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This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production. Analysis Lab
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages. Analysis Lab
This paper is a case study of nickel dendritic growth under moisture condensation condition on freshly produced circuit boards contaminated with sulfuric acid etchant. Analysis Lab
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable? Board Talk
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling. Board Talk
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components. Analysis Lab
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. Production Floor
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications. Analysis Lab
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this? Board Talk
Dendrites, Electrochemical Migration and parasitic leakage, can be caused by process related contamination. This paper explores aspects of the creep corrosion chemical reaction. Analysis Lab |
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