Electronics Manufacturing and Electronics Assembly

From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this situation and offer their own suggestions.
Board Talk

Control of the Underfill of Surface Mount Assemblies
Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations.
Production Floor

AI and Precision Agriculture Address Farming Problems
Automation with biology and chemistry to create a farming revolution which enabled a fraction of the population to deliver more than had formerly produced.
Technology Briefing

Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders.
Analysis Lab

Intermetallic Compounds in Solder Alloys: The Common Misconception
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys.
Materials Tech

Returning to Basics in the SMT Screen Printing Process
This paper showcases a new stencil process that was discovered by reverting to the basics.
Production Floor

Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab

Incoming Circuit Boards - How Clean Is Clean?
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness?
Board Talk

Evaluation and Qualification of Reworkable Underfill Materials
Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability.
Materials Tech

There Actually is an 'I' in Team
Robotic arms handle repetitive and precision movements. This change relieves operators of mundane work. They must adjust to the new work environment.
Technology Briefing

Leadless Flip Chip PLGA for Networking Applications
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications.
Production Floor

The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Analysis Lab

Attack of the BLOB!
Joe came home from work one day to find his house covered in a mysterious foam-like blob material. What was the mysterious foam and where did it come from?
Mysteries of Science

Direct Metallization for Printed Circuit Board Manufacturing
Since Multi-Layer Printed Circuit Boards with holes appeared, the processes making holes conductive have played critical roles to achieve MLB’s function.
Production Floor

AI, Digitalization, & the Outlook for the U.S. Economy

Trends in U.S. demography are poised to complement the deployment of maturing AI and digitalization. This will transform industries and create new ones.
Technology Briefing

Tin-Bismuth Low Temperature Solder Electromigration Behavior
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service.
Analysis Lab

Insertion Loss Comparisons of High Frequency PCBs

PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech

Rework Challenges for Leading Edge Components BGA, QFN and LED
This paper outlines rework processes for many challenging components including BGA, QFN/BTC, and LED packages.
Production Floor

Board Talk

How To Rework Warped PCBAs?

Incoming Circuit Boards - How Clean Is Clean?

How Long Solder Paste Can Be Left On a Stencil Without Activity

Should We Invest in 3D Optical Inspection?

Intrusive Soldering vs. Wave Solder

Issues With BGA Rework Residue

Limits for HASL with Complex Products

Reliability of Tin Lead Solder vs. Lead Free Solder

MORE BOARD TALK

Questions and Comments

How Long Solder Paste Can Be Left On a Stencil Without Activity

Testing for Environmental factors should include seasonal changes. Most larger ...
Alan Woodford, Zentech

The Quest for Reliability Standards

Test methods must relate to fundamental engineering principles and never ...
Jerry Magera

How Long Solder Paste Can Be Left On a Stencil Without Activity

The stand-time is the factor to look at. I contacted ...
Jaye Waas, Renkus-Heinz

MORE COMMENTS

"Always criticize the other guy before he has a chance to criticize you. That's called 'constructive criticism'."
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