| Board Talk |
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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How To Clean a Vintage Circuit Board Assembly?
A vintage computer board is contaminated with decomposed anti-static foam. The microprocessor and other ICs have a sticky grime on the leads. The Assembly Brothers, Phil Zarrow and Jim Hall, address this situation and share their own suggestions.
Board Talk
How Frequently Should We Recheck Profiles?
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically?
Board Talk
When is it Time to Switch from Manual Assembly to Automation?
We are a new start-up assembling wireless sensors. All assembly is now manual. We are experiencing large reject rates due to hand soldering of components. The Assembly Brothers, Jim Hall and Phil Zarrow, address this situation and share their suggestions.
Board Talk
Issues With Fillets on Via Holes?
During wave solder some of the vias have concave fillets giving them a dimple effect. What can we do to create flatter fillets on via holes?
Board Talk
Questions About Handling Solder Paste
We use lead-free solder and store it at a temperature of 4 to 5 degrees Celsius. What is the best practice for prepping this stored paste before use? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and offer their suggestions.
Board Talk
Suggested Stencil Wipe Frequency?
How do we determine what is the best under stencil wipe frequency? The Assembly Brothers share their own insights and experiences on this matter.
Board Talk
How Can We Prevent Our 0201 Nozzles From Clogging?
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this situation and offer their own suggestions and advice.
Board Talk
When To Use Adhesive To Bond SMT Components
When should we use adhesive to bond SMT components to the bottom-side of a double-sided PWA before going through reflow soldering?
Board Talk
Is There a Limit to the Step in a Step Stencil?
I've seen a problem with the 3-mil step. Is there a rule of thumb regarding the amount of step that can used in a step stencil? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this scenario and offer their advice.
Board Talk
PCBA Inspection Concerns
We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side?
Board Talk
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