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| Contamination, Defects, Whiskers | ||||||||||
| These programs cover problems and solutions associated with contamination, defects, tin whiskers and more. | ||||||||||
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We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable? Board Talk
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling. Board Talk
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components. Analysis Lab
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. Production Floor
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications. Analysis Lab
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this? Board Talk
Dendrites, Electrochemical Migration and parasitic leakage, can be caused by process related contamination. This paper explores aspects of the creep corrosion chemical reaction. Analysis Lab
This paper investigates the impact of voids in BGA and CSP components using thermal cycle testing per the IPC specification for tin-lead solder alloys. Analysis Lab
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls. Analysis Lab
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test. Analysis Lab |
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