Electronics Manufacturing and Electronics Assembly

Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question and share their own experiences.
Board Talk

Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor

Augmented Reality Enters Mainstream Information Technology
AR will grow exponentially, becoming the interface-of-choice between humans and machines, bridging the digital and physical worlds.
Technology Briefing

Nickel Hydroxide Corrosion Residues on Ceramic Packages
The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized.
Analysis Lab

High Reliability, Stress-free Copper Deposit
To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector.
Materials Tech

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor

Strain Measuring Technology in Board Level Assembly Process
The study on strain measurement has just started, and there are still many unsolved puzzles, whether about strain gage selection or about measurement methodology.
Analysis Lab

Why Do Our Boards Warp During Reflow?
Board flexing has started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven.
Board Talk

Tools and Techniques for Material Assessment in Advanced Technologies
Paper identifies limitations in the methods used for evaluating solders, circuit board materials and surface finishes.
Materials Tech

Automated Science Triggers 21st Century Bonanza
After being relatively flat since early 2000s, many economists doubt that productivity will again match or exceed the growth rates seen in the 1990s.
Technology Briefing

Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor

The True Business Impact of IIoT Technology
Pitfalls and opportunities in IIoT solution technology, at the device level, the manufacturing execution management system layer, and enterprise business systems layer.
Analysis Lab

Why Did the Old Reactor Work Best?
The expected color reaction at a dye manufacturing plant hadn't taken place. Why did the batch still work when moved into the old reactor?
Mysteries of Science

Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor

New Glass Three Times Stronger and Fracture Resistant

Scientists have developed a glass material that is not only three times stronger than conventional glass, but also more than five times more fracture resistant.
Technology Briefing

Determination of Total Halogen Content in Halogen-Free Fluxes
It is important for laboratories to follow robust methods to assure commercial products meet the safety requirements established.
Analysis Lab

NanoCopper Based Solder-free Electronic Assembly

This paper explores a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 degrees.
Materials Tech

Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor

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Board Talk

Is No-Clean the Trend for QFN Components?

Why Do Our Boards Warp During Reflow?

What Rate is World Class for SMT Machines?

Is Customer Approval Required for Class 3 Repair?

Should Apertures be Home Plate or Inverted Home Plate?

Solder Pallets With Titanium Inserts - Yes/No?

Selective Solder Pot Temperatures

Top Side Reflow Causing Solder Balls

MORE BOARD TALK

Questions and Comments

NanoCopper Based Solder-free Electronic Assembly

In 2008, Dr. Alfred Zinn embarked on developing a reliable ...
Doug Dixon, 360Circuits

What Rate is World Class for SMT Machines?

Guys, This is beneath you, as entertaining as your replies ...
Ike Sedberry, Sedberry Sales Inc

NanoCopper Based Solder-free Electronic Assembly

Yes, it eliminates whiskers, exhibits much higher electrical and thermal ...
Alfred Zinn, Kuprion, Inc.

Selective Solder Pot Temperatures

We are using 280C for most of our selective solder ...
Terry Ruszin, Lutron Electronics

Cleaning R.F. Circuits - Aqueous or Vapor?

Of the two methods, I would greatly favor aqueous cleaning ...
Doug Pauls, Collins Aerospace

MORE COMMENTS