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| PC Fab, Board Design, Laminates | ||||||||||
| These programs cover bare PC board fabrication, circuit board design, laminates and more. | ||||||||||
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With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate. Analysis Lab
This paper shows how the application of the Young-Laplace equation can lead to an understanding of the soldering process of exposed pads and heat slugs. Production Floor
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, share their suggestions for this scenario. Board Talk
The combination of improved computers, detectors, and new software has allowed the addition of a fourth dimension to a computed tomography data set. Production Floor
With tools to model a large quantity of products and the impact of SMT line configurations, an electronics assembly plant can be analyzed to identify improvement opportunities. Analysis Lab
We are able to lift a SOIC off a PCBA using tweezers and no heat. The pads are bare copper, the PCB was manufactured using tin lead HASL finish. The Assembly Brothers, Phil Zarrow and Jim Hall, share their own experiences. Board Talk
Use of embedded components has grown significantly in the defense, aerospace, telecommunications, medical and consumer markets. Production Floor
Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application. Materials Tech
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics. Analysis Lab
A new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions is covered. Materials Tech |
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