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A vintage computer board is contaminated with decomposed anti-static foam. The microprocessor and other ICs have a sticky grime on the leads. The Assembly Brothers, Phil Zarrow and Jim Hall, address this situation and share their own suggestions. Board Talk
This paper describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing. Production Floor
Microchips with tiny clocks hold the key to future computing security, a system that is resistant to attacks, and also inexpensive, convenient, and scalable. Technology Briefing
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods. Analysis Lab
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex. Materials Tech
The need to implement a tin whisker mitigation strategy has led to applying conformal coating over no clean residues. Production Floor
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users. Analysis Lab
When should we use adhesive to bond SMT components to the bottom-side of a double-sided PWA before going through reflow soldering? Board Talk
This paper describes the development and testing procedure of a new lead-free low melting point alloy. Materials Tech
Ride-hailing applications, electric propulsion technology and a new generation of avionics suddenly awakened commercial interest from companies. Technology Briefing |
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