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This paper presents the initial results from an experimental program designed to compare thermal cycling results for high-performance solder alloys using an extended dwell of 60 minutes to a typical short dwell time of 10 minutes. The 10-minute dwell data were generated in the initial phase oftesting and published previously. Analysis Lab
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability. Production Floor
Our wave solder pallets are made from Durastone. Can we use the same wave solder pallets for leaded and lead-free? Board Talk
This study reports a new near-eutectic Sn-Bi-based low-temperature solder alloy (Bi+) which can reflow between 165°C and 190°C. Materials Tech
Printed circuit board manufacturers are continually challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. Production Floor
A new methodology for solder joint reliability prediction taking into account the mechanical load as well as the thermal mismatch load between component, solder & PCB is proposed. Production Floor
Robotic soldering is a growing market. We will present how cored wires with different flux percentages will affect robotic soldering performance. Analysis Lab
Measurements of the electrical resistance of low temperature solder during current stressing were shown to provide indicators of the thickness of continuous layers of Bi accumulated at the anode. Production Floor
For this study, the authors wanted to assess the impact of different solder mask options on under component cleanliness. Analysis Lab
This paper focuses on establishing package warpage boundary conditions and identifying key process parameters for a successful LTS assembly. Production Floor |
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