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Component Moisture Question?
Component Moisture Question?
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Phil Zarrow and Jim Hall, The Assembly Brothers, dicsuss this scenario and offer their suggestions.
Board Talk

Combing Automated Advanced Process Control with Feedback to Revolutionize the Printed Circuit Board Assembly Process
Combing Automated Advanced Process Control with Feedback to Revolutionize the Printed Circuit Board Assembly Process
This presentation will explore Industry 4.0, and then explore how Advanced Process Control (APC) can increase production yields and reduce defects.
Production Floor

The Tumultuous Birth of Our New Golden Age
The Tumultuous Birth of Our New Golden Age
Per capita income and quality of life rise, during Techno-Economic Revolutions. Each wave was enabled by a general-purpose breakthrough technology.
Technology Briefing

Reliability of No-clean and Water-soluble Solder Pastes
Reliability of No-clean and Water-soluble Solder Pastes
The purpose of this paper is to highlight the differences between these two families of solder pastes to guide users in their choice.
Analysis Lab

Design and Fabrication of Ultra-Thin Flexible Substrate
Design and Fabrication of Ultra-Thin Flexible Substrate
This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
Materials Tech

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