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| Adhesives, Coating, Dispensing | ||||||||||
| These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more. | ||||||||||
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Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability. Materials Tech
In this study many coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals. Analysis Lab
Paper determines "life expectancies" as well as an extrapolated estimate of the Underwriter's Laboratories' "continuous use" temperature rating. Materials Tech
Ultra-thin fluoropolymer coatings were tested by industry approved test methods to determine whether this level of process was possible. Materials Tech
High speed transmission applications in electronic product have become a developing trend and one of the most important issue in the electronic industry. Analysis Lab
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives. Materials Tech
An electrochemical method via sequential electrochemical reduction analysis instrument to quantify the corrosion resistance of the EN deposit is proposed. Analysis Lab
This study evaluates conformal coatings for mitigation of tin whisker growth. The coatings chosen for the experiment are acrylic, polyurethane and parylene. Analysis Lab
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others. Board Talk
In this work, we have synthesized a conformal polyurethane coating consisting of hard (hexamethylene di-isocyanate) and soft (polyol) segments. Analysis Lab |
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