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The importance of proper calibration for two-wire measurement setups is reaffirmed. For tweezer meters, this issue is even more critical due to the potentially higher offset values, which can be as large as 19 nH. Production Floor
The paper presents a summary of board level reliability test performed on RF packages, the assembly process controls and monitoring, mechanical and environmental reliability tests, understanding of failure modes and lessons learned. Production Floor
We are showing what could be done when using a 2D X-ray system to collect high resolution images and process them with Deep Learning using AI. Analysis Lab
How can two different test methods provide Dk measurement that are different? When the methods measure the same circuit material in two different directions. Analysis Lab
This article presents workflows that combine 3D X-ray microscopy, nanoscale tomography, and electron microscopy for visualization of the interior of electronic devices. Analysis Lab
With the help of AI we hope to ease the workload of engineering and operation teams while also improving labor cost, efficiency, and product quality. After reviewing the four AI use cases presented in this paper, it is very apparent the overwhelming benefit AI can have with our AOI process and programs. Production Floor
This paper will outline the board-level assembly development and reliability that was undertaken to demonstrate this WLCSP could meet the demands of automotive. Analysis Lab
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality. Analysis Lab
The reliability of castellated vias as a rigid-flex interconnection method is evaluated. This is split into metallurgical aging of joints and investigating mechanical robustness/integrity. Analysis Lab
To investigate corrosion problems in electronic products for server applications, mixed flowing gas (MFG) is widely used as an accelerated testing method. Analysis Lab |
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