Adhesives, Coating, Dispensing
These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.
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Managing blooming in an adhesives process
Managing blooming in an adhesives process
If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Materials Tech

Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses.
Materials Tech

Jet-Dispensed SMT Adhesives for Durable Printed Electronics
Jet-Dispensed SMT Adhesives for Durable Printed Electronics
This paper discusses the use of jet-dispensed SMT adhesives for increased durability, lower component cost, and new form factor printed electronics.
Materials Tech

Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
The evaluation of conformal coatings to mitigate silver sulfide corrosion of thick film resistors is discussed.
Materials Tech

Effect of Encapsulation Materials on Tensile Stress
Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Analysis Lab

Durable Conductive Inks for Robust Printed Electronics
Durable Conductive Inks for Robust Printed Electronics
Polymer Thick Film based printed electronics has improved in durability and is now a proven alternative to copper circuitry in many applications.
Production Floor

Liquid Dispensed Thermal Materials for High Volume Manufacturing
Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech

Hybrid Sintering for High-power Density Devices  Aerospace Applications
Hybrid Sintering for High-power Density Devices Aerospace Applications
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications.
Materials Tech

Bi-Based Solders for Low Temperature to Reduce Cost and Improve Yield
Bi-Based Solders for Low Temperature to Reduce Cost and Improve Yield
The use of BiSnbased solder paste improves the BGA solder joint yield relative to SAC based solder pastes during low temperature reflow soldering.
Materials Tech

Shelf Life Before Conformal Coating
Shelf Life Before Conformal Coating
Prior to conformal coating, how long can we keep assemblies in an open condition before they will be impacted by moisture absorption? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss the impact that this will have on their process.
Board Talk