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| Assembly, Printing, Pick & Place | ||||||||||
| These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. | ||||||||||
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This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays. Production Floor
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized. Analysis Lab
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things. Materials Tech
We have seen as many as 180 fiducials per stencil with a step and repeat. How many fiducials are recommended for a solder paste stencil? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question and share their own experiences. Board Talk
Cavity design and assembly issues identified during the design of experiments, the findings, reliability results, and conclusions are discussed in this paper. Production Floor
In selecting a new pick and place line, why should we consider smart feeders? How can we justify the added cost? Board Talk
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow. Production Floor
NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes. Analysis Lab
A major study looks at different aspects of the stencil printing process and their impact upon the assembly and reliability of CSP components. Production Floor
Interconnection technology is capable for resistant joints for SMT components, bigger dies, like MOSFETs or IGBTs and even large area substrates, like baseplate or heat sinks. Analysis Lab |
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