|
|
|
|
|
|
|
|
| Solders, Fluxes, Pastes | ||||||||||
| These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. | ||||||||||
|
||||||||||
|
|
||||||||||
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding. Materials Tech
This paper focuses on the effects of sustained high temperatures on the high strain rate of doped lead-free solders operating between -65°C to 200°C. Materials Tech
In this paper the authors report some preliminary results from a wider study of the effects of bismuth on the properties and behaviour of solder alloys. Materials Tech
Solder powder size, flux chemistry, stencil aperture, stencil surface technology, reflow process, and more are investigated. Materials Tech
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys. Materials Tech
This paper details a water-soluble lead-free solder paste that has improved voiding performance and washability over previous generations of solder paste. Materials Tech
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates. Materials Tech
We evaluate the impact of stencil quality by comparing the printing performance of 0.35mm pitch and 01005 pads from different stencil suppliers. Analysis Lab
The primary goal of this study was to find a manufacturable solder paste material that would reduce the effects of aging on the solder joints. Analysis Lab
The experiment should find the optimum printer parameters, compare type 4 vs. 4.5 vs. 5 solder paste and 4 different stencils. Materials Tech |
|
|
|
|
|
|
|
|