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From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this situation and offer their own suggestions. Board Talk
Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations. Production Floor
Automation with biology and chemistry to create a farming revolution which enabled a fraction of the population to deliver more than had formerly produced. Technology Briefing
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders. Analysis Lab
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys. Materials Tech
This paper showcases a new stencil process that was discovered by reverting to the basics. Production Floor
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users. Analysis Lab
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness? Board Talk
Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability. Materials Tech
Robotic arms handle repetitive and precision movements. This change relieves operators of mundane work. They must adjust to the new work environment. Technology Briefing |
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