Electronics Manufacturing and Electronics Assembly

We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering. Phil Zarrow and Jim Hall, The Assembly Brothers, offer their own suggestions and recommendations for eliminating solder balls.
Board Talk

Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
Production Floor

Wireless Network Transmits Data from Microelectronic Chips
A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips.
Technology Briefing

Interconnect Mechanical Performance with Variable UBM and Decreasing Bump Size
Current work seeks to better understand how the indium (In) bump size affects the respective interface kinetics and subsequent mechanical properties.
Analysis Lab

Low Temperature Solder Joint Shear Strength of Components
This paper studies the effect of several factors on the shear strength of a wide range of components assembled using LTS paste.
Materials Tech

Methods to Get Volatile Compounds Out of Reflow Process
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified.
Production Floor

Influence of Plating Quality on Reliability of Microvias
This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Analysis Lab

Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market?
Board Talk

Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Materials Tech

Carbon Dioxide and Lignin Offer Alternative to Traditional Plastic
Researchers have created a potential alternative to traditional petroleum-based plastic made from carbon dioxide, plus lignin, a component of wood.
Technology Briefing

Early Design Review of Boundary Scan To Enhancing Testability
Paper reviews what portions of a design can be covered structurally and what are covered functionally, to provide the best diagnostics to discover faults?
Production Floor

Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
The understanding of the growth mechanism for tin whiskers and what mitigation strategies can be employed to reduce their propagation.
Analysis Lab

Peeling Paint Only On Wednesdays
A line with spray painted parts was running smoothly except on Wednesdays when the paint would peel? Why only on Wednesdays?
Mysteries of Science

Low Temperature Solder-SMT Manufacturability and Quality Considerations
This paper focuses on establishing package warpage boundary conditions and identifying key process parameters for a successful LTS assembly.
Production Floor

Wearable Devices to Operate Robotic Exoskeletons

A team has developed a wearable, stretchy patch about the size of a BandAid, which sticks to your skin and picks up tiny signals coming from human muscles.
Technology Briefing

A New X-Ray Source Technology for Demanding SMT Inspection
The paper contains data and images from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Analysis Lab

DFX on High Density Assemblies

This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech

01005 Rework – barricades and technological processes
Touch up and repair processes need to fulfil the high-quality demands of today’s highly integrated and complex electronic products.
Production Floor

Board Talk

What Causes Solder Balls During Hand Soldering?

Is There a Spacing Spec for SMD Components?

Wet-Based vs. Dry-Based Cleaning

Connector Bowing During Reflow Process

Seeking Alternatives to Solvent Cleaning

Long Term Component Storage

Solder Boards Not Holding Up to Shock Testing

Has My Flux Expired?

MORE BOARD TALK

Questions and Comments

Seeking Alternatives to Solvent Cleaning

These questions are recycled over time, so this is an ...
Rick Perkins, CHEM LOGIC

What is the Life Span of a Profile Board?

The typical lifespan of a profile board, which is used ...
Mohammed Imtiaz uddin, napino auto and electronics ltd.

How Frequently Should We Recheck Profiles?

The recommended frequency for rechecking reflow oven profiles can vary ...
md imtiaz, Napino

MORE COMMENTS

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