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The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized. Analysis Lab
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator. Analysis Lab
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly. Analysis Lab
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components. Analysis Lab
The paper reports the results of the iNEMI creep corrosion qualification test and compares them to the first round robin test and recent mixed-flowing gas test results. Analysis Lab
NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes. Analysis Lab
Interconnection technology is capable for resistant joints for SMT components, bigger dies, like MOSFETs or IGBTs and even large area substrates, like baseplate or heat sinks. Analysis Lab
With tools to model a large quantity of products and the impact of SMT line configurations, an electronics assembly plant can be analyzed to identify improvement opportunities. Analysis Lab
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site. Analysis Lab
This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications. Analysis Lab |
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