| Board Talk |
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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Component Moisture Question?
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own experiences and expertise.
Board Talk
What is the IPC Definition for Uncommonly Harsh?
IPC 610 defines class three to include products where the end use environment may be uncommonly harsh. How is uncommonly harsh defined?
Board Talk
How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their expertise.
Board Talk
Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk
Demise of the Plated-Through Hole?
How long will the industry continue to use through hole components? I can envision connectors being used for some time, what about component types? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question.
Board Talk
Assembling Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two?
Board Talk
Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? Jim Hall and PHil Zarrow, also known as The Assembly Brothers, answer this question and share their own experiences and knowledge.
Board Talk
5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk
Problem Meeting Minimum Hole Fill During Wave Soldering
We are having problems achieving the minimum hole fill of 75% on electrolytic capacitors using our wave soldering. What do you suggest? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question and share their own advice.
Board Talk
BGA Components and Coplanarity
We have a PCB with a HASL surface finish, the assembly includes a 256 ball BGA. The component balls are .6 mm pitch. Is coplanarity a concern?
Board Talk
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