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Contamination, Defects, Whiskers | ||||||||||
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A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario. Board Talk
With high density interconnection designs, advanced packaging, localised self heating, sources of thermomechanical stress are introducing complex failures. Production Floor
Multiple tantalum capacitors are SMT attached to PCBs. Failures or fractures were observed at contractor SMT assembly lines and not on RTX lines. Production Floor
We have an operational circuit board that was accidentally exposed to rainwater for a few hours. Is there a greater likelihood of failure? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question and share their expertise in the industry. Board Talk
This paper will present scenarios where environmental factors played a role in inducing various degradation mechanisms to Rockwell products. The paper will attempt to concentrate on the unusual scenarios, or where assumptions were made too early in the analytical process that likely hindered efficient determination of root cause. Analysis Lab
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question. Board Talk
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production. Analysis Lab
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages. Analysis Lab
This paper is a case study of nickel dendritic growth under moisture condensation condition on freshly produced circuit boards contaminated with sulfuric acid etchant. Analysis Lab
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable? Board Talk |
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