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What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints? The Asembly Brothers, Phil Zarrow and Jim Hall, discuss this question and share their advice and suggestions. Board Talk
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature). Production Floor
In a study recently published, engineers lay out the conceptual design for a system that can efficiently produce “solar thermochemical hydrogen.” Technology Briefing
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds. Analysis Lab
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates. Materials Tech
A model was developed to simulate the delamination behavior of multilayer PCBs assembled with BGA components reinforced with an underfill epoxy adhesive. Production Floor
There has been an increasing number of reports concluding that stacked micro vias are failing preferentially when compared to an alternative staggered via design. Analysis Lab
IPC 610 defines class three to include products where the end use environment may be uncommonly harsh. How is uncommonly harsh defined? Board Talk
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment. Materials Tech
In a new study, researchers identify a potentially game-changing remedy: seamlessly implementing 3D integration with 2D materials. Technology Briefing |
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