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X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies
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Can Silver Cause Solder Embrittlement?
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario.
Board Talk
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SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
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Turnkey Lines: In-Stock & Ready
In-stock, fully integrated SMT lines with Manncorp's U.S.-based support. Skip the wait, cut lead times, and get your operation producing sooner.
Manncorp Inc.
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The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys
This paper aimed to investigate the impacts of printed circuit board (PCB) design, including the PCB thickness and solder mask opening, on the fatigue performance of lead-free solders. Each test vehicle includes one of two component types: CABGA192 and MLF32, assembled using SnAgCu solder paste with an Organic Solderability Preservative (OSP) surface finish.
Technical Paper
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Panel Level Package (PLP) – Scaling up Fan-Out Packaging
The persistent push for electronics miniaturization calls for a different approach to make packages smaller, higher performance and lower cost. Fan-out (FO) packages are well suited to serve this market trend. Via interconnects between the chip and package RDL (redistribution layers) provide higher interconnect density and lower inductance.
Technical Paper
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Want High-Reliability BGA Service?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.
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Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk
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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation
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Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk
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