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| PC Fab, Board Design, Laminates | ||||||||||
| These programs cover bare PC board fabrication, circuit board design, laminates and more. | ||||||||||
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A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging Analysis Lab
How long will the industry continue to use through hole components? I can envision connectors being used for some time, what about component types? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question. Board Talk
The diameter, length, and aspect ratio of the Cu core columns and how to optimize the dimensions of the Cu core column is discussed. Analysis Lab
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. Production Floor
We have a PCB with a HASL surface finish, the assembly includes a 256 ball BGA. The component balls are .6 mm pitch. Is coplanarity a concern? Board Talk
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate. Analysis Lab
This paper shows how the application of the Young-Laplace equation can lead to an understanding of the soldering process of exposed pads and heat slugs. Production Floor
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, share their suggestions for this scenario. Board Talk
The combination of improved computers, detectors, and new software has allowed the addition of a fourth dimension to a computed tomography data set. Production Floor
With tools to model a large quantity of products and the impact of SMT line configurations, an electronics assembly plant can be analyzed to identify improvement opportunities. Analysis Lab |
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