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Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations. Production Floor This paper showcases a new stencil process that was discovered by reverting to the basics. Production Floor Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications. Production Floor Since Multi-Layer Printed Circuit Boards with holes appeared, the processes making holes conductive have played critical roles to achieve MLB’s function. Production Floor This paper outlines rework processes for many challenging components including BGA, QFN/BTC, and LED packages. Production Floor This paper focuses on one emerging DW approach, Aerosol Jet Printing, as a non-contact method to print fine features using different materials over various surfaces. Production Floor This paper discusses the influence of the PCB design parameters, PCB materials, and PCB lamination process on PCB warpage. Production Floor In this paper, we will discuss various assembly options and the challenges posed by each. Production Floor This paper discusses rework challenges including identification of the key technical process, outlining efforts aimed at addressing these new challenges. Production Floor The authors demonstrate how to produce a capacitive sensor system on three millimeter window glass by combining the piezo-jet technology and a pick-and-place system. Production Floor |
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