Electronics Manufacturing and Electronics Assembly

Sponsor

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies

Technical Papers

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

MORE TECHNICAL PAPERS

Ask the Experts

Rise of Bismuth Levels in our Solder Pots

Inspection for Hidden Solder Joints

Solution for Warped PCBAs

BGA Component Cleaning Spec

Tin Whiskers and Vapor Phase Reflow

Soldering Station Calibration

Solder Paste Stencil Inactivity

Solder Mask Thickness Tolerance

MORE ASK THE EXPERTS

The Impact of the Gold Layer Thickness on Layer Properties
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives.
Technical Paper

The Best Method for Reworking Ultra-Micro Chips
We are soldering and reworking 0201s and 01005s using hot air solder rework station with adjustable air flow. The minimum air flow will blow parts.
Board Talk

Sponsor

Build Your Solution with Manncorp
Get a custom SMT equipment plan in minutes and source your entire line from one trusted supplier—backed by lifetime expert support you won't find anywhere else.
Manncorp Inc.

Drop/Shock Behavior of Low Temperature Solder BGA
This study examines challenges posed by aging, a critical factor influencing the long-term performance of solder joints.
Technical Paper

Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Technical Paper

Supercooled Solder Pastes in Low-Temperature Attach Applications
This paper presents progress-to-date using supercooled solder pastes of core-shell bismuth-tin (BiSn) particles to accomplish solder interconnects below the melting point of the alloy. Comparisons between supercooled BiSn solder pastes and traditional BiSn pastes are discussed.
Technical Paper

Sponsor

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio

QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.
Technical Paper

How To Rework Warped PCBAs?
From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them?
Board Talk

Sponsor

Keep Engineering Changes Moving Without Production Delays
Design updates shouldn’t slow your build process. With precise, fast-turn rework capabilities, engineering changes can be implemented accurately and efficiently.
Circuit Technology Center

Optimizing Throughput and Cost with Manufacturing Simulation
This paper describes the design and implementation of several manufacturing simulation use-cases at an electronics assembly factory in Nanjing, China.
Technical Paper

Technology for Optical Co-Packaging
A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper.
Technical Paper

Process-Reliability Relationships of Low-Temperature Solders and ECAs
This paper studies the process-performance-reliability relationships for Sn-Bi-Ag and Sn-In solders on additively printed copper metallization.
Technical Paper

Sponsor

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Technical Paper

How Long Solder Paste Can Be Left On a Stencil Without Activity
How long can we leave solder paste on a stencil without any activity? If activity means not printing, then we are talking about a pause or abandoned time.
Board Talk

Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk

Latest Industry News

The iPhone Fold Is Coming: What We Know, What's Rumored, And When It Could Launch

Gartner Forecasts Worldwide AI Spending to Grow 47% in 2026

Robots Could Turn E-Waste Into a Source of Legacy Chips

Google gives first glimpse of new AI glasses ahead of fall launch

Google is making AI images easier to create, and deepfakes easier to spot

MORE INDUSTRY NEWS

Sponsor

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp