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| Flip-Chip, MEMS, Semiconductors | ||||||||||
| These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more. | ||||||||||
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A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution. Production Floor
A robust board assembly recipe is demonstrated for thin FCCSP packages with reflow warpage values of up to 110μm or higher. Production Floor
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability. Analysis Lab
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers. Materials Tech
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology. Materials Tech
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing. Production Floor
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs. Production Floor
The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process. Analysis Lab
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies. Production Floor
The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment. Materials Tech |
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