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This paper presents a comparative study for three types of immersion golds used for both ENIG and ENEPIG deposits in the same production line. Analysis Lab
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening? Board Talk
The stencil aperture design has more influence on overcoming CTE mismatch between the ceramic LGA and the FR4 PCB than the reflow oven temperature profile cool down slope. Analysis Lab
This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies. Analysis Lab
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences. Production Floor
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components? Board Talk
This paper addresses methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating. Analysis Lab
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature). Production Floor
This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions. Materials Tech
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? Jim Hall and PHil Zarrow, also known as The Assembly Brothers, answer this question and share their own experiences and knowledge. Board Talk |
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