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Reduce Pollution of Process Gasses in an Air Reflow Oven
Reduce Pollution of Process Gasses in an Air Reflow Oven
This paper gives detailed information of catalyst systems designed and implemented in SMD production lines to reduce pollution of process gasses.
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The Development of Hybrid Therma-EMI Solutions for Electronics
The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
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Assembly and Reliability of a Novel High Density Dual Row MaxQFP
Assembly and Reliability of a Novel High Density Dual Row MaxQFP
The paper focuses on all aspects of SMT assembly of the MaxQFP. The robustness of the assembly in automotive type board-level thermal cycling will be demonstrated.
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Jetting Conductive Adhesives with Silver Coated Polymer Particles
Jetting Conductive Adhesives with Silver Coated Polymer Particles
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing.
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Engineered Tin-Copper Alloys in Selective Soldering
Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
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Assembly Optimization for Thin Flip-Chip Chip-Scale Packages
Assembly Optimization for Thin Flip-Chip Chip-Scale Packages
A robust board assembly recipe is demonstrated for thin FCCSP packages with reflow warpage values of up to 110μm or higher.
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The Dynamics of Low Stress Epoxy Curing
The Dynamics of Low Stress Epoxy Curing
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature).
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Design for Testability to Overcome Functional Board Test Complexities
Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
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A New Line Balancing Method
A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
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Strain During Press Fit Connector Insertion in PCB Assembly
Strain During Press Fit Connector Insertion in PCB Assembly
Locations closer to the insertion site experienced the highest level of strain, which progressively decreased further from the insertion location.
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