Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk
Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider?
Board Talk
Delay Before Cleaning Partial Assemblies
We're assembling circuit boards with a water soluble flux. Is it acceptable to leave these partially assembled boards for 3 to 4 days before finishing them? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
Problems With Starved "J" Lead Joints
We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness. What do you advise?
Board Talk
Solder Paste Transfer Efficiency - What/Why
I've heard the term transfer efficiency relating to printing. What does this term refer to? What actions impact solder paste transfer efficiency? The Assembly Brothers, Jim Hall and Phil Zarrow, address these questions.
Board Talk
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