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Big Problems with HASL Finish
Big Problems with HASL Finish
We are able to lift a SOIC off a PCBA using tweezers and no heat. The pads are bare copper, the PCB was manufactured using tin lead HASL finish. The Assembly Brothers, Phil Zarrow and Jim Hall, share their own experiences.
Board Talk

Embedded Components from Concept-To-Manufacturing
Embedded Components from Concept-To-Manufacturing
Use of embedded components has grown significantly in the defense, aerospace, telecommunications, medical and consumer markets.
Production Floor

3D-Printed Concrete Revolutionizes Home Building
3D-Printed Concrete Revolutionizes Home Building
Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste.
Technology Briefing

Effects of Substrate Material and Package Pad Design on Solder-Joint Reliabilty
Effects of Substrate Material and Package Pad Design on Solder-Joint Reliabilty
This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications.
Analysis Lab

Alternative Solvent with Low Global Warming Potential
Alternative Solvent with Low Global Warming Potential
A new low global warming potential fluorinated solvent for precision cleaning is discussed. The paper covers the properties and performance.
Materials Tech

Risk and Solution for No-Clean Flux Not Dried Under Components
Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor

Evaluation of High Speed Plating for Copper Post with Flat Top Shape
Evaluation of High Speed Plating for Copper Post with Flat Top Shape
In developing high-speed electro “copper post” plating bath the shape of the post and the uniformity of the post height throughout the wafer were considered.
Analysis Lab

Solder Paste Inspection - When and Why
Solder Paste Inspection - When and Why
Our facility is considering a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one?
Board Talk

Bi-Based Solders for Low Temperature to Reduce Cost and Improve Yield
Bi-Based Solders for Low Temperature to Reduce Cost and Improve Yield
The use of BiSnbased solder paste improves the BGA solder joint yield relative to SAC based solder pastes during low temperature reflow soldering.
Materials Tech

The Biggest Barrier to a Robotics Revolution
The Biggest Barrier to a Robotics Revolution
Experts believe robots will be able to cost-effectively perform a large share of physical tasks which, until now, have been performed only by humans.
Technology Briefing