Electronics Manufacturing and Electronics Assembly

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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Technical Papers

Innovative Power Module Assembly Solutions

Unlocking the Potential of Nanoscale Conformal Coatings

Recycling vs Circularity: Minimising E-Waste in Manufacturing

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

Probe Card Manufacturer 'Sees the Unseen' With X-ray

Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods

An Eight-Step Methodology for Bringing a Process Under Statistical Control

Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel

MORE TECHNICAL PAPERS

Eliminate Cross Contamination

The Model 2003 Stencil & Pallet Cleaner is a semiautomatic system with two ultrasonic wash tanks for multiple applications. It is guaranteed to clean solder paste from any fine-pitch stencil.

LEARN MORE

Ask the Experts

Hand Sanitizer Contamination

Spotting After DI Water Cleaning

Silver Solder for Audio Circuits

Oxidation of Solder Balls During Secondary Reflow

QFN Test Failures Caused by Flux

Contamination From Anti-static Foam

Components Jumping Around During Reflow

Conformal Coating in Low Humidity Environments

MORE ASK THE EXPERTS

April 15, 2025

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability

The industry standard for accelerated temperature cycling, IPC-9701B, defines test conditions for characterizing solder interconnect fatigue. The document specifies a maximum cycling ramp rate of 20 °C/minute to avoid thermal shock conditions that can accelerate failure modes other than low cycle fatigue in the bulk solder.
Analysis Lab

Additive Manufacturing for Next Generation Microwave Electronics
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications.
Production Floor

Sponsor

Thermally Conductive Epoxy
Master Bond Supreme 11AOHTLP is a two component adhesive featuring thermal conductivity and electrical insulation for high performance bonding, sealing and coating.
Master Bond

Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing

Design Considerations That Influence LED Solder Joint Reliability
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA.
Analysis Lab

ENEPIG - How the Process Characteristics Influence the Layer Performance
This paper will focus on the comparison of pure Pd and PdP deposits and the interaction with the gold electrolyte type in use.
Materials Tech

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X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies

Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
Production Floor

Detect PCB Stack-up Error with Machine Learning Methods
With high frequency and high-speed transmission in information industry, PCB customers demand stricter signal transmission integrity of PCB.
Analysis Lab

Sponsor

440-R + Ultrasonics = Safe & Efficient Cleaning
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, misprints & SMD adhesives.
Smart Sonic

Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk

The Basics of Metal Thermal Interface Materials (TIMS)
Advancements in metal patterning have improved the effectiveness of metal TIMs by improving their compressibility.
Materials Tech

Heterogeneous Data Teaches Robots Range of Tasks
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks.
Technology Briefing

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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Printed Electronics for Medical Devices
This paper will share details about multiple medical sensing applications and the advanced materials and processes used to assemble them for optimal functionality.
Production Floor

Effect of Bias Voltage on Surface Insulation Resistance Measurements
In this study, we analyzed the effect that voltage bias has on dendrite growth both in clean PCBs and PCBs that were contaminated.
Analysis Lab

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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Can Motivational Talks Increase Defects?
At a factory with high productivity, one worker was skipping break time to increase productivity. Was this causing mysterious defects?
Mysteries of Science

The Convergence of Technologies and Standards
The future of manufacturing is dependent on the ability to develop and deploy suites of technology platforms to realize Smart Manufacturing and Industry 4.0.
Production Floor

3D-Printed Concrete Revolutionizes Home Building
Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste.
Technology Briefing

Electromigration in Tin-Bismuth Planar and Bottom Terminated Solder Joints
The electromigration rates and behavior of eutectic Sn-Bi alloy in planar and in BTC solder joints were compared and shown to be similar.
Analysis Lab

Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution.
Materials Tech

Counterfeit Electronics Component Conundrum with Smart Labeling

Electronics manufacturers hurting from supply chain disruptions and component shortages are challenged by the rise in counterfeit components.
Production Floor

Latest Industry News

Apple's iPhone Cost Could Rise 90% if It's Made in US, BofA Says

Why Do Hyperscalers Design Their Own CPUs?

Apple's foldable iPhone might not launch as soon as people are saying

Amazon CEO Andy Jassy says AI costs will come down over time even as company invests 'aggressively'

US tariffs on China unleash animal spirits in electronics

MORE INDUSTRY NEWS

100+ Repair and Rework Guides Online!

These guides are packed with illustrations and videos and follow popular IPC standards. The information will be helpful to anyone who works with bare circuit boards and circuit board assemblies.

CHECK IT OUT!

Sponsor

The Smart Alternative to SAC305
Get the cost benefits of a low-silver solution without sacrificing quality. REL61 surpasses SAC305 in key tests like AOI performance—making it the smart choice for your operations.
AIM Solder

Questions and Comments

Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions

There really, at present, no such thing as "selective cleaning". ...
Phil Zarrow, ITM Consulting

Palm Size Portable 3 Printer

Impressive start. I look forward to further reports on the ...
Jaye Waas, Renkus-Heinz

Impact of PCB Manufacturing, Design, and Material to PCB Warpage

Symmetrical stack ups and copper distribution is key to maintaining ...
Gerry Partida, Summit Interconnect

MORE COMMENTS

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Essential guide for hi-rel BGA re-balling
Re-balling of BGA's with tin-lead solder is required in some hi-rel applications due to tin whisker concerns. This white paper discusses the key considerations of this specialized process. Read more.
Circuit Technology Center