|
|
|
|
|
|
|
|
| Solders, Fluxes, Pastes | ||||||||||
| These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. | ||||||||||
|
||||||||||
|
|
||||||||||
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys. Materials Tech
How long can we leave solder paste on a stencil without any activity? If activity means not printing, then we are talking about a pause or abandoned time. The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario and share their own experiences. Board Talk
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated. Analysis Lab
Paper shows that tests can be developed to characterize fundamental properties of activator packages that directly impact performance. Materials Tech
Chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and material properties were documented. Analysis Lab
The issue of tin-lead solder versus lead-free solder reliability and whether lead in solders used for circuit board assembly impacts the reliability. Board Talk
This paper presents two concrete studies. Development steps will be validated by standardized tests, home-made testing, and industrial evaluations. Materials Tech
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper. Materials Tech
In the future more fine pitch CSP components will be required. However, product reliability has been a big challenge with the fine pitch CSPs. Analysis Lab
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste? Board Talk |
|
|
|
|
|
|
|
|