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| Soldering, Selective, Wave | ||||||||||
| These programs cover manual and automated soldering, selective soldering, wave soldering and more. | ||||||||||
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This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders. Analysis Lab
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service. Analysis Lab
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad. Analysis Lab
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question. Board Talk
It was confirmed that ENEPES with a Ag thickness of 0.3 μm had good reliability both for the solder joint and Ag sintering joint. Analysis Lab
What are the limits for the future with more complex products? HASL and the actual HASL process, hot air solder leveling, has been with us since the mid-70s. The original methodology was a vertical methodology where the board is vertically immersed in a pot of molten solder. Board Talk
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders. Analysis Lab
This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead-free assembly. Materials Tech
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions. Materials Tech
The purpose of this study is to evaluate the effect of failure criteria on the reported thermal fatigue life and find out which failure criterion can detect failure sooner. Analysis Lab |
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