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Industry expert Bob Willis uses the NPL Defect Database to explain SMT adhesive inspection. Defect of the Month
Industry expert Bob Willis explains the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it. Defect of the Month
Bob Willis explains the causes, solutions and tests for outgassing, caused by moisture in the printed board board. Defect of the Month
Industry expert Bob Willis explains the causes of popcorning (distortion) on plastic packages like QFPs, SOICs and BGAs. Defect of the Month
Industry expert Bob Willis explains the causes of PCB lamination defects. Defect of the Month
The water break test is easy and practical to conduct and helps you evaluate residues left from adhesives or conformal coating dots. Defect of the Month
Industry expert Bob Willis explains the three available options of x-ray, optical and process monitoring for inspection of package-on-package assemblies. Defect of the Month
Industry expert Bob Willis explains solder mask outgassing defects with the help of the NPL Defect Database. Defect of the Month
Bob Willis looks at the most common reasons for solder skips on surface mount during wave soldering and illustrates how pad length, solder mask thickness and gassing from solder mask and flux will contribute to the problem. Defect of the Month
Industry expert Bob Willis explains how to use "sticky dots" to measure conformal coating thickness. Defect of the Month |
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