Electronics Manufacturing and Electronics Assembly

Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question and share their own experiences and expertise.
Board Talk

Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor

Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing

Cavity Board SMT Assembly Challenges
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success.
Analysis Lab

Managing blooming in an adhesives process
If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Materials Tech

Implementing Automation and Ai for Electronic Card Assembly
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation.
Production Floor

Healthcare Gaps That Only Technology Can Fill
Digital Health is comprised of wearable, implantable technology, web and email, mobile technology, software, social networking, data management and analytics.
Analysis Lab

Step Stencil Setup
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle?
Board Talk

Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses.
Materials Tech

Muscle-Powered Robotic Leg More Efficient than Conventional Ones
Muscle-powered robotic is energy efficient. It can also perform high jumps and fast movements as well as detect and react to obstacles without complex sensors.
Technology Briefing

Optimization of Stencil Apertures to Compensate for Scooping
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure.
Production Floor

The Sir Reliability of Fine Pitch QFN Components Under Harsh Condition
A variety of dummy QFNs are assembled on PCBs whose surface finish is OSP by reflow in air, they are tested under 5V bias voltage and 85, 85%RH condition.
Analysis Lab

Danger on the Adhesive Coating Line
A plant worker adjusting rollers on an adhesive line suddenly began to act strangely. What caused the worker's spaced out appearance?
Mysteries of Science

How X-Ray Technology is Improving the Electronics Assembly Process
X-ray inspection of electronic components is now standard practice for any company working in the electronics industry.
Production Floor

Method Produces Metals with Low Thermal Expansion without Emitting CO2

Production of metals with low thermal expansion, called Invar, are critical for the aerospace, cryogenic transport, energy, and precision instrument sectors.
Technology Briefing

Room Temperature Fast Flow Reworkable Underfill for LGA
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate.
Analysis Lab

Atomristors: Non-Volatile Resistance Switching in 2D Monolayers

Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13.
Materials Tech

Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor