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Board Talk | ||||||||||
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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A vintage computer board is contaminated with decomposed anti-static foam. The microprocessor and other ICs have a sticky grime on the leads. The Assembly Brothers, Phil Zarrow and Jim Hall, address this situation and share their own suggestions. Board Talk Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically? Board Talk We are a new start-up assembling wireless sensors. All assembly is now manual. We are experiencing large reject rates due to hand soldering of components. The Assembly Brothers, Jim Hall and Phil Zarrow, address this situation and share their suggestions. Board Talk During wave solder some of the vias have concave fillets giving them a dimple effect. What can we do to create flatter fillets on via holes? Board Talk We use lead-free solder and store it at a temperature of 4 to 5 degrees Celsius. What is the best practice for prepping this stored paste before use? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and offer their suggestions. Board Talk How do we determine what is the best under stencil wipe frequency? The Assembly Brothers share their own insights and experiences on this matter. Board Talk We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this situation and offer their own suggestions and advice. Board Talk When should we use adhesive to bond SMT components to the bottom-side of a double-sided PWA before going through reflow soldering? Board Talk I've seen a problem with the 3-mil step. Is there a rule of thumb regarding the amount of step that can used in a step stencil? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this scenario and offer their advice. Board Talk We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side? Board Talk |
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