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Questions and CommentsHave you got something to say? Visit any program page and use the Comment form at the bottom of the page to submit a comment or ask a question. Comments and questions are reviewed prior to posting. |
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Apr 9, 2025 Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions There really, at present, no such thing as "selective cleaning". As my friends at Foresite say " if there is no rinse you are not really cleaning - you're just relocating the contaminant". ... Phil Zarrow, ITM Consulting Mar 10, 2025 Palm Size Portable 3 Printer Impressive start. I look forward to further reports on the progress. Thank you for the clear explanation of the 3D device. ... Jaye Waas, Renkus-Heinz Mar 10, 2025 Impact of PCB Manufacturing, Design, and Material to PCB Warpage Symmetrical stack ups and copper distribution is key to maintaining flatness. See IPC-2221 section 5.2.4 and IPC-2222 4.2.2 ... Gerry Partida, Summit Interconnect Feb 12, 2025 Additive Manufactured Electronics for Next Generation Microelectronics AME is necessary to manufacture advanced electronics do to need for very fine connecting lines and excellent registration. ... Voya Markovich Feb 12, 2025 Combing Automated Advanced Process Control with Feedback I wonder in the case of the print process DOE for the ten confirmation prints what happens regarding under stencil automatic cleaning if the printer is set to clean inside the ten confirmation prints? Ten ... Robert Gray |
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