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The industry standard for accelerated temperature cycling, IPC-9701B, defines test conditions for characterizing solder interconnect fatigue. The document specifies a maximum cycling ramp rate of 20 °C/minute to avoid thermal shock conditions that can accelerate failure modes other than low cycle fatigue in the bulk solder. Analysis Lab
The electromigration rates and behavior of eutectic Sn-Bi alloy in planar and in BTC solder joints were compared and shown to be similar. Analysis Lab
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario. Board Talk
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used. Production Floor
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper and a .4 - .8 micron thickness on tin-nickel. Board Talk
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds. Analysis Lab
This paper discusses the results of a comparative study for solder joint performance - under shock - for ENIG and ENEPIG surface plated tester PCBs. The best cost-reduction practice for Intel manufacturing is to deliver testers with high quality and reliability. Solutions with higher margins to failure will support this goal. Analysis Lab
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints. Production Floor
This study examines challenges posed by aging, a critical factor influencing the long-term performance of solder joints. Analysis Lab
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture. Board Talk |
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