|
|
|
|
|
|
|
|
| Rework, Repair, Modification | ||||||||||
| These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more. | ||||||||||
|
||||||||||
|
|
||||||||||
This paper outlines rework processes for many challenging components including BGA, QFN/BTC, and LED packages. Production Floor
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA? Board Talk
This paper discusses rework challenges including identification of the key technical process, outlining efforts aimed at addressing these new challenges. Production Floor
Off-the-shelf column grid arrays are now being considered for use in a number of NASA systems. This paper presents rework and re-column attachment data. Production Floor
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components? What are the safest, best methods for depaneling circuit board that have BGA components? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question. Board Talk
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards? Board Talk
This paper discusses some aspects of the process optimization and changes made to improve the quality of the rework process. Production Floor
This paper discusses the work done in identifying the key features for the right BGA rework equipment. Production Floor
Is there a way to estimate the potential failure rate introduced by hand rework on one SMT part? Phil Zarrow and Jim Hall, also known as The Assembly Brothers, offer their own expertise and experience when answering this question. Board Talk
We recently reworked a BGA component and the corners all bridged. Can these components be removed and reused if we remove the warp? Board Talk |
|
|
|
|
|
|
|
|