Electronics Manufacturing and Electronics Assembly

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Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

Looking for Long-term Component Storage Options

Question About PPM Defect Rate for Reversed Packages

ESD and Humidification

SMT Target Component Placement

Old Components and Blow Holes

Pin in Paste Solder Dropping

Reusing recovered solder paste

Removing Cleaning Residues Under BTC Packages

MORE ASK THE EXPERTS

Advanced in Packaging for Emerging Technologies
A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper.
Technical Paper

Analysis of Mechanism About Data Retention Characteristic in TANOS Structure
The long-term evaluation of TANOS structure is investigated and the prediction of retention characteristic can be evaluated through the accelerated tests.
Technical Paper

Sponsor

Keeley Pedals Perfected with Manncorp
Keeley Electronics revolutionizes production with Manncorp pick & place machines, achieving unprecedented speed, precision, and innovation in the guitar pedal industry.
Manncorp Inc.

Solder Boards Not Holding Up to Shock Testing
We are using a vapor phase oven. We have experienced problems with a no-lead BGA that has low silver solder balls. The solder boards do not hold up to shock testing.
Board Talk

Evaluation of High Speed Plating for Copper Post with Flat Top Shape
In developing high-speed electro “copper post” plating bath the shape of the post and the uniformity of the post height throughout the wafer were considered.
Technical Paper

The Impact of Harsh Environments and Ionic Contamination on Post-Reflow Circuit Assemblies
Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM).
Technical Paper

Sponsor

Wave Soldering Processes Rethought
As a pioneer in the development of automated soldering technologies, SEHO is setting global standards today more than ever with outstanding features. Find out more.
SEHO Systems GmbH

The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Technical Paper

Advances in Power Electronics
This paper details some of the recent advances in power electronics systems and details some of the challenges that need to be overcome.
Technical Paper

Sponsor

Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies

Common PCB Design Decisions that Cause Manufacturing Problems
What are the most common design decisions that can have a negative impact on the PCB assembly manufacture and how could we correct them during the design? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario and share their suggestions.
Board Talk

Adding OSP to Pads that are Missing ENIG Plating Process
A fabricator notified us that during the ENIG plating process, several pads had been “skipped”. The fabricator would like to add OSP to the pads that are missing the ENIG.
Board Talk

Living With PB-Free in High Performance Engineering Design
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by this material.
Technical Paper

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Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom SE

Advanced Substrate Technology for Heterogeneous Integration
The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process.
Technical Paper

Selective Soldering Design for Reliability Using SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Technical Paper

Sponsor

Low Outgassing, Thermally Conductive Epoxy
Master Bond EP21AOLV-2LO is a low outgassing, thermally conductive, electrically isolating adhesive that can be used for sealing, coating and encapsulating.
Master Bond

Autonomous Vehicles Still Decades Away: 2019
This paper examines the challenges to progress from existing advanced driver-assistance systems to level 4 and 5 autonomous vehicles.
Technical Paper

Latest Industry News

Apple Reportedly Brings Mac Mini Back to U.S., Taps Foxconn for Assembly

VIEWPOINT 2026: Michail Klimkovic, CEO, XIMEA

Memory chip shortage will last until mid-2026, says Acer CEO

True Entrepreneurs Don't Chase Demand — They Create It. Here's How.

Apple to move some of its production to Texas

MORE INDUSTRY NEWS

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Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology

Sponsor

The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
KYZEN

"For this part, I credit hard work, ingenuity and determination. The other part, I blame on gravity."
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