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This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing. Production Floor
To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, without compromising quality, cost, and throughput. Production Floor
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material. Materials Tech
This paper will examine examples where changes in process can change the material properties or performance of polymer composites used in semiconductor packaging and board assembly, such as adhesives and encapsulants. Materials Tech
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others. Board Talk
This paper will focus on interconnects fabricated using the AME method. Two material sets will be used to fabricate test devices for studying interconnects. Analysis Lab
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives. Materials Tech
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their expertise. Board Talk
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process. Production Floor
Research on a prototype paste is being completed to improve reliability and survivability of PCB and SMT solder joints under extreme temperatures (< 500° Celsius). Production Floor |
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