New Approaches to Develop a Scalable 3D IC Assembly Method
Testing PCBs for Creep Corrosion
Embedded Fibers Enhance Nano-Scale Interconnections
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
Final Finish Specifications Review
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Vapor Phase Quality Improvement
The Quest for Reliability Standards
Latest Industry News
Future Manufacturing: Bracing for and Embracing the Postpandemic Era
China's digital yuan could pose challenges to the U.S. dollar
Intel's planned comeback: 10nm production now surpassing 14nm, 7nm remains a work in progress
Apple said to be testing a new external display with a dedicated A13 Bionic SoC
3 Tips for Making Supply Chain Management More Sustainable
Smartphones Could Be Next in Global Chip Shortage
Electrical Slip Ring, All You Need to Know
Why Manufacturers Will Embrace Surface-Mount Tech--Sooner or Later

Liquid Dispensed Thermal Materials for High Volume Manufacturing

Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech


Authored By:

Dr. Sanjay Misra
Sr. Scientific Principal, Adhesive Technologies, Henkel Corporation
18930 W 78th Street, Chanhassen, MN 55317, USA


Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected keeping in mind both performance as well as economics viability. With higher volumes of various device designs, automated manufacturing and adaptable materials are also critical factors is the price-performance equation. Uniquely, liquid dispensed thermal interface materials (TIMs) are an optimal approach to address this convergence of high performance and cost-competitive manufacturing.

Adaptable attributes – such as curable or non-reactive – make liquid TIM materials well-suited for a variety of applications. This paper presents the basic science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently, and illustrates the relationship between material properties, performance and manufacturing compatibility. Fundamental differences between solid, pad-like materials and unfilled liquids will be highlighted.


While the specification of TIM performance is driven by electronic design, one must also optimize manufacturing. Liquid TIMs offer not only better thermal performance, due to lower modulus during assembly and better wet out, but also allow increased manufacturing efficiencies. Better inventory management, automation optimization and quality control are possible with liquid TIMs, which are available in several formats to address both performance and manufacturing attributes. For the successful startup of a line, attention must be paid to storage, handling and dispensing these materials due to the particulate filler. These issues should be collectively addressed by TIM manufacturers, equipment manufacturers and the end user. There are several technically and economically viable solutions for automated dispensing of liquid TIMs on the market.

Initially Published in the SMTA Proceedings


No comments have been submitted to date.

Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name

Your Company
Your E-mail

Your Country
Your Comments

Board Talk
Moisture Barrier Bag Issues
Trouble With Skewed DPAK Components
Can Mixing Wave Solder Pallets Cause Contamination?
How to Reduce Voiding on QFN Components
Calculating Failure Rate During Rework
Do BGA Components Warp During Reflow?
Can Water Contamination Cause Failure?
Why Uneven Conformal Coating?
Ask the Experts
ENIG Solderability Issues
Very Low Temp PCBs
0201 Pick & Place Nozzle Plugging
IPC-A-610 Class 3 - IPC-A-600 Class 2
BGA Solder Ball Collapse
Baking After Cleaning Hand Placed Parts
What is the IPC Definition of Uncommonly Harsh?
Solder Balling Splash After Reflow