| Analysis Lab |
|
|
|
|
|
|
Cavity Board SMT Assembly Challenges
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success.
Analysis Lab
Healthcare Gaps That Only Technology Can Fill
Digital Health is comprised of wearable, implantable technology, web and email, mobile technology, software, social networking, data management and analytics.
Analysis Lab
The Sir Reliability of Fine Pitch QFN Components Under Harsh Condition
A variety of dummy QFNs are assembled on PCBs whose surface finish is OSP by reflow in air, they are tested under 5V bias voltage and 85, 85%RH condition.
Analysis Lab
Room Temperature Fast Flow Reworkable Underfill for LGA
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate.
Analysis Lab
Solder Composition, Surface Finish and Solder Joint Volume on Drop Shock Reliability
Five Pb-free solder alloys on two PCB surface finishes were evaluated for drop shock reliability with two different solder joint volumes (LGA and BGA).
Analysis Lab
Protocol Development for Testing Solder Reliability
This paper updates progress in the development of methods for investigating solder joint reliability in a combined environment of vibration and thermal cycle testing.
Analysis Lab
Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab
Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab
Electrochemical Reliability as a Function of Component Standoff
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance.
Analysis Lab
Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Analysis Lab
|
|
