Operations, Productivity, Supply
These programs cover overall operations, plan productivity, issues with the supply chain and more.
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The Quest for Reliability Standards
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Analysis Lab

Essential Tools to Combat the Ingress of Counterfeit Materials
Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Materials Tech

High Thermal, High Temperature Interconnects for Ultra High Power LEDs
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor

Combing Automated Advanced Process Control with Feedback
Combing Automated Advanced Process Control with Feedback
This presentation will explore Industry 4.0, and then explore how Advanced Process Control (APC) can increase production yields and reduce defects.
Production Floor

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Lean Flow on the SMT Factory Floor
How can a Lean, agile SMT operation be sustained by turning existing engineering programming and planning functions "upside down"?
Production Floor

Discrete Carbon Nanotube Implementation for use in ESD Tooling
Discrete Carbon Nanotube Implementation for use in ESD Tooling
This research illustrates the improvement in volume and surface resistivity for trays and tooling fixtures manufactured usin functionalized carbon nanotubes.
Materials Tech

Value-Driven CFX Case Studies Supporting Smart Manufacturing
Value-Driven CFX Case Studies Supporting Smart Manufacturing
In this paper, two diverse examples are discussed, illustrating how the adoption of the Connected Factory Exchange (CFX) standard is changing manufacturing.
Analysis Lab

Oxide Alternative Process for High Frequency Bonding Applications
Oxide Alternative Process for High Frequency Bonding Applications
This paper highlights the challenges made with conventional Sulphuric-Peroxide based Oxide Replacement bonding enhancement system.
Analysis Lab

Cost Comparison of Complex PCB Fabrication
Cost Comparison of Complex PCB Fabrication
The authors present an alternative to sequential lamination for fabricating complex PCBs, where conductive paste is used as interconnect between cores.
Production Floor

Automation for Traceability and Reliability
Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Production Floor