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Apr 16, 2025 A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability In re-reading this study, the results, of course are well substantiated, but it would be particularly nice to know the conversion factors as relates to the real-world product lifetime expectations. Quite few applications have the ... Jaye Waas, Renkus-Heinz Apr 9, 2025 Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions There really, at present, no such thing as "selective cleaning". As my friends at Foresite say " if there is no rinse you are not really cleaning - you're just relocating the contaminant". ... Phil Zarrow, ITM Consulting Mar 10, 2025 Palm Size Portable 3 Printer Impressive start. I look forward to further reports on the progress. Thank you for the clear explanation of the 3D device. ... Jaye Waas, Renkus-Heinz Mar 10, 2025 Impact of PCB Manufacturing, Design, and Material to PCB Warpage Symmetrical stack ups and copper distribution is key to maintaining flatness. See IPC-2221 section 5.2.4 and IPC-2222 4.2.2 ... Gerry Partida, Summit Interconnect Feb 12, 2025 Additive Manufactured Electronics for Next Generation Microelectronics AME is necessary to manufacture advanced electronics do to need for very fine connecting lines and excellent registration. ... Voya Markovich |
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