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Questions and CommentsHave you got something to say? Visit any program page and use the Comment form at the bottom of the page to submit a comment or ask a question. Comments and questions are reviewed prior to posting. |
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Apr 5, 2024 Problem Meeting Minimum Hole Fill During Wave Soldering Everything that has been described is correct. If it is a thermodynamic problem, preheating is essential because it’s part of the demand on soldering heat. The higher the heat capacity of the PCB, the longer ... Juergen Friedrich, Ersa GmbH Apr 3, 2024 Problem Meeting Minimum Hole Fill During Wave Soldering Our past experience is that the use of an inert atmosphere, Nitrogen, significantly improves through wetting performance. The nitrogen will allow for the flux to stay active longer and promote improved wetting. N2 inerting retrofit ... Gregory K Arslanian, Air Products and Chemicals, Inc. Apr 1, 2024 Is No-Clean the Trend for QFN Components? We work with smaller assemblies with small QFN and smaller SMT packages that make it hard for the traditional cleaning methods. Most applications I choose a NO-Clean paste/flux always. Or a local clean and air ... Tim Smith, Base2 Engineering a BlueHalo Company Mar 27, 2024 Is No-Clean the Trend for QFN Components? I love these questions…always anonymous (I think Phil makes them up to stimulate Jim) Let’s visit DMAIC again. And let’s also look at the Industry IPC Assembly Class guidelines. If you are assembling Winky-Blinkies (ClassI), ... Ike Sedberry, ISEDS Mar 25, 2024 Why Do Our Boards Warp During Reflow? After reading all the comments, I didn’t see anyone mention to check that the bare board Tg is what was you initially specified and that it is adequate for the profile(s) you are running. ... Andy Monson, Hayward Industries |
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