Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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What Is the Recommended Component Storage Environment?
What Is the Recommended Component Storage Environment?
What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature? The Assembly Brothers, otherwise known as Jim Hall and Phil Zarrow, share their own recommendations and suggestions.
Board Talk

How To Prevent Mid-chip Solder Balls?
How To Prevent Mid-chip Solder Balls?
Is there a mathematical calculation that can be used to predict solder balling for a given package size?
Board Talk

The Best Storage Method to Protect Against Corrosion
The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? Regardless of the methodology you use, you want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards. Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Risks Using Flux Only for Soldering BGAs
Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk

Solder Paste Printing First Pass
Solder Paste Printing First Pass
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and share their expertise.
Board Talk

Gooey Flux Residue Left Behind
Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk

Requirements for Depaneling and Rescoring Circuit Boards with BGA Components
Requirements for Depaneling and Rescoring Circuit Boards with BGA Components
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components? What are the safest, best methods for depaneling circuit board that have BGA components? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question.
Board Talk

Modify Rework Procedures for Assemblies Fabricated Using OSP?
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk

What Causes Solder Icicles During Wave Soldering
What Causes Solder Icicles During Wave Soldering
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario.
Board Talk

Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper and a .4 - .8 micron thickness on tin-nickel.
Board Talk