Electronics Manufacturing and Electronics Assembly

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Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Mixed MSL Baking

Automatic Insertion Causing Plated Hole Damage

MSD Components Baked Too Long

Adhesion Problems with Conformal Coating

Reliability of Automated Soldering vs. Hand Soldering

Frequency of Checking Solder Paste Viscosity

Challenging Cleaning Problem

Profiling for Double Sided BGA

MORE ASK THE EXPERTS

December 23, 2025

Predicting the Reliability of Package-On-Package Interconnections
Package-on-package technologies are being considered to reduce the size, weight, and power of military, space, and satellite electronics.
Technical Paper

No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Sponsor

Malcom Paste Mixers
Unlike hand mixing, the Malcom SPS Solder Paste Mixer is a non-contaminating mixer which utilizes pseudo planetary motion to stir the solder paste. The SPS-1 provides uniform consistency.
Seika

Additive Manufacturing Printed Circuit Board Assembly Processes
Utilizing 3D printing, the design process can be shortened and the manufacturing of the jigs and fixtures can replace the cost and lead time of traditional manufacturing.
Technical Paper

Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications.
Technical Paper

Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
This study was designed to investigate the efficiency of the rinse cycle using both a spray-in-air batch and inline cleaner.
Technical Paper

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Technical Paper

Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

Sponsor

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

2D X-Ray Inspection With Materials and Thickness Identification
A technology has been developed that, instead of simply measuring the total absorption of the X-ray beam, enables changes in the beam energy to be resolved.
Technical Paper

How To Strip Tin-Lead Solder From SMT Pads for RoHS
Is it possible to scrub the pads of a PCB to bring it back into compliance? 63-37 solder was mistakenly used to hand solder parts.
Board Talk

Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
Technical Paper

Sponsor

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS

Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance.
Technical Paper

Early Design Review of Boundary Scan To Enhancing Testability
Paper reviews what portions of a design can be covered structurally and what are covered functionally, to provide the best diagnostics to discover faults?
Technical Paper

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk

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Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC

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Build Your Solution with Manncorp
Get a custom SMT equipment plan in minutes and source your entire line from one trusted supplier—backed by lifetime expert support you won't find anywhere else.
Manncorp Inc.