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This paper will present scenarios where environmental factors played a role in inducing various degradation mechanisms to Rockwell products. The paper will attempt to concentrate on the unusual scenarios, or where assumptions were made too early in the analytical process that likely hindered efficient determination of root cause. Analysis Lab
Since Multi-Layer Printed Circuit Boards with holes appeared, the processes making holes conductive have played critical roles to achieve MLB’s function. Production Floor
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks. Technology Briefing
In this work, we further discuss solderability and mechanical reliability of a novel low temperature proprietary alloy (generically called as X46). Materials Tech
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications. Production Floor
The survivability of 0.4mm pitch and 0.5mm pitch parts at acceleration levels upto 50,000g have been studied for bare test boards. Analysis Lab
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences. Board Talk
This paper presents an examination of three low temperature solders and provides a comparison with tin-silver-copper solder. Materials Tech
Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste. Technology Briefing
The cleanliness of high-reliability assemblies has become more critical for the product’s performance in the field. Production Floor |
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