Contamination, Defects, Whiskers
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
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 Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
Analysis Lab

The Best Storage Method to Protect Against Corrosion
The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? Regardless of the methodology you use, you want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards. Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Can High Particle Concentrations Impact PCB Assembly?
Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Corrosion Resistant Servers for Free-Air Cooling Data Centers
Corrosion Resistant Servers for Free-Air Cooling Data Centers
This paper describes a corrosion resistant server design suitable for reliable operation in a free-air cooling data center.
Production Floor

Can Silver Cause Solder Embrittlement?
Can Silver Cause Solder Embrittlement?
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario.
Board Talk

Human-Induced Contamination on PCB Assembly
Human-Induced Contamination on PCB Assembly
This paper will discuss an experiment that was performed to investigate the effects of "contaminants" that could be measured with SIR testing.
Analysis Lab

Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor

Can Water Contamination Cause Failure?
Can Water Contamination Cause Failure?
We have an operational circuit board that was accidentally exposed to rainwater for a few hours. Is there a greater likelihood of failure? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question and share their expertise in the industry.
Board Talk

SERDP Tin Whisker Testing and Modeling
SERDP Tin Whisker Testing and Modeling
The paper discusses testing and modeling program that aims to assess and quantify tin whisker growth on lead-free manufactured assemblies.
Production Floor

Effect of Bias Voltage on Surface Insulation Resistance Measurements
Effect of Bias Voltage on Surface Insulation Resistance Measurements
In this study, we analyzed the effect that voltage bias has on dendrite growth both in clean PCBs and PCBs that were contaminated.
Analysis Lab