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| Solders, Fluxes, Pastes | ||||||||||
| These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. | ||||||||||
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The experiment should find the optimum printer parameters, compare type 4 vs. 4.5 vs. 5 solder paste and 4 different stencils. Materials Tech
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon. Materials Tech
A variety of dummy QFNs are assembled on PCBs whose surface finish is OSP by reflow in air, they are tested under 5V bias voltage and 85, 85%RH condition. Analysis Lab
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability. Production Floor
Five Pb-free solder alloys on two PCB surface finishes were evaluated for drop shock reliability with two different solder joint volumes (LGA and BGA). Analysis Lab
The roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon. Materials Tech
This paper shows alloy and flux properties as well as temperature cycle test results comparing SAC305 and Innolot® solder pastes. Materials Tech
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance. Analysis Lab
This article studies a new low melting temperature solder interconnect application and reliability on various product categories. Analysis Lab
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste. Materials Tech |
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