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PRIOR
Page 1 of 204
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INDEX
2037 program listings.
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How To Rework Warped PCBAs?
From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this situation and offer their own suggestions.
Board Talk
Control of the Underfill of Surface Mount Assemblies
Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations.
Production Floor
AI and Precision Agriculture Address Farming Problems
Automation with biology and chemistry to create a farming revolution which enabled a fraction of the population to deliver more than had formerly produced.
Technology Briefing
Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders.
Analysis Lab
Intermetallic Compounds in Solder Alloys: The Common Misconception
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys.
Materials Tech
Returning to Basics in the SMT Screen Printing Process
This paper showcases a new stencil process that was discovered by reverting to the basics.
Production Floor
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab
Incoming Circuit Boards - How Clean Is Clean?
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness?
Board Talk
Evaluation and Qualification of Reworkable Underfill Materials
Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability.
Materials Tech
There Actually is an 'I' in Team
Robotic arms handle repetitive and precision movements. This change relieves operators of mundane work. They must adjust to the new work environment.
Technology Briefing
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Programs
Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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Defect of the Month
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.
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Mysteries of Science
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.
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Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.
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Channels
Adhesives, Coating, Dispensing
These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.
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Assembly, Printing, Pick & Place
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.
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Baking, Ovens, Moisture Control
These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.
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Cleaning, Washing, Solvents
These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.
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Contamination, Defects, Whiskers
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
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Environment, RoHS, Recycling
These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.
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Flip-Chip, MEMS, Semiconductors
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
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Operations, Productivity, Supply
These programs cover overall operations, plan productivity, issues with the supply chain and more.
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PC Fab, Board Design, Laminates
These programs cover bare PC board fabrication, circuit board design, laminates and more.
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Reflow Soldering, Profiling
These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.
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Rework, Repair, Modification
These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.
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Soldering, Selective, Wave
These programs cover manual and automated soldering, selective soldering, wave soldering and more.
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Solders, Fluxes, Pastes
These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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Test, Inspection, X-Ray
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
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