Complex Board Design Induced Solder Separation Failure
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. An in-depth analysis on the solder joint microstructure utilizing Electron-backscattered diffraction (EBSD) supports the test results leading to the mechanism associated with the solder separation failure.
Technical Paper
|
|
Vapor Phase and Backward Compatibility
We use lead-free solder paste with a melting point of 217 degrees C, along with 230 degree C Galden. We have a new project that uses tin-lead solder. The Assembly Brothers, Phil Zarrow and Jim Hall, offer their suggestions.
Board Talk
|
|
| Sponsor |
|
Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN
|
|
The Next Generation of Si-Interposers
This paper explores the next generation of silicon interposers, focusing on the technical advantages of using thicker interposers[1] with larger TSVs, specifically 50μm in diameter and 300μm in length. These larger TSVs offer several benefits, including enhanced electrical interconnectivity.
Technical Paper
|
|
|
|
|
|
| Sponsor |
|
Optically Clear Nanosilica Filled Epoxy
Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing.
Master Bond
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| Sponsor |
|
Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
|
|
Cure for the Grape Effect
We are processing lead-free boards with large components. Our parts are showing the grape effect. What is the best solution for this?
Board Talk
|
|
|
|
| Sponsor |
|
3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
|
|
Metal Organic Decomposition Inks for Electromagnetic Interference Shielding
In this paper, we will review different printing techniques, and spray coating. We will review 5-sided metallization to provide shielding via spray coating, film performance parameters including coating thickness uniformity, EMI shielding effectiveness, adhesion to different substrates, and reliability.
Technical Paper
|
|
