circuit insight
Evaluation of Reliability using Autocatalytic Silver Bath on ENEP Layer
It was confirmed that ENEPES with a Ag thickness of 0.3 μm had good reliability both for the solder joint and Ag sintering joint.
Technical Paper
3P Production Preparation Process
A Lean Manufacturing methodology is presented as a standardization tool where teams work for the process design of production lines and manufacturing systems.
Technical Paper
Sponsor
BEST-Inc.

Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.
The Importance of Conformal Coating Thickness and Edge Coverage
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material.
Technical Paper
Intrusive Soldering Through-Hole Connector
We are SMT soldering a through-hole PC 104 connector. We have tried preforms and are unable to get all of the pins soldered. Phil Zarrow and Jim Hall, The Assembly Brothers, share their own suggestions in this scenario.
Board Talk
Impact of Pb-free Solder Alloy Mixing on Solder Joint Integrity Using BGAs
An investigation was conducted to assess the solder joint integrity (acceptable/nonacceptable) for three different solder alloys on ball grid arrays (BGAs) in a mixed metallurgy configuration as compared to a baseline SAC305 system. Thermal cycle testing using a -55 to +125 ºC range in accordance with the IPC-9701 specification was used.
Technical Paper
Sponsor
Manncorp

Build Your Solution with Manncorp
Get a custom SMT equipment plan in minutes and source your entire line from one trusted supplier—backed by lifetime expert support you won't find anywhere else.
Manncorp Inc.
How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly.
Board Talk
Increased Reliability of Quad Flat No Lead Wettable Flank Connections
The focus of this study is to investigate the reliability of the immersion tin layers plated by a tailored immersion tin process for QFN flank plating.
Technical Paper
Sponsor
kyzen

How pH Cleaning Agents Affect Production Performance
Establishing a reliable cleaning process requires a good understanding of all influencing factors, including pH, and defining the correct balance to meet final product reliability.
KYZEN
Breakthrough Technology to Improve X-Ray results
The paper contains comparison data from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Technical Paper
Implementing Automation and Ai for Electronic Card Assembly
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation.
Technical Paper
Challenges of Ultra-Fine Feature Printing Optimization of Pb-Free Solder Paste
Semiconductor manufacturing, flip chip, package on package, system in package, and miniature components may require printing through stencil apertures of 50-100 μm in size.
Technical Paper
Sponsor
Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE
The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of an 84-Pin Thin Core BGA
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders.
Technical Paper
Flux Residue Causing Test Issues
We are having issues with flux residues. After wave, we experience many incomplete readings due to flux residues on connector pins.
Board Talk
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Technical Paper
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AI-Technology-Inc
Sponsor
Viscom

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom
Circuit-Technology-Center
Sponsor
Zestron

Is your PCB surface finish surviving the wash?
Aqueous cleaning can stain or strip ImSn, ImAg & ENIG finishes. Get test data on protecting surface finish integrity post-reflow.
ZESTRON Americas
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