Sponsor
Advanced-Interconnections

How solder ball technology can facilitate QFP device transition
Unique application of solder ball technology facilitates QFP to BGA device transition on PC boards with existing QFP pads, eliminating solder processing issues.
Advanced Interconnections Corp.
Advanced-Interconnections
Operations, Productivity, Supply
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How the Chip Shortage Reshaped the Electronics Supply Chain
How the Chip Shortage Reshaped the Electronics Supply Chain
The global chip shortage that started in 2020 sent shockwaves through the electronics manufacturing industry, disrupting production lines and forcing companies to rethink their supply chain strategies. This shortage not only delayed production but also highlighted critical vulnerabilities in the electronics supply chain.
Supply Chain

i4.0, Are We Really Ready?
i4.0, Are We Really Ready?
This paper evaluates SMT production and inspection machines and attempts to define their potential to act as ‘smart sensors’, the first building blocks towards i4.0.
Analysis Lab

High Thermal, High Temperature Interconnects for Ultra High Power LEDs
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor

Weibull Distribution and Analysis
Weibull Distribution and Analysis
This paper provides an overview of the Weibull distribution, its variables, types of data required, and interpretations that can be drawn.
Analysis Lab

Combing Automated Advanced Process Control with Feedback
Combing Automated Advanced Process Control with Feedback
This presentation will explore Industry 4.0, and then explore how Advanced Process Control (APC) can increase production yields and reduce defects.
Production Floor

The True Business Impact of IIoT Technology
The True Business Impact of IIoT Technology
Pitfalls and opportunities in IIoT solution technology, at the device level, the manufacturing execution management system layer, and enterprise business systems layer.
Analysis Lab

Discrete Carbon Nanotube Implementation for use in ESD Tooling
Discrete Carbon Nanotube Implementation for use in ESD Tooling
This research illustrates the improvement in volume and surface resistivity for trays and tooling fixtures manufactured usin functionalized carbon nanotubes.
Materials Tech

Healthcare Gaps That Only Technology Can Fill
Healthcare Gaps That Only Technology Can Fill
Digital Health is comprised of wearable, implantable technology, web and email, mobile technology, software, social networking, data management and analytics.
Analysis Lab

Automation for Traceability and Reliability
Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Production Floor

Embracing a New Paradigm: Electronic Work Instructions (EWI)
Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab

Sponsor
AI-Technology

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology
Aim-Solder