Electronics Manufacturing and Electronics Assembly

Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Printing of Solder Paste - A Quality Assurance Methodology
This paper describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing.
Production Floor

AI Algorithm Predicts Material Structure Almost Instantaneously
Nanoengineers developed an AI algorithm that predicts the structure and properties of any material - whether existing or new, almost instantaneously.
Technology Briefing

Wettable-Flanks On Bottom-Termination Components in Mass Production
Paper investigates the influence of wetting height of lead-frame based bottom-termination components on the performance of AO joint inspection.
Analysis Lab

The Importance of Conformal Coating Thickness and Edge Coverage
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material.
Materials Tech

Technology for Optical Co-Packaging
A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper.
Production Floor

Effects of Composition and Isothermal Aging on Microstructure Performance
Investigations of alloy composition and isothermal aging on solder microstructure and shear fatigue were performed on Pb-free alloy solder joints.
Analysis Lab

Issues With Fillets on Via Holes?
During wave solder some of the vias have concave fillets giving them a dimple effect. What can we do to create flatter fillets on via holes?
Board Talk

Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
This study was designed to investigate the efficiency of the rinse cycle using both a spray-in-air batch and inline cleaner.
Materials Tech

Cobalt Supply Chain Problem
Cobalt is one of the most significant supply chain risks threatening the widespread adoption of electric cars, trucks, and other electronic devices requiring batteries.
Technology Briefing

The Versatile Preform
This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms.
Production Floor

Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab

The Frustrating Filter Fix
A color film production facility was having a serious quality control problem and the building air filters were at the top of the suspect list.
Mysteries of Science

Rework Challenges for Smart Phones and Tablets
This paper reviews the challenges and process steps needed for successful repair of surface mount devices on very densely packaged circuit boards.
Production Floor

Putting the Great Stagnation Behind Us

In 1973 came a slower pace of productivity and economic growth, which has continued. We call this "the Great Stagnation."
Technology Briefing

Controlling Voiding Mechanisms in the Reflow Soldering Process
This paper reviews the factors that influence the incidence of voids in small and large area solder joints in LED modules.
Analysis Lab

Screening of Lower Melting Point Pb-Free Alloys

Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech

Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Production Floor

Supplier Spotlight

Krayden, Inc.
Since 1989 Krayden has delivered technical expertise as a problem-solving ...

RNS International
RNS International is a privately held company headquartered in Charlotte, ...

American Hakko Products, Inc.
Hakko has been producing superior quality soldering and desoldering tools, ...

IAC Industries
Welcome to IAC Industries. Our name represents the merged product ...

FULL SUPPLIER DIRECTORY

Board Talk

Reflow Oven Zone Separation Challenges

Issues With Fillets on Via Holes?

How To Clean a Vintage Circuit Board Assembly?

Suggested Stencil Wipe Frequency?

When is it Time to Switch from Manual Assembly to Automation?

When To Use Adhesive To Bond SMT Components

Questions About Handling Solder Paste

PCBA Inspection Concerns

MORE BOARD TALK

Questions and Comments

How To Clean a Vintage Circuit Board Assembly?

Been there and did this: With the circuit board removed ...
Jaye Waas, Renkus-Heinz

Questions About Handling Solder Paste

Here are some answers: 1. For best results, try to ...
Richard Stadem, Analog Technologies Corp.

What Causes Board Delamination?

In terms of root cause failure analysis, micro-sectioning across a ...
Alan Couchman, Process Sciences, Inc.

MORE COMMENTS