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We are able to lift a SOIC off a PCBA using tweezers and no heat. The pads are bare copper, the PCB was manufactured using tin lead HASL finish. The Assembly Brothers, Phil Zarrow and Jim Hall, share their own experiences. Board Talk Use of embedded components has grown significantly in the defense, aerospace, telecommunications, medical and consumer markets. Production Floor Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste. Technology Briefing This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications. Analysis Lab A new low global warming potential fluorinated solvent for precision cleaning is discussed. The paper covers the properties and performance. Materials Tech In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. Production Floor In developing high-speed electro “copper post” plating bath the shape of the post and the uniformity of the post height throughout the wafer were considered. Analysis Lab Our facility is considering a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one? Board Talk The use of BiSnbased solder paste improves the BGA solder joint yield relative to SAC based solder pastes during low temperature reflow soldering. Materials Tech Experts believe robots will be able to cost-effectively perform a large share of physical tasks which, until now, have been performed only by humans. Technology Briefing |
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