ProgramsWe have over 1000 programs in this database. |
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Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question. Board Talk
This paper defines a process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly. Production Floor
The 6th generation of mobile communications promises higher data rates, shorter latency, and increased densities of terminal devices.. Technology Briefing
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints. Analysis Lab
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies. Materials Tech |
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