Authored By:
Kai Hollstein and Kirsten Weide-Zaage
Institute for Microelectronic Systems
Hannover, Germany
Summary
A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper. Starting with a description about the trends in miniaturization of IC packaging and the demand for heterogeneous integration in the following a focus on commonly applied processes like System-on-Chip, Flip-Chip packaging, Fan-out packaging and 3D-Integration will be presented. A brief explanation about process characteristics, followed by an explanation of the main process steps is described. The latest version of the heterogeneous integration roadmap is short introduced.
The link to corresponding fields of application like high performance computing and AI processing, mobile electronics and 5G, and automotive is given. Here, main requirements for each technological sectors are worked out followed by a description of
commonly applied package types. Each sector is round up by mentioning key challenges for future developments.
Conclusions
The demand for further miniaturization of electronic packaging has been introduced. The two approaches “More Moore” and “More than Moore” have been revised. The packaging landscape for further heterogeneous integration has been laid out. Key process technologies (Flip-Chip technology, System-on-Chip, System-in-Package, Fan-out packaging, and 3D integration) have been introduced and their main process steps have been described.
Based on that, the heterogeneous integration roadmap was introduced. In the last section, advanced packaging technologies for some of the technological drivers were explained. High performance computing is mainly limited by DRAM processing speed so that processor and memory have to be assembled as close together as possible. Therefore, Si interposers are commonly applied but are comparably cost intense. Development focus is mainly put on finding cost efficient alternatives with high reliability.
Smartphone technology is mainly about integrating electronics on a footprint as small as possible. Currently, PoP technology is commonly applied. First manufacturers already moved to Fan-out packaging for even higher integration. 5G packaging comes with many technological challenges. Advantageous for both, Antenna on Chip and Antenna in Package have been stated. When it comes to packaging for automotive, the integration of numerous sensors, processing of the data and the demanding reliability requirements of this industry are the biggest challenges to tackle.
Initially Published in the SMTA Proceedings
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