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Tech Paper - Keys to Component Lead Tinning Success
This paper explores the challenges and best practices of component tinning, emphasizing temperature control, flux selection, and soldering techniques. Download this free tech paper.
Circuit Technology Center
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iNEMI Board Assembly –Press-Fit Technology Roadmap
A press-fit roadmap team including press-fit manufacture, OEM/ODM and EMS are getting together every two years to identify the future technology trend, future technical challenges and needs and then to find potential solution for next 5 to 10 years in the horizon.
Analysis Lab
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Authored By:
Dennis Willies, Oscar Diaz, Jasbir Bath
iNEMI 2023 Board Assembly-Press Fit Technology Roadmap Team
Alex Chen, Thilo Sack, and Paul Wang, Ph.D
MiTAC Computer Technology
CA, USA
Summary
Press-Fit technology used in printed circuit board (PCB) application is a proven and robust interconnect approach to reliably provide electrical and mechanical connections from PCB to an electrical connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical connections. Press-Fit Compliant Pins are used on various Backplanes, Mid-planes, and Daughter Card Connectors. Circuit designers are continuing to use press-fit interconnect method to avoid challenges associated with soldering and rework.
To fulfill the future electrical performance and memory and speed I/O data rate in Gigabytes per second and high signal integrity for next generation cloud computing products and specially for the ever growing massive mobile users and IoT applications, iNEMI Board Assembly-press-Fit Technology Roadmap Team get together every two years to identify the future technology trend, future technical challenges and needs and then to find potential solution for next 5 to 10 years in the horizon.
In this article, there are several technical challenges have been identified through extensive brainstorming by press-fit roadmap team. These challenges range from press-fit interconnection high-speed signal performance limits, press-fit assembly process automation, bent compliance pin during insertion, press-fit rework standardized method, bend pin testing and AOI/X-ray detection, to EMI/cross talk concern when press-fit serve as antenna during high-speed signal transmission. The current technical status and gap to these challenges will be discussed in the paper. Then the potential solution in three color-coded will be marked to describe if there are /will be a research, development and deployment activates to facilitate the technology evolution to enable resolution of these press-fit interconnect challenges.
Conclusions
In this article, there are several technical challenges have been identified through extensive brainstorming by press-fit roadmap team. These challenges range from press-fit interconnection high-speed signal performance limits, press-fit assembly process automation, bent compliance pin during insertion, press-fit rework standardized method, bend pin testing and AOI/X-ray detection, to EMI/cross talk concern when press-fit serve as antenna during high-speed signal transmission. The current technical status and gap to these challenges will be discussed in the paper. Then the potential solution in three color-coded will be marked to describe if there are /will be a research, development and deployment activates to facilitate the technology evolution to enable resolution of these press-fit interconnect challenges.
Initially Published in the SMTA Proceedings
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Comments
A very interesting article. UIBEL CONSULTING is participating in the working group “IPC 9797 Press-Fit Standard for Automotive Requirements and Other High Reliability Applications.” In my opinion, it could be beneficial for both sides to discuss the topic of press-fit technology.
Frank Alexander Uibel, Uibel Consulting
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Bismuth in Solder Alloys
Bismuth is a primary constituent in many low-temp solders. It also serves as an additive element in SAC solders that reinforces joint durability & optimizes wetting characteristics.
AIM Solder
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