Electronics Manufacturing and Electronics Assembly

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Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic

Technical Papers

The "Fried Egg" Effect in Soldering

Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices

Innovative Power Module Assembly Solutions

Unlocking the Potential of Nanoscale Conformal Coatings

Recycling vs Circularity: Minimising E-Waste in Manufacturing

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

Probe Card Manufacturer 'Sees the Unseen' With X-ray

Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods

MORE TECHNICAL PAPERS

Peel-A-Way Removable Terminal Carriers

Reduce PC board assembly time by eliminating hand-loading of socket terminals and pins. Available in virtually any pattern to match your existing board layout.

FREE SAMPLE

Ask the Experts

Mixed Process Solder Joint Appearance, Smooth or Grainy?

ESD Grounding - 1 Meg Ohm Resistor

Stencil Pattern for LGA Power Pad

BGA Die and Pry Testing

Stencil Cleaning Frequency

Rechecking Thermal Profiles

Cleanliness Standards for Electronic Components

Pin-in-Paste Hole Stencil Printing

MORE ASK THE EXPERTS

100+ Repair and Rework Guides Online!

These guides are packed with illustrations and videos and follow popular IPC standards. The information will be helpful to anyone who works with bare circuit boards and circuit board assemblies.

CHECK IT OUT!

May 1, 2025

High-Reliability Solder Alloys’ Impact on Pb-free TF Conductors

The main objective of this paper was to identify a solder (specifically Sn-based and high reliability) and thick film combination to improve overall reliability of thick film hybrids. This was done by conducting rigorous thermal testing. The work conducted for this paper served as an initial exploration into this area of study.
Materials Tech

A.I. Deployment in Verification Tool for Inspection Equipment
AI has been deployed in the verification tool with studies conducted to compare the effectiveness and efficiency of the tool versus human operation.
Production Floor

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Heterogeneous Data Teaches Robots Range of Tasks
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks.
Technology Briefing

Evaluation of Reliability using Autocatalytic Silver Bath on ENEP Layer
It was confirmed that ENEPES with a Ag thickness of 0.3 μm had good reliability both for the solder joint and Ag sintering joint.
Analysis Lab

Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste.
Materials Tech

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Circuitnet Media LLC

Complex Board Design Induced Solder Separation Failure
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure.
Production Floor

Tin-Bismuth Low Temperature Solder Electromigration Behavior
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service.
Analysis Lab

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REL61: Cost-Effective Soldering, Elevated Performance
Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance.
AIM Solder

The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards.
Board Talk

Dynamic Bending Reliability of Chip-In Fabrics (CIF) Packaging
In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated.
Materials Tech

Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing

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Touchless Solder Ball Removal
Watch our video showcasing touch-free BGA component deballing. This revolutionary approach achieves unparalleled reliability and precision when preparing BGA components for re-balling.
Circuit Technology Center

Assembly Optimization for Thin Flip-Chip Chip-Scale Packages
A robust board assembly recipe is demonstrated for thin FCCSP packages with reflow warpage values of up to 110μm or higher.
Production Floor

Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders.
Analysis Lab

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Silver Filled, Heat Curing Epoxy
Master Bond EP4S-80 is a one part, electrically conductive, silver filled adhesive for bonding, sealing and coating with a low curing temperature of 80°C.
Master Bond

The Day They Shut Down Intel
Chipmaker Intel had just started up a new chip factory when something odd caused a shut down. What lead to this development?
Mysteries of Science

Breakthrough Technology to Improve X-Ray results
The paper contains comparison data from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Production Floor

America Risks Losing Its Status As the Most Innovative Place on Earth
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography.
Technology Briefing

Increased Reliability of Quad Flat No Lead Wettable Flank Connections

The focus of this study is to investigate the reliability of the immersion tin layers plated by a tailored immersion tin process for QFN flank plating.
Analysis Lab

Selective Soldering with Alternative Lead-Free Alloys
We are still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling.
Materials Tech

How X-Ray Technology is Improving the Electronics Assembly Process

X-ray inspection of electronic components is now standard practice for any company working in the electronics industry.
Production Floor

Latest Industry News

Smartphone Market Slows Worldwide, Apple and Samsung Still Lead the Pack

Rochester Minimizes Supply Chain Disruption

Amazon CEO Jassy says he's 'optimistic' company could emerge from tariff uncertainty stronger

5 cars that are safest from tariffs — and 5 getting hit hardest

Intel Foundry: We Are Listening and Learning from Our Customers

MORE INDUSTRY NEWS

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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Questions and Comments

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability

In re-reading this study, the results, of course are well ...
Jaye Waas, Renkus-Heinz

Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions

There really, at present, no such thing as "selective cleaning". ...
Phil Zarrow, ITM Consulting

Palm Size Portable 3 Printer

Impressive start. I look forward to further reports on the ...
Jaye Waas, Renkus-Heinz

MORE COMMENTS

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Conquer BGA Rework Challenges!
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Circuit Technology Center

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