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| Assembly, Printing, Pick & Place | ||||||||||
| These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. | ||||||||||
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Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations. Production Floor
This paper showcases a new stencil process that was discovered by reverting to the basics. Production Floor
Since Multi-Layer Printed Circuit Boards with holes appeared, the processes making holes conductive have played critical roles to achieve MLB’s function. Production Floor
This paper focuses on one emerging DW approach, Aerosol Jet Printing, as a non-contact method to print fine features using different materials over various surfaces. Production Floor
The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the materials that require control or replacement. Materials Tech
The authors demonstrate how to produce a capacitive sensor system on three millimeter window glass by combining the piezo-jet technology and a pick-and-place system. Production Floor
This paper will discuss advantages of advanced ball-attach materials developed to meet the challenges of advanced packaging. Materials Tech
Implementation of metric 0201 or M0201 size surface mount passives will help enable the next generation form factor electronic packaging. Production Floor
The focus of this study is to investigate the reliability of the immersion tin layers plated by a tailored immersion tin process for QFN flank plating. Analysis Lab
This paper explores various technologies available today and some that are starting to appear and illustrates some key items for each technology. Production Floor |
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