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This paper studies the process-performance-reliability relationships for Sn-Bi-Ag and Sn-In solders on additively printed copper metallization. Analysis Lab
Lower-temperature paste can be reflowed under a relatively lower peak temperature profile and outperform SAC305 paste in the current WLP256 application. Materials Tech
This paper compared these three environments in terms of how well they characterize conformal coatings. Analysis Lab
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard. Materials Tech
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability. Materials Tech
In this work, thermal performance of five Sn/3.2Ag/0.7Cu/xSb (x is in the range of 4.5 to 6.5 wt.%) alloys were compared to select the optimized Sb content. Materials Tech
We developed a Cu paste that can be used as a filling material for a through-glass via (TGV). A TGV substrate can be filled with Cu paste without voids by using the vacuum-press method. A Cu film with the lowest volume resistivity of approximately 3.5 μΩ･cm was obtained at 350 °C or higher in a hydrogen atmosphere. Materials Tech
This study investigated the cause of tombstoning for 0402 capacitors in surface mount technology. Statistical analysis methods were used to determine if there was any difference. Analysis Lab
A novel lead-free solder paste, Durafuse® HR (DFHR), has been developed using Durafuse® technology. Materials Tech
This paper evaluates the long term aging effect of various doped lead free solders built using Megtron6 substrate under other, different aging conditions. Materials Tech |
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