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PRIOR
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INDEX
2047 program listings.
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Component Moisture Question?
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own experiences and expertise.
Board Talk
Reduce Pollution of Process Gasses in an Air Reflow Oven
This paper gives detailed information of catalyst systems designed and implemented in SMD production lines to reduce pollution of process gasses.
Production Floor
Muscle-Powered Robotic Leg More Efficient than Conventional Ones
Muscle-powered robotic is energy efficient. It can also perform high jumps and fast movements as well as detect and react to obstacles without complex sensors.
Technology Briefing
Stencil Printing for Challenging Heterogeneous Assembly Applications
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography.
Analysis Lab
Development of Materials Informatics Platform
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials.
Materials Tech
The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor
Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented.
Analysis Lab
What is the IPC Definition for Uncommonly Harsh?
IPC 610 defines class three to include products where the end use environment may be uncommonly harsh. How is uncommonly harsh defined?
Board Talk
Robust SMT No-Clean Solder Paste for SIP and 01005 Assembly
Solder powder size, flux chemistry, stencil aperture, stencil surface technology, reflow process, and more are investigated.
Materials Tech
Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing
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Programs
Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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Defect of the Month
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.
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Mysteries of Science
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.
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Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.
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Channels
Adhesives, Coating, Dispensing
These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.
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Assembly, Printing, Pick & Place
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.
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Baking, Ovens, Moisture Control
These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.
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Cleaning, Washing, Solvents
These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.
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Contamination, Defects, Whiskers
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
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Environment, RoHS, Recycling
These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.
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Flip-Chip, MEMS, Semiconductors
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
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Operations, Productivity, Supply
These programs cover overall operations, plan productivity, issues with the supply chain and more.
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PC Fab, Board Design, Laminates
These programs cover bare PC board fabrication, circuit board design, laminates and more.
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Reflow Soldering, Profiling
These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.
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Rework, Repair, Modification
These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.
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Soldering, Selective, Wave
These programs cover manual and automated soldering, selective soldering, wave soldering and more.
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Solders, Fluxes, Pastes
These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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Test, Inspection, X-Ray
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
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