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November 6, 2025
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Metal Organic Decomposition Inks for Electromagnetic Interference Shielding
In this paper, we will review different printing techniques, and spray coating. We will review 5-sided metallization to provide shielding via spray coating, film performance parameters including coating thickness uniformity, EMI shielding effectiveness, adhesion to different substrates, and reliability.
Materials Tech
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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3P Production Preparation Process
A Lean Manufacturing methodology is presented as a standardization tool where teams work for the process design of production lines and manufacturing systems.
Production Floor
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Reflow Oven Zone Separation Challenges
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
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Silver Filled, Heat Curing Epoxy
Master Bond EP4S-80 is a one part, electrically conductive, silver filled adhesive for bonding, sealing and coating with a low curing temperature of 80°C.
Master Bond
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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