Electronics Manufacturing and Electronics Assembly

Sponsor

Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

How to Eliminate Via Pits

Process Controls When Running Multiple Lines

Blow Holes and Disturbed Joints

No-Clean Flux Residue After Selective Soldering

Mixing Silicone and Acrylic Conformal Coatings

0201 Pick & Place Nozzle Plugging

Solution for Grape Effect

Via Wall Thickness Test

MORE ASK THE EXPERTS

December 18, 2025

3D Digital Stitching Imagery is Revolutionizing Failure Analysis and Product Analysis

This presentation will outline the different types of 3D imagery and how they have found uses in various applications. There are several different companies making 3D vertical stitching equipment and this will show how this capability is being used in the medical, industrial, and especially the electronics industries.
Analysis Lab

Reliability of Critical Assemblies When Implementing a New Cleaning
The cleanliness of high-reliability assemblies has become more critical for the product’s performance in the field.
Production Floor

Sponsor

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Problems With Starved "J" Lead Joints

We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness. What do you advise?
Board Talk

Creating Reusable Manufacturing Tests for High-Speed I/O
This paper illustrates high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and a strategy for testing them with SIs within FPGAs.
Analysis Lab

An Introduction to the Process of Printed Electronics
While following best practices, researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures.
Production Floor

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X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies

Selective Soldering with Alternative Lead-Free Alloys

We are still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling.
Materials Tech

Innovative of CU Electroplating Process for Any Layer Via Fillwith Planer
PCB manufacturers need another additional processing step to chemically etch the deposit until they reach a planer surface to build the next layer without issues.
Production Floor

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Process Development to Achieve a High Yield Wafer-to-Wafer Hybrid Bond
Discussed are ethodologies that ensure high yielding Cu-based wafer to wafer hybrid bonding includig the test vehicle used, chemical mechanical planarization.
Analysis Lab

Dynamic Bending Reliability of Chip-In Fabrics (CIF) Packaging

In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated.
Materials Tech

Proper Exhaust Pressure for Reflow Ovens?

What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure?
Board Talk

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REL61: Cost-Effective Soldering, Elevated Performance
Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance.
AIM Solder

Process Reliability Requirements in Matching Reinforcement Material

This paper presents the methodology for evaluation of Underfills and Edgebond materials in combination with no-clean solder paste.
Analysis Lab

Jet-Dispensed SMT Adhesives for Durable Printed Electronics
This paper discusses the use of jet-dispensed SMT adhesives for increased durability, lower component cost, and new form factor printed electronics.
Materials Tech

Sponsor

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD

A Solution for Component Shortage & IC Obsolescence

When a semiconductor component becomes obsolete or has a lead time that is beyond 52 weeks, finding a direct replacement that fits the existing system’s footprint can be challenging. Interposers act as a bridge between the new component and the old system, allowing the integration of modern semiconductors into legacy systems without the need for extensive redesign.
Production Floor

Latest Industry News

Higher Memory prices to Hit PC Shipments

China exploits US research, report says

AI Is Going To Make Your Next Computer Cost A Lot More, And It's Pretty Clear Why

Smartphone prices expected to rise in 2026 as shipments fall

The U.S. CHIPS Act Takes Another Hit

MORE INDUSTRY NEWS

Sponsor

Tech Paper - Keys to Component Lead Tinning Success
This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques.
Circuit Technology Center

Sponsor

Two Part, Room Temperature Curing Epoxy
Master Bond EP39MAOHT is a thermally conductive, electrically insulative adhesive with low exotherm, suitable for large castings and potting applications.
Master Bond

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