Electronics Manufacturing and Electronics Assembly

Sponsor

Drop-in SAC305 Alternative: Try REL61
Upgrade your alloy without the downtime. REL61 requires no pot cleaning and your SAC305 scrap value often covers the cost of the changeover. Optimize your process today.
AIM Solder

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Bottom Side Chip Bonding

Pick Performance for SMT Placement Machines

Overlap Solder Joint Failures

How to Re-qualify BGA Spheres

Pick and Place Machine Calibration

Components Falling Off During Reflow

Solder Balling Prediction Formula

Dendritic Growth and Contamination at BGA Sites

MORE ASK THE EXPERTS

Screen Making for Printed Electronics
This study presents a DOE method to pre-test materials to categorize ink and substrate rheology, compatibility and printed feature requirements.
Technical Paper

SN-CU-NI Composite Solder Paste High Temperature Use
Research on a prototype paste is being completed to improve reliability and survivability of PCB and SMT solder joints under extreme temperatures (< 500° Celsius).
Technical Paper

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

How To Prevent Mid-chip Solder Balls?
Is there a mathematical calculation that can be used to predict solder balling for a given package size?
Board Talk

Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process.
Technical Paper

Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Technical Paper

Sponsor

ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions

Process Optimization for Fine Feature Solder Paste Dispensing
In this paper the authors evaluate variables in the solder paste dispensing process, and review the impact on dispense quality of the solder paste.
Technical Paper

Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee.
Technical Paper

Sponsor

Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.

The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards.
Board Talk

Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk

Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Technical Paper

Sponsor

Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies

Solder Composition, Surface Finish and Solder Joint Volume on Drop Shock Reliability
Five Pb-free solder alloys on two PCB surface finishes were evaluated for drop shock reliability with two different solder joint volumes (LGA and BGA).
Technical Paper

Optimization of Stencil Apertures to Compensate for Scooping
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure.
Technical Paper

Sponsor

Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch

Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Technical Paper

Latest Industry News

Samsung Starts Mass Production of Next-gen AI Chips

VIEWPOINT 2026: Randy Flinders, Director of Regulatory Compliance, GreenSoft Technology, Inc.

Nvidia CEO praises Foxconn's AI server leadership at company sports event

Apple's stock has worst day since April as iPhone maker faces FTC scrutiny, reports of Siri delay

Apple delays Siri AI upgrades again as technical challenges mount

MORE INDUSTRY NEWS

Sponsor

Unitech PCB Cleaners
The basic PCB cleaning equipment from Unitech Corp., includes a large surface vacuum that sucks up dust and particles, a small brush to pick up dirt and a soft cloth for wiping down.
Seika

Sponsor

BGA Component Rework Simplified
When you're confronted with tough BGA rework, who do you turn to? Discover the #1 resource used by military contractors. We have solutions for all your BGA rework and repair needs.
Circuit Technology Center

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