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PRIOR
Page 1 of 205
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INDEX
2046 program listings.
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Is No-Clean the Trend for QFN Components?
Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question and share their own experiences and expertise.
Board Talk
Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor
Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing
Cavity Board SMT Assembly Challenges
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success.
Analysis Lab
Managing blooming in an adhesives process
If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Materials Tech
Implementing Automation and Ai for Electronic Card Assembly
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation.
Production Floor
Healthcare Gaps That Only Technology Can Fill
Digital Health is comprised of wearable, implantable technology, web and email, mobile technology, software, social networking, data management and analytics.
Analysis Lab
Step Stencil Setup
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle?
Board Talk
Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses.
Materials Tech
Muscle-Powered Robotic Leg More Efficient than Conventional Ones
Muscle-powered robotic is energy efficient. It can also perform high jumps and fast movements as well as detect and react to obstacles without complex sensors.
Technology Briefing
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Programs
Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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Defect of the Month
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.
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Mysteries of Science
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.
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Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.
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Channels
Adhesives, Coating, Dispensing
These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.
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Assembly, Printing, Pick & Place
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.
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Baking, Ovens, Moisture Control
These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.
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Cleaning, Washing, Solvents
These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.
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Contamination, Defects, Whiskers
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
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Environment, RoHS, Recycling
These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.
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Flip-Chip, MEMS, Semiconductors
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
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Operations, Productivity, Supply
These programs cover overall operations, plan productivity, issues with the supply chain and more.
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PC Fab, Board Design, Laminates
These programs cover bare PC board fabrication, circuit board design, laminates and more.
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Reflow Soldering, Profiling
These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.
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Rework, Repair, Modification
These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.
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Soldering, Selective, Wave
These programs cover manual and automated soldering, selective soldering, wave soldering and more.
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Solders, Fluxes, Pastes
These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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Test, Inspection, X-Ray
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
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