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| Contamination, Defects, Whiskers | ||||||||||
| These programs cover problems and solutions associated with contamination, defects, tin whiskers and more. | ||||||||||
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Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components. Analysis Lab
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. Production Floor
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications. Analysis Lab
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this? Board Talk
Dendrites, Electrochemical Migration and parasitic leakage, can be caused by process related contamination. This paper explores aspects of the creep corrosion chemical reaction. Analysis Lab
This paper investigates the impact of voids in BGA and CSP components using thermal cycle testing per the IPC specification for tin-lead solder alloys. Analysis Lab
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls. Analysis Lab
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test. Analysis Lab
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question and share their own experiences. Board Talk
Pad cratering is laminate fracturing under the copper pads of a surface mount component. Two novel approaches to minimize pad cratering are presented. Production Floor |
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