Soldering, Selective, Wave
These programs cover manual and automated soldering, selective soldering, wave soldering and more.
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Component Density on Solder Joint Reliability Under Harsh Environment
Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab

Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly.
Analysis Lab

Cure for the Grape Effect
Cure for the Grape Effect
We are processing lead-free boards with large components. Our parts are showing the grape effect. What is the best solution for this?
Board Talk

Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab

Fatigue and Shear Properties of High Reliable Solder Joints
Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Analysis Lab

Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used.
Production Floor

Solder Column Attachment for Absorbing Large CTE Mismatch
Solder Column Attachment for Absorbing Large CTE Mismatch
Paper reviews commercially off-the-shelf solder columns available, including plain columns, copper wrapped columns and more.
Production Floor

Alloy Composition and Aging on the Survivability of Lead-Free Solders
Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
Analysis Lab

Position Accuracy Machines for Selective Soldering Fine Pitch
Position Accuracy Machines for Selective Soldering Fine Pitch
Selective soldering is a robust soldering process. This paper explores the different process steps and critical parameters.
Production Floor

Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
The effect of aperture shape and orientation on solder paste printing performance is analyzed using stencil thicknesses, solder paste types and manufacturers.
Analysis Lab