Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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Larger Stencil Apertures and Type 4 Paste
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints? The Asembly Brothers, Phil Zarrow and Jim Hall, discuss this question and share their advice and suggestions.
Board Talk

What is the IPC Definition for Uncommonly Harsh?
What is the IPC Definition for Uncommonly Harsh?
IPC 610 defines class three to include products where the end use environment may be uncommonly harsh. How is uncommonly harsh defined?
Board Talk

Component Moisture Question?
Component Moisture Question?
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own experiences and expertise.
Board Talk

Causes of Blowholes
Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk

How To Verify Cleanliness After Rework and Prior to Re-coating?
How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their expertise.
Board Talk

Assembling Boards with BGAs on Both Sides
Assembling Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two?
Board Talk

Demise of the Plated-Through Hole?
Demise of the Plated-Through Hole?
How long will the industry continue to use through hole components? I can envision connectors being used for some time, what about component types? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question.
Board Talk

5 vs 8-Zone Ovens
5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk

Simple Test for Flux Penetration
Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? Jim Hall and PHil Zarrow, also known as The Assembly Brothers, answer this question and share their own experiences and knowledge.
Board Talk

BGA Components and Coplanarity
BGA Components and Coplanarity
We have a PCB with a HASL surface finish, the assembly includes a 256 ball BGA. The component balls are .6 mm pitch. Is coplanarity a concern?
Board Talk