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This paper investigates new processes that achieve cleaning effectiveness while balancing the environmental, human, and machine impacts for longevity. Production Floor
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question. Board Talk
This research studies rinsing effects as a function of loading and cleaning agent design. A type of sensor for non-ionic organic compounds will be used. Materials Tech
This research is to design electrical twin test boards in the waste area of a panel of production boards, which are representative of production hardware. Production Floor
The level of importance of a clean circuit assembly has been demoted. How did the cleanliness of circuit assemblies, once required, get shoved aside? Production Floor
There was a time when virtually all circuit assemblies were cleaned. The removal of flux and other process-related contamination was commonplace. Analysis Lab
Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question and share their own experiences and expertise. Board Talk
This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials. Production Floor
This paper examines the role variables play in aerosol cleaning and offers guidelines to improve an aerosol cleaning process. Production Floor
We clean R.F. assemblies by hand but want to switch to an automated process. Which process would be better vapor degreasing or aqueous? Board Talk |
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