Head in Pillow Explained
Industry expert Bob Willis explains the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
Defect of the Month
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Defect of the Month are short informative programs produced by Bob Willis.
Bob is an electronics manufacturing consultant providing solutions for process and product failure trouble shooting, in-house training, process engineering support
on conventional and SMT,
lead-free production plus process and product failure analysis.
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Comments
Very interesting explanation. If oxygen level during reflow process is controlled at very low levels, solder oxidation may go to near zero as well. So Head in pillow defects rate would decrease (considering that other process parameters are ok). Using correctly nitrogen in reflow atmosphere helps to eliminate this type of defect if caused by solder oxidation.
Luiz Felipe Rodrigues, Air Liquide, Brasil
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