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This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders. Analysis Lab
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users. Analysis Lab
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods. Analysis Lab
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service. Analysis Lab
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad. Analysis Lab
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated. Analysis Lab
It was confirmed that ENEPES with a Ag thickness of 0.3 μm had good reliability both for the solder joint and Ag sintering joint. Analysis Lab
This research is to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. Analysis Lab
Chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and material properties were documented. Analysis Lab
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders. Analysis Lab |
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