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PRIOR
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INDEX
2060 program listings.
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Case Studies of Harsh Application Environments
This paper will present scenarios where environmental factors played a role in inducing various degradation mechanisms to Rockwell products. The paper will attempt to concentrate on the unusual scenarios, or where assumptions were made too early in the analytical process that likely hindered efficient determination of root cause.
Analysis Lab
Direct Metallization for Printed Circuit Board Manufacturing
Since Multi-Layer Printed Circuit Boards with holes appeared, the processes making holes conductive have played critical roles to achieve MLB’s function.
Production Floor
Heterogeneous Data Teaches Robots Range of Tasks
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks.
Technology Briefing
Low Temperature Soldering: Reflow Enhanced Mechanical Reliability
In this work, we further discuss solderability and mechanical reliability of a novel low temperature proprietary alloy (generically called as X46).
Materials Tech
Leadless Flip Chip PLGA for Networking Applications
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications.
Production Floor
Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads
The survivability of 0.4mm pitch and 0.5mm pitch parts at acceleration levels upto 50,000g have been studied for bare test boards.
Analysis Lab
Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk
Investigation into Low Temperature Solder Reliability
This paper presents an examination of three low temperature solders and provides a comparison with tin-silver-copper solder.
Materials Tech
3D-Printed Concrete Revolutionizes Home Building
Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste.
Technology Briefing
Reliability of Critical Assemblies When Implementing a New Cleaning
The cleanliness of high-reliability assemblies has become more critical for the product’s performance in the field.
Production Floor
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Programs
Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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Defect of the Month
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.
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Mysteries of Science
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.
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Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.
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Channels
Adhesives, Coating, Dispensing
These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.
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Assembly, Printing, Pick & Place
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.
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Baking, Ovens, Moisture Control
These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.
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Cleaning, Washing, Solvents
These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.
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Contamination, Defects, Whiskers
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
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Environment, RoHS, Recycling
These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.
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Flip-Chip, MEMS, Semiconductors
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
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Operations, Productivity, Supply
These programs cover overall operations, plan productivity, issues with the supply chain and more.
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PC Fab, Board Design, Laminates
These programs cover bare PC board fabrication, circuit board design, laminates and more.
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Reflow Soldering, Profiling
These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.
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Rework, Repair, Modification
These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.
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Soldering, Selective, Wave
These programs cover manual and automated soldering, selective soldering, wave soldering and more.
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Solders, Fluxes, Pastes
These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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Test, Inspection, X-Ray
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
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| Sponsor
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How Precise are Your Temp. Readings?
Did you know thermocouple attachment method can significantly impact the accuracy of thermal profiling temperature readings? Find out what this study revealed.
ECD
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