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Contamination, Defects, Whiskers
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Can Silver Cause Solder Embrittlement?
Can Silver Cause Solder Embrittlement?
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario.
Board Talk

Managing Thermomechanical Behaviour in Automotive Electronics
Managing Thermomechanical Behaviour in Automotive Electronics
With high density interconnection designs, advanced packaging, localised self heating, sources of thermomechanical stress are introducing complex failures.
Production Floor

In-Situ Thermal Radiographic Failure Analysis of Capacitor Encapsulant Fracturing
In-Situ Thermal Radiographic Failure Analysis of Capacitor Encapsulant Fracturing
Multiple tantalum capacitors are SMT attached to PCBs. Failures or fractures were observed at contractor SMT assembly lines and not on RTX lines.
Production Floor

Can Water Contamination Cause Failure?
Can Water Contamination Cause Failure?
We have an operational circuit board that was accidentally exposed to rainwater for a few hours. Is there a greater likelihood of failure? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question and share their expertise in the industry.
Board Talk

Case Studies of Harsh Application Environments
Case Studies of Harsh Application Environments
This paper will present scenarios where environmental factors played a role in inducing various degradation mechanisms to Rockwell products. The paper will attempt to concentrate on the unusual scenarios, or where assumptions were made too early in the analytical process that likely hindered efficient determination of root cause.
Analysis Lab

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Process Control of Ionic Contamination in Assembly of Electronic Circuits
Process Control of Ionic Contamination in Assembly of Electronic Circuits
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production.
Analysis Lab

Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids
Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages.
Analysis Lab

A Case Study of Nickel Dendritic Growth on Printed Circuit Boards
A Case Study of Nickel Dendritic Growth on Printed Circuit Boards
This paper is a case study of nickel dendritic growth under moisture condensation condition on freshly produced circuit boards contaminated with sulfuric acid etchant.
Analysis Lab

Acceptable Rate for Head in Pillow?
Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable?
Board Talk

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