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A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography. Analysis Lab
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented. Analysis Lab
This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies. Analysis Lab
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging Analysis Lab
The iNEMI Connector Reliability Test Recommendations team recommends work to define test conditions to evaluate the expected degradation of connectors under the stress levels. Analysis Lab
This paper addresses methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating. Analysis Lab
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages. Analysis Lab
The diameter, length, and aspect ratio of the Cu core columns and how to optimize the dimensions of the Cu core column is discussed. Analysis Lab
This paper discusses individual process step validation methods with real examples of improvement that contribute to defect per million opportunities (DPMO) reduction. Analysis Lab
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated. Analysis Lab |
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