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The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives. Materials Tech
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their expertise. Board Talk
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process. Production Floor
Research on a prototype paste is being completed to improve reliability and survivability of PCB and SMT solder joints under extreme temperatures (< 500° Celsius). Production Floor
The properties of NiCo deposits were analyzed using field emission scanning electron microscopy (FESEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). Analysis Lab
In this paper the authors evaluate variables in the solder paste dispensing process, and review the impact on dispense quality of the solder paste. Production Floor
If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part. Materials Tech
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses. Materials Tech
This paper discusses the use of jet-dispensed SMT adhesives for increased durability, lower component cost, and new form factor printed electronics. Materials Tech
The evaluation of conformal coatings to mitigate silver sulfide corrosion of thick film resistors is discussed. Materials Tech |
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