Electronics Manufacturing and Electronics Assembly

We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own experiences and expertise.
Board Talk

Reduce Pollution of Process Gasses in an Air Reflow Oven
This paper gives detailed information of catalyst systems designed and implemented in SMD production lines to reduce pollution of process gasses.
Production Floor

Muscle-Powered Robotic Leg More Efficient than Conventional Ones
Muscle-powered robotic is energy efficient. It can also perform high jumps and fast movements as well as detect and react to obstacles without complex sensors.
Technology Briefing

Stencil Printing for Challenging Heterogeneous Assembly Applications
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography.
Analysis Lab

Development of Materials Informatics Platform
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials.
Materials Tech

The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor

Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented.
Analysis Lab

What is the IPC Definition for Uncommonly Harsh?
IPC 610 defines class three to include products where the end use environment may be uncommonly harsh. How is uncommonly harsh defined?
Board Talk

Robust SMT No-Clean Solder Paste for SIP and 01005 Assembly
Solder powder size, flux chemistry, stencil aperture, stencil surface technology, reflow process, and more are investigated.
Materials Tech

Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing

Assembly and Reliability of a Novel High Density Dual Row MaxQFP
The paper focuses on all aspects of SMT assembly of the MaxQFP. The robustness of the assembly in automotive type board-level thermal cycling will be demonstrated.
Production Floor

Test Methods for Electrochemical Consistency in PCB Assembly Processes
This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies.
Analysis Lab

Lubricant Causes Quality Problems
Cylinder locks coated with a light oil spray started to stick. Did a change in the process affect quality, and if so how?
Mysteries of Science

Jetting Conductive Adhesives with Silver Coated Polymer Particles
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing.
Production Floor

Computing After Moore's Law

The gap between computing demand and supply is growing. We are seeing a revolution due to the development of deep artificial neural networks.
Technology Briefing

Reexamination of Thermal Cycling Reliablity of BGA Components
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging
Analysis Lab

High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys

High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys.
Materials Tech

Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Production Floor

Board Talk

Component Moisture Question?

What is the IPC Definition for Uncommonly Harsh?

How To Verify Cleanliness After Rework and Prior to Re-coating?

Causes of Blowholes

Demise of the Plated-Through Hole?

Assembling Boards with BGAs on Both Sides

Simple Test for Flux Penetration

5 vs 8-Zone Ovens

MORE BOARD TALK

Questions and Comments

Simple Test for Flux Penetration

AIM has a helpful video found at: https://youtu.be/MRPRmOYORT8 ...
Timothy ONeill, AIM Solder

Problem Meeting Minimum Hole Fill During Wave Soldering

I've had these problems where there were no thermal reliefs ...
Scott W McKee, Golden West Technology

What Rate is World Class for SMT Machines?

So many comments here and no hard numbers, so as ...
Robert Gray

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