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Touchless Solder Ball Removal
Watch our video showcasing touch-free BGA component deballing. This revolutionary approach achieves unparalleled reliability and precision when preparing BGA components for re-balling.
Circuit Technology Center
Advanced-Interconnections

Questions and Comments



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Feb 12, 2025
Additive Manufactured Electronics for Next Generation Microelectronics
AME is necessary to manufacture advanced electronics do to need for very fine connecting lines and excellent registration. ...
Voya Markovich

Feb 12, 2025
Combing Automated Advanced Process Control with Feedback
I wonder in the case of the print process DOE for the ten confirmation prints what happens regarding under stencil automatic cleaning if the printer is set to clean inside the ten confirmation prints? Ten ...
Robert Gray

Feb 12, 2025
Issues With SMT Component Alignment
To F.S. Put two little dots of red adhesive on the board after screenprinting and before reflow. Those football shaped inductors are notorious for moving. The glue will cure before liquidous and hold the part ...
David S. Chapman, DCT

Feb 7, 2025
Method Produces Metals with Low Thermal Expansion without Emitting CO2
Where does this stand with respect to Hydrogen embrittlement, a known cause of fractures and failure? Does the use of oxides eliminate or reduce the net hydrogen content or the migration of hydrogen? Altogether this ...
Jaye Waas, Renkus-Heinz

Jan 28, 2025
Issues With SMT Component Alignment
The fan speeds in your oven could be turned down they might be moving them. When was the last time you calibrated your oven? Make sure your parts thickness are measured correctly since that can ...
David S. Chapman, DCT

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ECD

How Precise are Your Temp. Readings?
Did you know thermocouple attachment method can significantly impact the accuracy of thermal profiling temperature readings? Find out what this study revealed.
ECD
Circuit-Technology-Center