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| Test, Inspection, X-Ray | ||||||||||
| These programs cover manual and automated test, manual and automated optical inspection, x-ray and more. | ||||||||||
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Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee. Production Floor
The paper contains comparison data from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs. Production Floor
This paper updates progress in the development of methods for investigating solder joint reliability in a combined environment of vibration and thermal cycle testing. Analysis Lab
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses. Analysis Lab
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware. Analysis Lab
This paper compares assembly and test of various 1.0 mm pitch CBGAs conducted between 2005 and 2014. Production Floor
The paper reports the results of the iNEMI creep corrosion qualification test and compares them to the first round robin test and recent mixed-flowing gas test results. Analysis Lab
Our facility is considering a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one? Board Talk
Study compares board level reliability of BGA and LGA packages mounted with an LGA footprint. Yield, drop test and thermal performance were evaluated. Analysis Lab
Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service? Board Talk |
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