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With the help of AI we hope to ease the workload of engineering and operation teams while also improving labor cost, efficiency, and product quality. After reviewing the four AI use cases presented in this paper, it is very apparent the overwhelming benefit AI can have with our AOI process and programs. Production Floor
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors. Production Floor
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks. Technology Briefing
This paper will outline the board-level assembly development and reliability that was undertaken to demonstrate this WLCSP could meet the demands of automotive. Analysis Lab
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability. Materials Tech
The manufacturing process challenges faced by electronics manufactures producing large panels of small boards is discussed. Production Floor
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality. Analysis Lab
Is there a way to estimate the potential failure rate introduced by hand rework on one SMT part? Phil Zarrow and Jim Hall, also known as The Assembly Brothers, offer their own expertise and experience when answering this question. Board Talk
In this work, thermal performance of five Sn/3.2Ag/0.7Cu/xSb (x is in the range of 4.5 to 6.5 wt.%) alloys were compared to select the optimized Sb content. Materials Tech
Imagine a portable 3D printer you could hold in your palm. The tiny device could enable a user to rapidly create customized, low-cost objects on the go. Technology Briefing |
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