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| Rework, Repair, Modification | ||||||||||
| These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more. | ||||||||||
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A non-aerospace customer's board was repaired without authorization. Does an IPC document state that customer approval is required for class 3 repairs? Board Talk
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss their recommendations. Board Talk
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature. Analysis Lab
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss the best practices given this scenario. Board Talk
Reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies are presented. Production Floor
What is the consensus for baking out moisture in circuit board assemblies prior to convection rework, localized mini-wave rework, or hand soldering rework? Board Talk
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness? Board Talk
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit. Production Floor
The successful transition of low and mid-range servers to lead-free has come largely through wave solder process optimization and the use of alternate lead-free alloys. Production Floor
This paper reviews the challenges and process steps needed for successful repair of surface mount devices on very densely packaged circuit boards. Production Floor |
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