Technical Papers
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
2D SPI and a 2D AOI now integrated in your SMT Production Machine
Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes
An Essential Guide to Optimize Selective Soldering Processing
Is My Printed Circuit Board Wash Concentration in Check?
Ultraminiature Soldering: Techniques, Technologies, and Standards
X-Ray Inspection Verifies Quality of Complex PCBs
Cold Underfill Component Removal
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Prismark's 30-Year Perspective of the Electronics Industry
With wearable device demand declining, Samsung lays out plans to boost sales
Acer targets booming Indian smartphone market with white-label strategy
U.S.-China Tech War Likely to Escalate, Analysts Say
How to Overcome the Challenges of Remote Work in the Professional Services Industry
MORE INDUSTRY NEWS
July 18, 2024
Seeking Alternatives to Solvent Cleaning
Seeking Alternatives to Solvent Cleaning
We are using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene. Phil Zarrow and Jim Hall, The Assembly Brothers, offer their suggestions.
Board Talk
Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly
Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable.
Production Floor
Implementing 3D Integration with 2D Materials
Implementing 3D Integration with 2D Materials
In a new study, researchers identify a potentially game-changing remedy: seamlessly implementing 3D integration with 2D materials.
Technology Briefing
Reliability in Low Temperature Soldering for BGA Components
The adoption of LTS presents compatibility challenges. This study explores the reliability of different ball-paste combinations for LTS soldering.
Analysis Lab
Copper Dissolution Testing Report for the Selected Pb-free Solder Alloys
Copper Dissolution Testing Report for the Selected Pb-free Solder Alloys
This paper describes the approach for measuring the copper dissolution rates of five Pb-free solder alloys.
Materials Tech
Electroplated Copper Filling of Through Hole Influence of Hole Geometry
The through hole fill technology and factors that affect performance such as substrate thickness and through hole diameter will be presented.
Production Floor
Measuring Copper Surface Roughness for High Speed Applications
This paper examines the use of light interferometry and the relevant parameters used to measure copper surface roughness before and after oxide alternative.
Analysis Lab
Long Term Component Storage
Long Term Component Storage
We need to store SMD components for at least 10 years. What do you recommend for a humidity and temperature settings?
Board Talk
Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Under pressure-less sintering conditions silver sintering pastes for different sized die attachment to form robust silver joints have been developed.
Materials Tech
Robots Begin to Develop Common Sense Knowledge
Robots Begin to Develop Common Sense Knowledge
MIT engineers are working to give robots a bit of “common sense” when faced with situations that push them off their trained paths.
Technology Briefing
Panel Level Packaging
In this paper a wide variety of technologies are described that allow the generation of maximum miniaturized microsystems or SiPs.
Production Floor
A Model for Life of SnAgCu Solder Joints
Almost all reliability assessment is focused on the anticipated life in service. The question, how large a cycling temperature range is required for a model to apply.
Analysis Lab
The Ink Spitting Autowriter
The Ink Spitting Autowriter
A factory was testing a new auto writing system. It went haywire when a big fork truck passed by. What was causing this?
Mysteries of Science
Low Temperature Solder Hybrid Solder Joint Time Dependent Behavior
This paper will review a model to illustrate the source of “ball drift” and will report empirical results from testing designed to confirm the mechanism.
Production Floor
Real-World Implementation of Robotic Exoskeletons
Real-World Implementation of Robotic Exoskeletons
Research represents a step toward real-world implementation of robotic exoskeletons designed to help humans with walking and physically demanding work.
Technology Briefing
Enhance the Shock Performance of Ultra-Large BGA Components
A study on the rubber standoffs and gaskets. The effectiveness of rubber standoffs and rubber gaskets as shock/vibration mitigation have been evaluated.
Analysis Lab
New Phosphorus-based Curing Agents for PWB
New Phosphorus-based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials.
Materials Tech
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor
Board Talk
Seeking Alternatives to Solvent Cleaning
Long Term Component Storage
Solder Boards Not Holding Up to Shock Testing
Has My Flux Expired?
Common PCB Design Decisions that Cause Manufacturing Problems
Processing Circuit Boards with BGAs On Both Sides
Dross Contamination After Selective Soldering
What is the Life Span of a Profile Board?
MORE BOARD TALK
Questions and Comments
What is the Life Span of a Profile Board?
The typical lifespan of a profile board, which is used ...
Mohammed Imtiaz uddin, napino auto and electronics ltd.
How Frequently Should We Recheck Profiles?
The recommended frequency for rechecking reflow oven profiles can vary ...
md imtiaz, Napino
Adding OSP to Pads that are Missing ENIG Plating Process
Basically, the board shop is clearly unreliable, and the product ...
Jaye Waas, Renkus-Heinz
MORE COMMENTS
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