Circuit Insight Programs

Research Index

PRIOR

Page 1 of 205

2045 program listings.

How Do You Remove Oxidation from PCBs?
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, share their suggestions for this scenario.
Board Talk

Characterization of SIP Assembly and Reliability Under Thermal Cycles
This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays.
Production Floor

Computing After Moore's Law
The gap between computing demand and supply is growing. We are seeing a revolution due to the development of deep artificial neural networks.
Technology Briefing

Moisture Effects in Common Solderable RF Connector Dielectrics
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized.
Analysis Lab

Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech

Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
Production Floor

Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab

Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk

Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Materials Tech

Robots Begin to Develop Common Sense Knowledge
MIT engineers are working to give robots a bit of “common sense” when faced with situations that push them off their trained paths.
Technology Briefing

Programs

Board Talk

Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.

Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.

Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month

Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science

Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing

Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels

Adhesives, Coating, Dispensing

These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place

These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control

These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents

These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers

These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling

These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors

These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply

These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates

These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling

These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification

These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave

These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes

These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray

These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.