Electronics Manufacturing and Electronics Assembly

Sponsor

Touchless Solder Ball Removal
Watch our video showcasing touch-free BGA component deballing. This revolutionary approach achieves unparalleled reliability and precision when preparing BGA components for re-balling.
Circuit Technology Center

Technical Papers

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

Probe Card Manufacturer 'Sees the Unseen' With X-ray

Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods

An Eight-Step Methodology for Bringing a Process Under Statistical Control

Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel

Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry

Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment

Recent Advances in Final Finishes Push Past the Limits of Conventional Electrolytes

MORE TECHNICAL PAPERS

Ask the Experts

BGA reballing question

Conformal Coating Press Fit Connectors

Dust contamination after selective soldering

Moisture Sensitivity Level for Bare Boards

Contamination Using Solvent Dispensers

Challenges Placing RF Shields During SMT Assembly

Seeking Advise for a Solder Reflow Recipe

Critical Part Fixture During Reflow

MORE ASK THE EXPERTS

February 20, 2025

Case Studies of Harsh Application Environments

This paper will present scenarios where environmental factors played a role in inducing various degradation mechanisms to Rockwell products. The paper will attempt to concentrate on the unusual scenarios, or where assumptions were made too early in the analytical process that likely hindered efficient determination of root cause.
Analysis Lab

Direct Metallization for Printed Circuit Board Manufacturing
Since Multi-Layer Printed Circuit Boards with holes appeared, the processes making holes conductive have played critical roles to achieve MLB’s function.
Production Floor

Sponsor

How Precise are Your Temp. Readings?
Did you know thermocouple attachment method can significantly impact the accuracy of thermal profiling temperature readings? Find out what this study revealed.
ECD

Heterogeneous Data Teaches Robots Range of Tasks
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks.
Technology Briefing

Low Temperature Soldering: Reflow Enhanced Mechanical Reliability
In this work, we further discuss solderability and mechanical reliability of a novel low temperature proprietary alloy (generically called as X46).
Materials Tech

Leadless Flip Chip PLGA for Networking Applications
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications.
Production Floor

Sponsor

Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond

Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads
The survivability of 0.4mm pitch and 0.5mm pitch parts at acceleration levels upto 50,000g have been studied for bare test boards.
Analysis Lab

Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk

Sponsor

Choose Advanced Assembly with Precision Components
PCBWay handles complex assemblies with precision. Our lines handle fine pitch components such as 01005, 0201, BGAs & other challenging packages.
PCBWay

Investigation into Low Temperature Solder Reliability
This paper presents an examination of three low temperature solders and provides a comparison with tin-silver-copper solder.
Materials Tech

3D-Printed Concrete Revolutionizes Home Building
Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste.
Technology Briefing

Reliability of Critical Assemblies When Implementing a New Cleaning
The cleanliness of high-reliability assemblies has become more critical for the product’s performance in the field.
Production Floor

Sponsor

Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Discover and learn more.
Smart Sonic

Tin Flakes/Splashes in SMT
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes.
Analysis Lab

RCA TV Soldering Mystery
Decades ago RCA had a soldering problem. One day nearly half of the assemblies had to be reworked, but nothing seemed amiss at the board shop. What was the cause?
Mysteries of Science

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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Assembly Process Optimization of 0201 BTC Diodes for High Temperature
This case study considers the effects of PCB pad design, stencil aperture design, the flux formulation in the assembly of 0201 BTC diodes using high temperature lead free solder. The study recommends the consideration of supplier recommended pad designs for 0201 BTCs.
Analysis Lab

America Risks Losing Its Status As the Most Innovative Place on Earth
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography.
Technology Briefing

ENIG Nickel Corrosion on Wetting Balance Test Results and Intermetallic Formation
This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed.
Analysis Lab

Intermetallic Compounds in Solder Alloys: The Common Misconception
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys.
Materials Tech

Impact of PCB Design BGA Land Pattern Warpage and SMT Yield

This paper discusses the influence of the PCB design parameters, PCB materials, and PCB lamination process on PCB warpage.
Production Floor

10 Cloud-based PCB Designing Tools for Remote Work
We have categorized together 10 of the best software tools for PCB outlook for electronics engineers – to buy you time while you are working on your projects.
Analysis Lab

Latest Industry News

iPhone 17 could be 9% more expensive due to Trump’s tariffs

How to Transform Your Business Operations Through Process Innovation

This 1.9-pound smartphone battery life can be measured in months

Building semiconductor plants in the US takes twice as long, costs twice as much as in Taiwan

Desperately Seeking AGI: Throwing Good Money After Bad

MORE INDUSTRY NEWS

Sponsor

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.

Questions and Comments

Additive Manufactured Electronics for Next Generation Microelectronics

AME is necessary to manufacture advanced electronics do to need ...
Voya Markovich

Combing Automated Advanced Process Control with Feedback

I wonder in the case of the print process DOE ...
Robert Gray

Issues With SMT Component Alignment

To F.S. Put two little dots of red adhesive on ...
David S. Chapman, DCT

MORE COMMENTS

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Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics—no trade-offs needed.
AIM Solder