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| Test, Inspection, X-Ray | ||||||||||
| These programs cover manual and automated test, manual and automated optical inspection, x-ray and more. | ||||||||||
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We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time? Board Talk
This study evaluates reliability in a production design. Functional assemblies were built using Pb-free BGAs in a SnPb solder process and subjected to life testing. Analysis Lab
This paper uses data to outline what a 4-wire Kelvin test. Several examples are illustrated of what the 4 wire Kelvin test can and cannot do. Analysis Lab
This paper discusses test access methodologies and elaborates on Embedded System Access strategies in particular. Analysis Lab
For the study we used two boards exhibiting HIP defects with four types of AXI machines at four sites in Flextronics manufacturing, or vendor laboratory. Analysis Lab
This paper investigates how the connected at-line x-ray system can improve production yield and lower costs when connected to the production line. Production Floor
This paper proposes a test method and vehicle to characterize soldering materials, assembly process steps, and conformal coating to determine reliability. Analysis Lab
A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data. Production Floor
This paper discusses a method to predict drop test behavior by understanding the surface tension of the solder mask ink and the underfill. Analysis Lab
This paper investigates the Mechanical Shock and Drop Reliability of SnAgCu ball Flip Chip BGA solder joints. Production Floor |
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