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| Reflow Soldering, Profiling | ||||||||||
| These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more. | ||||||||||
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The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated. Analysis Lab
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process? Board Talk
Board flexing has started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and share their recommendations. Board Talk
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss the most important reflow guidelines in this scenario. Board Talk
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure? Board Talk
With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting. Board Talk
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question. Board Talk
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically? Board Talk
This study investigates the evaporation of chemicals during the reflow process from preheating until cooling. Different solder pastes are compared. Analysis Lab
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow? Board Talk |
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