Electronics Manufacturing and Electronics Assembly

Sponsor

Eliminate Worry of Cross Contamination
While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine.
Smart Sonic

Technical Papers

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

Maintenance: The Basics of Cleaning Series Part 4

The Economics of Electronic Component Salvage and Reuse

MORE TECHNICAL PAPERS

Ask the Experts

Environment Impact on Assembly, Printing and Reflow

IPC-A-610 Class 3 - IPC-A-600 Class 2

Glued SMT Components Falling Off

Delamination Causing Scrap

Hot Air Soldering for 0201s and 01005s

Reflow Causing Warp

Conformal Coating Recommendation

Circuit Board Bow and Twist

MORE ASK THE EXPERTS

October 9, 2025

Sustainability is Key for Material and Chemistry Choices

OEMs have started adopting sustainable materials and chemistry technologies for their electronics as a part of better ESG score rankings. Sustainability is becoming a key parameter for material and chemistry choices for the next generation electronics. The use of non-toxic options are being evaluated and preferred.
Materials Tech

Feasibility of Plasmonic Circuits Merged with Silicon Integrated Circuits
Plasmonic signal transmission via nanoscale plasmonic waveguides is a technique with the potential to increase the information transfer capacity in silicon integrated circuits.
Production Floor

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

The Versatile Preform
This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms.
Production Floor

Oxide Alternative Process for High Frequency Bonding Applications
This paper highlights the challenges made with conventional Sulphuric-Peroxide based Oxide Replacement bonding enhancement system.
Analysis Lab

Engineered Flux for Low Temperature Solders
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper.
Materials Tech

Sponsor

REL61: Cost-Effective Soldering, Elevated Performance
Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance.
AIM Solder

Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor

Automated Optical Inspection Performance with Different Solder Alloys
This paper presents the performance of AOI systems when applied to PCBs soldered with SAC305 and a third-generation, low-silver, bismuth-containing alloy.
Analysis Lab

Sponsor

Tech Paper - The Essential Guide for High-Reliability BGA Component Re-balling
This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. Download this free tech paper.
Circuit Technology Center

Is There a Limit to the Step in a Step Stencil?
I've seen a problem with the 3-mil step. Is there a rule of thumb regarding the amount of step that can used in a step stencil?
Board Talk

The Impact of the Gold Layer Thickness on Layer Properties
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives.
Materials Tech

Drop/Shock Behavior of Low Temperature Solder BGA
This study examines challenges posed by aging, a critical factor influencing the long-term performance of solder joints.
Analysis Lab

Sponsor

Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond

Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Production Floor

Optimizing Throughput and Cost with Manufacturing Simulation
This paper describes the design and implementation of several manufacturing simulation use-cases at an electronics assembly factory in Nanjing, China.
Analysis Lab

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Pennies Converted To Dimes
A vendor was sorting a vending machine's change when he came across some strange looking dimes that looked like silver pennies.
Mysteries of Science

QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.
Production Floor

Technology for Optical Co-Packaging
A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper.
Production Floor

Process-Reliability Relationships of Low-Temperature Solders and ECAs

This paper studies the process-performance-reliability relationships for Sn-Bi-Ag and Sn-In solders on additively printed copper metallization.
Analysis Lab

Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Materials Tech

Improved Process Yield with Dynamic "real-time" Dual Head Dispensing

This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing.
Production Floor

Latest Industry News

Tesla Faces U.S Safety Probe After Reports FSD Ran Red Lghts, Caused Collisions

Industry Intelligence Insights October 2025

Learning to Code Still Matters in the Age of AI

Crypto's Greatest Impact Won't Be in Finance — It Will Be in Solving AI's Biggest Problem

China tightens its controls of exports of its rare earths

MORE INDUSTRY NEWS

Sponsor

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Questions and Comments

Concerns with Flux During Vapor Phase Reflow

Flux density is lighter than the Galden, so any melted ...
Mike Cummings, TSI

Is There a Spacing Spec for SMD Components?

Another significant spacing issue arises if you have a mixed-technology ...
Alan Ritter, MtRitter.com, LLC

Influence of Salt Contamination and RH on Creep Corrosion of Immersion Silver

In the 1980s a consortium of companies sponsored research under ...
Pat Lees, Littelfuse

MORE COMMENTS

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

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