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This paper presents the initial results from an experimental program designed to compare thermal cycling results for high-performance solder alloys using an extended dwell of 60 minutes to a typical short dwell time of 10 minutes. The 10-minute dwell data were generated in the initial phase oftesting and published previously. Analysis Lab
This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing. Production Floor
Experts believe robots will be able to cost-effectively perform a large share of physical tasks which, until now, have been performed only by humans. Technology Briefing
This paper studies the process-performance-reliability relationships for Sn-Bi-Ag and Sn-In solders on additively printed copper metallization. Analysis Lab
Lower-temperature paste can be reflowed under a relatively lower peak temperature profile and outperform SAC305 paste in the current WLP256 application. Materials Tech
A technique called hydrogen evolution assisted electroplating, has shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods. Production Floor
This paper compared these three environments in terms of how well they characterize conformal coatings. Analysis Lab
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant? Board Talk
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard. Materials Tech
Robotic systems can perform experiments without fatigue, speeding up research. Robots execute experimental steps with greater consistency than humans. As explained recently in the journal Science Robotics, robots are rapidly, "Transforming Science Labs into Automated Factories of Discovery." Technology Briefing |
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