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| Flip-Chip, MEMS, Semiconductors | ||||||||||
| These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more. | ||||||||||
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Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications. Production Floor
In this paper, we will discuss various assembly options and the challenges posed by each. Production Floor
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates. Production Floor
China's semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC integration. Production Floor
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution. Production Floor
A robust board assembly recipe is demonstrated for thin FCCSP packages with reflow warpage values of up to 110μm or higher. Production Floor
Overview of typical defects and failure modes seen in flip chip package assembly, and efforts to understand new failure modes during assembly. Analysis Lab
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication. Production Floor
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance. Analysis Lab
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices. Analysis Lab |
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