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Control of the Underfill of Surface Mount Assemblies
Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA
Intermetallic Compounds in Solder Alloys: The Common Misconception
Returning to Basics in the SMT Screen Printing Process
Final Finish Specifications Review
Evaluation and Qualification of Reworkable Underfill Materials
Leadless Flip Chip PLGA for Networking Applications
The Quest for Reliability Standards
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Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech
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Authored By:
John Coonrod, Rogers Corporation
Initially Published in the IPC Proceedings
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