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| Assembly, Printing, Pick & Place | ||||||||||
| These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. | ||||||||||
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Our solder paste has an exposure life of ten hours. After ten hours of operation do we need to remove all of the paste on the stencil and scrap it? Board Talk
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success. Analysis Lab
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation. Production Floor
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle? Board Talk
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. Production Floor
X-ray inspection of electronic components is now standard practice for any company working in the electronics industry. Production Floor
Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13. Materials Tech
Should stencil the aperture be home plate or inverted home plate? You know the performance difference between the two types. Which one is better? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own insights. Board Talk
What rate is considered world class when it comes to pick performance for SMT placement machines? Can you define pick performance? Board Talk
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing. Production Floor |
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