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We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture. Board Talk
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions. Board Talk
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant? Board Talk
Is there a way to estimate the potential failure rate introduced by hand rework on one SMT part? Phil Zarrow and Jim Hall, also known as The Assembly Brothers, offer their own expertise and experience when answering this question. Board Talk
Our wave solder pallets are made from Durastone. Can we use the same wave solder pallets for leaded and lead-free? Board Talk
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario. Board Talk
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be? Board Talk
We have an operational circuit board that was accidentally exposed to rainwater for a few hours. Is there a greater likelihood of failure? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question and share their expertise in the industry. Board Talk
We recently reworked a BGA component and the corners all bridged. Can these components be removed and reused if we remove the warp? Board Talk
An operator attempted to repair three damaged conductors using bus wire overcoated with epoxy. Do you consider this repair acceptable? Board Talk |
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