Free SubscriptionEvery issue of the Circuit Insight email newsletter will bring you articles, multimedia information, and updates on the issues affecting you and your company. Subscribe Today Insert Your Email Address Privacy We respect your privacy. We will never sell, rent, or disclose your email address or any other information to anyone. Your subscription is held strictly confidential. See our Privacy Policy for more information. Format The Circuit Insight email newsletter is sent in HTML format. Unsubscribing Unsubscribing is simple. At the bottom of every newsletter is a simple link to unsubscribe. |
| PC Fab, Board Design, Laminates | ||||||||||
|
||||||||||
|
|
||||||||||
This paper aimed to investigate the impacts of printed circuit board (PCB) design, including the PCB thickness and solder mask opening, on the fatigue performance of lead-free solders. Each test vehicle includes one of two component types: CABGA192 and MLF32, assembled using SnAgCu solder paste with an Organic Solderability Preservative (OSP) surface finish. Analysis Lab
This paper will examine a few key areas of PCB design and manufacturing that can have a substantial impact on product reliability and how to mitigate reliability risks by deploying design for manufacturability (DFM) best practices. It will also explore the dependencies between the design and manufacturing processes. Analysis Lab
The focus of this study was to investigate the underlying mechanism of V-pitting and to develop a process to withstand or resist the pitting. Production Floor
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints. Analysis Lab
This case study considers the effects of PCB pad design, stencil aperture design, the flux formulation in the assembly of 0201 BTC diodes using high temperature lead free solder. The study recommends the consideration of supplier recommended pad designs for 0201 BTCs. Analysis Lab
This paper discusses the influence of the PCB design parameters, PCB materials, and PCB lamination process on PCB warpage. Production Floor
We have categorized together 10 of the best software tools for PCB outlook for electronics engineers – to buy you time while you are working on your projects. Analysis Lab
This paper provides insight into the impact of irregularities on BGA package surface mount yield, and guidance on design and to limit their impact. Production Floor
This paper presents design guidelines for laser depaneling such as contour limitations as well as required channel widths and component distances to the cutting edge. Production Floor
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L. Production Floor |
|