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The industry standard for accelerated temperature cycling, IPC-9701B, defines test conditions for characterizing solder interconnect fatigue. The document specifies a maximum cycling ramp rate of 20 °C/minute to avoid thermal shock conditions that can accelerate failure modes other than low cycle fatigue in the bulk solder. Analysis Lab
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. Production Floor
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded. Technology Briefing
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA. Analysis Lab
This paper will focus on the comparison of pure Pd and PdP deposits and the interaction with the gold electrolyte type in use. Materials Tech
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology. Production Floor
With high frequency and high-speed transmission in information industry, PCB customers demand stricter signal transmission integrity of PCB. Analysis Lab
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards? Board Talk
Advancements in metal patterning have improved the effectiveness of metal TIMs by improving their compressibility. Materials Tech
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks. Technology Briefing |
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