circuit insight
Assembly Process Optimization of 0201 BTC Diodes for High Temperature
The effects of PCB pad design, stencil aperture design, the flux formulation in the assembly of 0201 BTC diodes using high temperature lead free solder are examined.
Technical Paper
New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
The roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Technical Paper
Sponsor
Schunk

What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK Electronic Solutions
Case Studies of Harsh Application Environments
This paper will present scenarios where environmental factors played a role in inducing various degradation mechanisms to Rockwell products. The paper will attempt to concentrate on the unusual scenarios, or where assumptions were made too early in the analytical process that likely hindered efficient determination of root cause.
Technical Paper
Intrusive Soldering Through-Hole Connector
We are SMT soldering a through-hole PC 104 connector. We have tried preforms and are unable to get all of the pins soldered. Phil Zarrow and Jim Hall, The Assembly Brothers, share their own suggestions in this scenario.
Board Talk
How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly.
Board Talk
Sponsor
Master-Bond

High Temp & Chemical Resistant Epoxy
Master Bond EP62-1AO is an electrically insulating adhesive that withstands harsh chemical environments while delivering thermal conductivity. View full specs.
Master Bond
Restoration of Lead-Free Bismuth Containing Solder Joints
Bismuth (Bi)-containing solder alloys have emerged as prime candidates to replace traditional lead (Pb)-free alloys such as SAC 305 (Sn-3.0Ag-0.5Cu).
Technical Paper
10 Cloud-based PCB Designing Tools for Remote Work
We have categorized together 10 of the best software tools for PCB outlook for electronics engineers – to buy you time while you are working on your projects.
Technical Paper
Sponsor
Circuit-Technology-Center

Don't Let Part Shortages Shut You Down
When critical components are hard to find, your production doesn't have to suffer. Discover proven methods for removing and requalifying components.
Circuit Technology Center
ENIG Nickel Corrosion on Wetting Balance Test Results and Intermetallic Formation
This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed.
Technical Paper
Sensors and Process-Performance Interactions for Additive In-Mold Electronics
The study explored printed electronics' suitability for in-mold electronic circuits. The study explored the effects of print parameter variations of direct ink write systems on the final thermoformed traces on PETG, PC, and HIPS samples.
Technical Paper
Flux Residue Causing Test Issues
We are having issues with flux residues. After wave, we experience many incomplete readings due to flux residues on connector pins.
Board Talk
Sponsor
Glenbrook-Technologies

Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies
Understanding PCB Design Variables That Contribute to Warpage
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed.
Technical Paper
Overcoming Solder Icicling and Copper Wire Dissolution
Dip soldering remains a common attachment method due to its simplicity, robustness, uniformity and low cost for a number of applications.
Technical Paper
Sponsor
kyzen

Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN
Discrete Event Simulation in Electronics Manufacturing Operations
This paper will provide an overview of discrete event simulation in general, explain the different types of model taxonomy used in academia and industry.
Technical Paper
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Sponsor
Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
SEHO
Sponsor
Manncorp

Turnkey Lines: In-Stock & Ready
In-stock, fully integrated SMT lines with Manncorp's U.S.-based support. Skip the wait, cut lead times, and get your operation producing sooner.
Manncorp Inc.
Cartoon
"We need to make some big changes around here. The kind of changes where many decisions are made but nothing actually happens."
Copyright © Randy Glasbergen