Electronics Manufacturing and Electronics Assembly

Sponsor

REL61: Cost-Effective Soldering, Elevated Performance
Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance.
AIM Solder

Technical Papers

Recycling vs Circularity: Minimising E-Waste in Manufacturing

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

Probe Card Manufacturer 'Sees the Unseen' With X-ray

Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods

An Eight-Step Methodology for Bringing a Process Under Statistical Control

Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel

Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry

Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment

MORE TECHNICAL PAPERS

Ask the Experts

Initial Screen Print Test Board

Cleaning Under Low Clearance Components

What Is This Contamination?

Baking Old PCBs Prior To Reflow

A Generic Reflow Profile

Organic Flux Residue Concerns

Reflow Profile for Mixed Lead-Free and Leaded

Solder Joint Blow Holes

MORE ASK THE EXPERTS

March 25, 2025

The Effect of Thermal Cycling Dwell Time on Reliability of Pb-free Solder Alloys

This paper presents the initial results from an experimental program designed to compare thermal cycling results for high-performance solder alloys using an extended dwell of 60 minutes to a typical short dwell time of 10 minutes. The 10-minute dwell data were generated in the initial phase oftesting and published previously.
Analysis Lab

Improved Process Yield with Dynamic "real-time" Dual Head Dispensing
This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing.
Production Floor

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Conquer BGA Rework Challenges!
Trusted by top military and electronics manufacturers, our BGA rework operators can tackle the most complex projects with quick turn times. Your go-to source for BGA rework and repair is here.
Circuit Technology Center

The Biggest Barrier to a Robotics Revolution
Experts believe robots will be able to cost-effectively perform a large share of physical tasks which, until now, have been performed only by humans.
Technology Briefing

Process-Reliability Relationships of Low-Temperature Solders and ECAs
This paper studies the process-performance-reliability relationships for Sn-Bi-Ag and Sn-In solders on additively printed copper metallization.
Analysis Lab

Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package
Lower-temperature paste can be reflowed under a relatively lower peak temperature profile and outperform SAC305 paste in the current WLP256 application.
Materials Tech

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Copper Electrodeposition By Hydrogen Evolution Assisted Electroplacing
A technique called hydrogen evolution assisted electroplating, has shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods.
Production Floor

Conformal Coating Testing in Various Test Environments
This paper compared these three environments in terms of how well they characterize conformal coatings.
Analysis Lab

Sponsor

Underfill Epoxy Offers Thermal Conductivity
Master Bond EP29LPTCHT is a low viscosity adhesive that can be used for underfill & encapsulation apps. It offers thermal conductivity & electrical insulation.
Master Bond

Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk

Implementation of Assembly Processes for Low-Melting Point Solder Pastes
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard.
Materials Tech

Robotic Systems Perform Experiments Speeding Up Research
Robotic systems can perform experiments without fatigue, speeding up research. Robots execute experimental steps with greater consistency than humans. As explained recently in the journal Science Robotics, robots are rapidly, "Transforming Science Labs into Automated Factories of Discovery."
Technology Briefing

Sponsor

Choose Advanced Assembly with Precision Components
PCBWay handles complex assemblies with precision. Our lines handle fine pitch components such as 01005, 0201, BGAs & other challenging packages.
PCBWay

Feasibility of Plasmonic Circuits Merged with Silicon Integrated Circuits
Plasmonic signal transmission via nanoscale plasmonic waveguides is a technique with the potential to increase the information transfer capacity in silicon integrated circuits.
Production Floor

Optimization of PCB SI Coupon Design that Minimizes Discontinuity
In this study, we tried to minimize the discontinuous path of Delta-L coupon by using the VIPPO (Via In Pad Plated Over) technique to improve the signal integrity.
Analysis Lab

Sponsor

EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic

Was the Contamination From Silicone?
Black enamel was sprayed onto metal followed by a clear coating when a contamination problems surfaced. What was causing the contamination?
Mysteries of Science

Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor

Heterogeneous Data Teaches Robots Range of Tasks

Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks.
Technology Briefing

Board Level Reliability of Large Body Size WlCSP for Automotive Applications
This paper will outline the board-level assembly development and reliability that was undertaken to demonstrate this WLCSP could meet the demands of automotive.
Analysis Lab

How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.
Materials Tech

In-Line Testing of Highly Panelized PCBAs with Parallel Functional Test

The manufacturing process challenges faced by electronics manufactures producing large panels of small boards is discussed.
Production Floor

Latest Industry News

Global Electronics Supply Chain Shifts From Certainty to Chaos Amid Tariff 'Noise'

VIEWPOINT 2025: Michail Klimkovic, CEO, XIMEA s.r.o.

iPhone Fold might look like this quirky new foldable you probably can't buy

China says it is prepared for shocks as US tariffs loom

TSMC to dominate 2nm sector

MORE INDUSTRY NEWS

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Questions and Comments

Palm Size Portable 3 Printer

Impressive start. I look forward to further reports on the ...
Jaye Waas, Renkus-Heinz

Impact of PCB Manufacturing, Design, and Material to PCB Warpage

Symmetrical stack ups and copper distribution is key to maintaining ...
Gerry Partida, Summit Interconnect

Additive Manufactured Electronics for Next Generation Microelectronics

AME is necessary to manufacture advanced electronics do to need ...
Voya Markovich

MORE COMMENTS

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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

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