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| Cleaning, Washing, Solvents | ||||||||||
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Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology. Production Floor
The purpose of this research is to measure what circuit cards and parts on those assemblies are exposed to during the wash and rinse process of inline cleaning. Analysis Lab
To better understand OSP and de-flux interactions, a study of OSP with four different de-flux cleaning chemistries is discussed. Materials Tech
The purpose of this paper is to present a cleaning process for difficult no-clean, lead-free and high temperature flux residues on reflowed PCBs. Production Floor
The purpose of this paper is to present a cleaning process for difficult no-clean, lead-free and high temperature flux residues on reflowed PCBs. Production Floor
The cleanliness of high-reliability assemblies has become more critical for the product’s performance in the field. Production Floor
This paper offers guidance for protecting the integrity of electronic products and assemblies when disinfecting equipment surfaces for SARS-CoV-2 virus. Production Floor
This paper investigates new processes that achieve cleaning effectiveness while balancing the environmental, human, and machine impacts for longevity. Production Floor
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question. Board Talk
This research studies rinsing effects as a function of loading and cleaning agent design. A type of sensor for non-ionic organic compounds will be used. Materials Tech |
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