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November 25, 2025
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Non-Contact Measurement of Conformal Coating Thickness
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces. In this work, conformal coating wet and dry thicknesses were measured using CCM and traditional methods. FR4 boards with varied color solder masks and components were created for realistic use cases.
Analysis Lab
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Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Materials Tech
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Thermally Conductive Epoxy
Master Bond Supreme 11AOHTLP is a two component adhesive featuring thermal conductivity and electrical insulation for high performance bonding, sealing and coating.
Master Bond
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
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Help With Lead to Hole Ratio
What is the minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Where can I find the recommended guideline?
Board Talk
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What Caused the Mysterious Spots?
One afternoon big round blank spots in a roll of metalized film were detected. Were the defects in the film-coating process?
Mysteries of Science
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Storage Solutions – Free Online Demo
Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are.
Essegi Automation
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Going Beyond Your Solder Paste Work Life
Solder paste used for a problem batch of board exceeded the 12 hour work life by one hour. Could this cause soldering problems for small chip components?
Board Talk
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