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Assembly Process Optimization of 0201 BTC Diodes for High Temperature
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Authored By:Prathik Rudresh Vicor Corporation MA, USA Chrys Shea Shea Engineering Services RI, USA SummaryAssembling 0201 footprint components on a PCB is a challenge given their small size. The study addresses the difficulties faced during assembly of bottom terminated 0201 components, precisely diodes. A structured Design of Experiments was utilized to understand the effects of pad design, stencil apertures and solder paste on the diode assembly. The findings from this study has helped in optimizing the diode placement and reduced false calls on the AOI, thus reducing the cycle time of AOI workstation. The learnings from this study will be used for various future paste formulations and smaller footprint components, which is where the industry is headed. ConclusionsWhile AD1 printed better than AD2, AD2 reduced shorts, skewing and false calls, indicating that there is more to quality and productivity than just good prints; the effect on the entire line should be measured and considered. This case study considers the effects of PCB pad design, stencil aperture design, the flux formulation in the assembly of 0201 BTC diodes using high temperature lead free solder. The study recommends the consideration of supplier recommended pad designs for 0201 BTCs. Generic aperture designs for 0201 chip components provide too much solder for the BTC-style termination. Adopting the strategy of looking at the product and production holistically, manufacturers can overcome the challenges associated with assembling 0201 diodes and ensure the production of high-quality electronic products. By presenting these insights, this paper aims to contribute to the broader understanding on assembly process optimization for ultra-miniature components that are increasingly vital in design and manufacturing of next generation electronics. Initially Published in the SMTA Proceedings |
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