Electronics Manufacturing and Electronics Assembly

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Technical Papers

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

Maintenance: The Basics of Cleaning Series Part 4

The Economics of Electronic Component Salvage and Reuse

MORE TECHNICAL PAPERS

Ask the Experts

Moisture Barrier Bag Calculation

Question About J-STD-001

Allowable Bow and Twist on Round PC Fab

IPC 610 Class 3 with Missing Non-functional BGA Pads

Package-on-Package Rework

Question About Dry Storage of PCBA's

Very Low Temp PCBs

IPC-A-610 Solder Joint Acceptability Question

MORE ASK THE EXPERTS

September 16, 2025

AI to Predict Compatibility Between Solder Paste Residues and Coatings

This paper shows how AI is used to predict compatibility results between solder paste residues and coatings. A physical compatibility study is carried out to benchmark some combinations of solder pastes and coatings of the market. Results between AI prediction and the physical tests are compared to choose the right AI model for a good prediction of the compatibilities
Materials Tech

01005 Rework – barricades and technological processes
Touch up and repair processes need to fulfil the high-quality demands of today’s highly integrated and complex electronic products.
Production Floor

Sponsor

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

Microstructure Modification for SnBi Low Temperature Solder Alloy
This paper introduces a novel structure for the SnBi-based solder joint at the board level. A layer of SAC alloy is applied over the OSP surface finish.
Production Floor

Materials Considerations for Automotive Radar Designs
This paper will discuss the current areas of growth that support level 3 autonomy, specifically on radar modules that bring perspectives of distance and speed to surrounding objects.
Analysis Lab

Expandable Bio-based Polymers: Future for Electronics Ruggedization
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components.
Materials Tech

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Large Form Factor Surface Mount Technology Process Demonstration
This paper reviews the implementation of a multiple solder ball diameter (MDSB) strategy to increase the SMT warpage capability for a standard SAC BGA Package.
Production Floor

Case Study for Improving the PCB Print Process Using Factory Data
The analytics of big data could help us to understand that process better. We can buy better equipment and select the parameters more carefully.
Analysis Lab

Sponsor

REL61: Cost-Effective Soldering, Elevated Performance
Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance.
AIM Solder

Will Nitrogen Reduce Wave Solder Defects?
We plan to install a nitrogen environment around the wave soldering tank. Is this likely to improve our defective parts-per-million level?
Board Talk

Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Materials Tech

Process Characterization for Acceptable Levels of Flux
Analysis of residues and their effects has shifted from a global examination of ionic residues to a more site-specific examination of spot or local contamination.
Analysis Lab

Sponsor

6 Common Mistakes of BGA Rework
BGA rework is one of the most challenging procedures you may need to master. Doing it right depends in large part on the skills and knowledge of the rework technician. Learn more ...
Circuit Technology Center

An Interesting Approach to Yield Improvement
The approach involves spending a little more money than normal at the start of project and the results show savings of many times more than this outlay.
Production Floor

A Close look at IPC X-Ray Inspection Guidelines for BGAs
The massive amount of measurements and qualitative information provided by CT-Xray systems can now enable more inspections to be easily automated, ultimately reducing the burden on engineers. With access to this impressive technology, tighter processing parameters can be maintained to ultimately ensure higher quality electronic products for a variety of markets.
Analysis Lab

Sponsor

Thermally Conductive Epoxy
Master Bond Supreme 11AOHTLP is a two component adhesive featuring thermal conductivity and electrical insulation for high performance bonding, sealing and coating.
Master Bond

Cloudy Copper Plating Bath
At a circuit shop near Los Angeles there was trouble with the copper plating line. Was an impurity getting in the tank and how?
Mysteries of Science

Inline Assembly of Flex PET Circuits
This work further explores photonic soldering of PET flex circuits in the context of high-volume production.
Production Floor

Warpage of Flexible-Board Assemblies with BGAs During Reflow

Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable.
Production Floor

Impact of PCB Manufacturing, Design, and Material to PCB Warpage
This paper will use high temperature warpage metrology to evaluate the impact that PCB manufacturing, design, and material has on BGA and panel area PCB warpage.
Analysis Lab

Do We Need to Switch to Type 5 Solder Pastes?
The experiment should find the optimum printer parameters, compare type 4 vs. 4.5 vs. 5 solder paste and 4 different stencils.
Materials Tech

Additive Manufacturing Approach for Integrated, Robust 3D Electronics

This paper focuses on the In-Mold Electronics approach, which facilitates the transition from subtractive to additively printed, robust, and 3D electronic structures.
Production Floor

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Waymo obtains permit to test robotaxis at San Francisco International Airport

Redefining Construction With Eco-Friendly Concepts and 4D Tech

Environmental Impact Assessment: The costs of compliance

MORE INDUSTRY NEWS

Sponsor

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD

Questions and Comments

Concerns with Flux During Vapor Phase Reflow

Flux density is lighter than the Galden, so any melted ...
Mike Cummings, TSI

Is There a Spacing Spec for SMD Components?

Another significant spacing issue arises if you have a mixed-technology ...
Alan Ritter, MtRitter.com, LLC

Influence of Salt Contamination and RH on Creep Corrosion of Immersion Silver

In the 1980s a consortium of companies sponsored research under ...
Pat Lees, Littelfuse

MORE COMMENTS

Sponsor

New SELECT Synchro soldering system
A multi-station selective soldering system that uses a unique, synchronous motion to increase throughput, improve cost-of-ownership, and provide flexibility for electronics manufacturers.
Nordson Electronics Solutions

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