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Adhesives, Coating, Dispensing | ||||||||||
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This paper will focus on the comparison of pure Pd and PdP deposits and the interaction with the gold electrolyte type in use. Materials Tech
Plasma treatment increases the adhesion strength of the conformal coatings through the removal of organic contaminants and surface activation. Materials Tech
This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions. Analysis Lab
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages. Production Floor
This paper describes work carried out by Humiseal to investigate root causes of these problems, and to introduce materials with improved performance. Analysis Lab
This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing. Production Floor
To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, without compromising quality, cost, and throughput. Production Floor
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material. Materials Tech
This paper will examine examples where changes in process can change the material properties or performance of polymer composites used in semiconductor packaging and board assembly, such as adhesives and encapsulants. Materials Tech
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others. Board Talk |
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