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Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences. Board Talk
I am aware of the suggested humidity level for an electronics assembly facility. Do the same limits apply within a 100,000 class clean room? Board Talk
We are seeing field returns due to solder joint cracking on the pin of a 16-pin through-hole connector. What might be the cause of the joint cracking? Board Talk
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount? Board Talk
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question. Board Talk
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own experiences. Board Talk
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening? Board Talk
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question. Board Talk
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily. Board Talk
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints? The Asembly Brothers, Phil Zarrow and Jim Hall, discuss this question and share their advice and suggestions. Board Talk |
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