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We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own experiences and expertise. Board Talk
This paper gives detailed information of catalyst systems designed and implemented in SMD production lines to reduce pollution of process gasses. Production Floor
Muscle-powered robotic is energy efficient. It can also perform high jumps and fast movements as well as detect and react to obstacles without complex sensors. Technology Briefing
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography. Analysis Lab
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials. Materials Tech
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed. Production Floor
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented. Analysis Lab
IPC 610 defines class three to include products where the end use environment may be uncommonly harsh. How is uncommonly harsh defined? Board Talk
Solder powder size, flux chemistry, stencil aperture, stencil surface technology, reflow process, and more are investigated. Materials Tech
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded. Technology Briefing |
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