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| Reflow Soldering, Profiling | ||||||||||
| These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more. | ||||||||||
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Today's state of the art single-phase vapor phase provide the solutions needed for lead-free soldering and requirements for a void-less solder joint. Production Floor
The goal of this study was to identify a non-destructive method for thermocouple attachment that provides a small offset to the "actual temperature under a BGA." Analysis Lab
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be? Board Talk
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own experiences. Board Talk
This paper describes and characterizes an unusual open circuit failure mechanism in Pb-free ball grid array (BGA) solder joints. Analysis Lab
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process? Board Talk
Board flexing has started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and share their recommendations. Board Talk
This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time. Analysis Lab
This paper explores equipment that has been developed to achieve void-free joints using modern condensation reflow technology. Production Floor
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss the most important reflow guidelines in this scenario. Board Talk |
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