Electronics Manufacturing and Electronics Assembly

What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, share their suggestions for this scenario.
Board Talk

Characterization of SIP Assembly and Reliability Under Thermal Cycles
This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays.
Production Floor

Computing After Moore's Law
The gap between computing demand and supply is growing. We are seeing a revolution due to the development of deep artificial neural networks.
Technology Briefing

Moisture Effects in Common Solderable RF Connector Dielectrics
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized.
Analysis Lab

Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech

Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
Production Floor

Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab

Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk

Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Materials Tech

Robots Begin to Develop Common Sense Knowledge
MIT engineers are working to give robots a bit of “common sense” when faced with situations that push them off their trained paths.
Technology Briefing

Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
Production Floor

Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly.
Analysis Lab

The Hot Chip Scale Package
A team building the world's first high-density Chip Scale Package needed to get it out the door. It was still hot when it shipped.
Mysteries of Science

Industry Progress from 2005 to Present Day
This paper compares assembly and test of various 1.0 mm pitch CBGAs conducted between 2005 and 2014.
Production Floor

Method Produces Metals with Low Thermal Expansion without Emitting CO2

Production of metals with low thermal expansion, called Invar, are critical for the aerospace, cryogenic transport, energy, and precision instrument sectors.
Technology Briefing

Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Analysis Lab

Effect of Bi Content on Properties of Low Silver SAC Solders

A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys.
Materials Tech

Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity design and assembly issues identified during the design of experiments, the findings, reliability results, and conclusions are discussed in this paper.
Production Floor

Board Talk

How Do You Remove Oxidation from PCBs?

Should We Measure Solder Paste Thickness?

How Many Fiducials Per Stencil

Why Should We Consider Smart Feeders?

PCBA Cleaning with Sodium Bicarbonate

Cure for the Grape Effect

Big Problems with HASL Finish

Solder Paste Inspection - When and Why

MORE BOARD TALK

Questions and Comments

Big Problems with HASL Finish

This problem was quite common in the late 90s. Electronic ...
Les Watts, Testerion

Shelf Life Before Conformal Coating

There are a couple of standards that have requirements for ...
Alan Woodford, Zentech

Reflow For Rigid Flex

Depending on the overall thickness of the flex, bake times ...
Philip H. Provencal, Jr., Columbia Tech

MORE COMMENTS

"If we provide great customer service, people will pester us with a bunch of stupid questions. Do we really want that?"
Copyright © Randy Glasbergen