Fill the Void II: An Investigation into Methods of Reducing Voiding
Wettable-Flanks On Bottom-Termination Components in Mass Production
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
Investigation into Lead-Free Low Silver Solder Wire for Electronics
Effects of Composition and Isothermal Aging on Microstructure Performance
How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Wearable Electronics & Big Data = High Volume, High Mix SMT
Evaluation of Molded Flip-chip BGA Packages
Latest Industry News
Foxconn Raises Bonus for New Assembly Line Workers
BMW pushes ahead with hydrogen-tech vehicle
How China turned a prize-winning iPhone hack against the Uyghurs
Foxconn sees increased April revenues
Supply chain, what it is and how it works
Vendors to Watch in Performance Testing Tools
Useful Waste: Rethinking Computing in the GPU Era
IBM Introduces the World's First 2-nm Node Chip

Hand Printing using Nanocoated and other High End Stencil Materials

Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing.
Production Floor


Authored By:

Bob Wettermann - BEST Inc


There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.


The solder paste printing process is the area of the SMT assembly process where the greatest strides in improvement can be made with respect to yield. This is especially true in the case where several inputs to the manual printing process, are not controlled as in a machine-controlled printing process.

The high tension advanced stainless steel material provided the best release characteristics across all aperture sizes compared to the standard nickel-content small grain structure stainless steel. In addition, the printing volume was more consistent using this higher grade material. All the high tension material results were better than the high nickel content stainless steel stencils.

The addition of a nanocoating to the high nickel content stainless steel stencil did generally bring about higher print volume compared to an uncoated stencil. This was especially true of the thinner 3 mil stencil. However the consistency of the printing was lessened by the addition of a nanocoating for the thinner stencil.

Finally, it was demonstrated that each type of nanocoating material needs to be evaluated and confirmed for the manual printing process. In this study the nanocoating 1 material outperformed the nanocoating 2 material.

The higher grade high tension material had the best overall printing performance using a manual SMT printing process.

Initially Published in the IPC Proceedings


No comments have been submitted to date.

Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name

Your Company
Your E-mail

Your Country
Your Comments

Board Talk
Cure for the Grape Effect
Removing Warpage from PCBAs
Solder Paste Inspection - When and Why
Predicting Mid-Chip Solder Balling
Will Typical No Clean Paste Pass an SIR Test?
How Do You Remove Oxidation from PCBs?
Consensus for Baking Prior to Rework?
How Many Fiducials Per Stencil
Ask the Experts
Hand Soldering at Low Temperature
Question About Dry Storage of PCBA's
Baking Concerns for Stacked Trays of Components
Two Year Component Date Code Mandate
Assembly Question for Soldering USB Connectors
Tough Hand Soldering Problem
Challenges with 01005 Components
What Is Causing Connectors to Bow?