Authored By:
Patrick Stockbrügger, Stephan Schmidt
LPKF Laser & Electronics SE
Garbsen, Germany
Summary
Intrecacy and flexibility – these are the characteristic properties of a laser. Anyone who understands how the narrow laser beam of only a few micrometers works can use its potential to optimize the PCB design of his applications. When changing from a traditional depaneling process to laser depaneling, PCB designers should therefore consider some new design freedoms as well as guidelines in order to allow the laser to unfold its potential.
This paper presents an in-depth analysis and summary of the most fundamental design guidelines for laser depaneling such as contour limitations as well as required channel widths and component distances to the cutting edge. For instance, the required channel widths are evaluated in regard to the material thickness and cutting quality. As a basis for these guidelines generated data and gained know-how from application trials is used. Furthermore, aspects such as the size of the scan field and the benefit of different preparation methods such as v-groove and pre-milling are evaluated. The target of the paper is to provide comprehensive and evidence-based design rules for PCB design optimized for laser depaneling.
Conclusions
Overall, it is evident that PCB and panel design are of central importance for laser depaneling. On the one hand, potentials are revealed through placement of components on the circuit board close to the cutting channel and material savings through the relatively narrow cutting channels when the contour is fully cut. On the other hand, it shows that factors such as the cutting strategy, arrangement of tabs, the size and positioning of the scan fields and also the selection of possible panel preparation should be taken into account during the design in order to get the best possible performance and quality out of the technology.
Initially Published in the SMTA Proceedings
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