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Research
Reliability of Critical Assemblies When Implementing a New Cleaning
Solid-State Diffusion between Rolled Cu and Electroplated Matte-Sn System
Development and Testing of a Lead-Free Low Melting Point Alloy
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
Testing PCBs for Creep Corrosion
A Novel Conformal Back-Up Material
Soldering Immersion Tin
Influence of Via Stub Length and Antipad Size
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Real or Fake? The Counterfeit Chip Conundrum
Today, many feel that counterfeiting is the number one issue that threatens the electronics supply chain. How big is the problem?
Supply Chain
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Authored By:
Hal Rotchadl
Premier Semiconductor Services
Tempe, AZ, USA
Initially Published in the IPC Proceedings
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