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| Solders, Fluxes, Pastes | ||||||||||
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The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution. Materials Tech
Alternative solders meet stringent environmental regulations, requirements for greater mechanical reliability, and high temperature service environments. Materials Tech
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications. Production Floor
Electronic Assembly reliability must consider process residues and cleanliness. IPC J-STD-001J—Section 8 requires assemblers to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other process residues. This research aims to study the electrical effects of flux and process residues following the rework process. Materials Tech
Aggressive form factors, reducing pitch, thinner packages, and larger die to package ratios are leading to higher package warpage during SMT reflow. Materials Tech
The types of rheology measurements studied here show trends that mirror the print volume and volume reproduceability for three pastes. Production Floor
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards. Materials Tech
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions. Materials Tech
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly. Materials Tech
This paper reports results of the behaviour of Sb in a Sn-Bi alloy and consider the implications of the findings for the reliability of LTS solder joints. Materials Tech |
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