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The mechanism for the formation of Hot Tears is discussed and applied to other design elements that can be found on Printed Circuit Board Assemblies. Production Floor
Large size commercially available plastic ball grid array chip packaging was tested and analyzed under random vibration to assess its application feasibility on satellite electronics. Analysis Lab
This paper provides a procedure to simulate die pick-up process based on contact-debonding fracture mechanics approach. Production Floor
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint. Production Floor
The method explored in this paper regards the use of exposed via in pad. A dedicated test vehicle was designed for two types of QFN components. Analysis Lab
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily. Board Talk
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints? The Asembly Brothers, Phil Zarrow and Jim Hall, discuss this question and share their advice and suggestions. Board Talk
The study on strain measurement has just started, and there are still many unsolved puzzles, whether about strain gage selection or about measurement methodology. Analysis Lab
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography. Analysis Lab
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials. Materials Tech |
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