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This paper will present scenarios where environmental factors played a role in inducing various degradation mechanisms to Rockwell products. The paper will attempt to concentrate on the unusual scenarios, or where assumptions were made too early in the analytical process that likely hindered efficient determination of root cause. Analysis Lab
The survivability of 0.4mm pitch and 0.5mm pitch parts at acceleration levels upto 50,000g have been studied for bare test boards. Analysis Lab
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes. Analysis Lab
This case study considers the effects of PCB pad design, stencil aperture design, the flux formulation in the assembly of 0201 BTC diodes using high temperature lead free solder. The study recommends the consideration of supplier recommended pad designs for 0201 BTCs. Analysis Lab
This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. Analysis Lab
We have categorized together 10 of the best software tools for PCB outlook for electronics engineers – to buy you time while you are working on your projects. Analysis Lab
Bismuth (Bi)-containing solder alloys have emerged as prime candidates to replace traditional lead (Pb)-free alloys such as SAC 305 (Sn-3.0Ag-0.5Cu). Analysis Lab
The Valley, synonymous with semiconductors, personal computers, and software, was a hub for innovation before the rise of personal computing, or even the transistor. Analysis Lab
Dip soldering remains a common attachment method due to its simplicity, robustness, uniformity and low cost for a number of applications. Analysis Lab
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed. Analysis Lab |
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