Technical Papers
Engineer's Guide to Component Re-Conditioning Using RHSD Process
X-Ray Inspection is Critical for Counterfeit Detection
Eight Steps to Ensure PCB Assembly Success
The Process Audit: One of the Most Important Procedures
ENEPIG Deposit Enhancement Achieves Ultimate Goal: Thicker, Lower Porosity Gold
Meeting Critical Medical Demands with X-ray Inspection
How continuous reflow monitoring supports lean manufacturing
Using True3D Inspection Data as a Process Control Tool in a Smart Factory
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Foxconn Raises Bonus for New Assembly Line Workers
BMW pushes ahead with hydrogen-tech vehicle
How China turned a prize-winning iPhone hack against the Uyghurs
Foxconn sees increased April revenues
Supply chain, what it is and how it works
Vendors to Watch in Performance Testing Tools
Useful Waste: Rethinking Computing in the GPU Era
IBM Introduces the World's First 2-nm Node Chip
MORE INDUSTRY NEWS
May 6, 2021
Cure for the Grape Effect
Cure for the Grape Effect
We are processing lead-free boards with large components. Our smaller parts are showing the grape effect. What is the best solution for this? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and offer their suggestions for the best solution.
Board Talk
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
The Tumultuous Birth of Our New Golden Age
The Tumultuous Birth of Our New Golden Age
Per capita income and quality of life rise, during Techno-Economic Revolutions. Each wave was enabled by a general-purpose breakthrough technology.
Technology Briefing
Wettable-Flanks On Bottom-Termination Components in Mass Production
Paper investigates the influence of wetting height of lead-frame based bottom-termination components on the performance of AO joint inspection.
Analysis Lab
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
This paper covers a type of 'crack free' flux paste designed to inhibit cracking under extreme environments. Includes electro-chemical migration tests dew ...
Materials Tech
Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor
Effects of Composition and Isothermal Aging on Microstructure Performance
Investigations of alloy composition and isothermal aging on solder microstructure and shear fatigue were performed on Pb-free alloy solder joints.
Analysis Lab
Removing Warpage from PCBAs
Removing Warpage from PCBAs
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them?
Board Talk
How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.
Materials Tech
Putting the Great Stagnation Behind Us
Putting the Great Stagnation Behind Us
We had begun our shift from the Great Stagnation which started with the Dot.com crash. But COVID19 has convinced many that mediocrity is here to stay.
Technology Briefing
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab
Flying Saucer Over The Factory
Flying Saucer Over The Factory
At a new circuit factory an employee heard a thud and saw a bright metal dome-shaped object falling from the sky. Where did it come from?
Mysteries of Science
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor
Increased Computer Chip Processing with Conductive Titanium Oxide
Increased Computer Chip Processing with Conductive Titanium Oxide
A method to make non-volatile computer memory which may help solve a problem that has been holding back machine learning has been developed.
Technology Briefing
Controlling Voiding Mechanisms in the Reflow Soldering Process
This paper reviews the factors that influence the incidence of voids in small and large area solder joints in LED modules.
Analysis Lab
Lower Temperature Solder Joint Encapsulant
Lower Temperature Solder Joint Encapsulant
The strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved.
Materials Tech
Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
Printed Circuits, LLC
Printed Circuits, LLC
Founded in 1977, Printed Circuits has since ...
Aqueous Technologies Corporation
Aqueous Technologies Corporation
Aqueous Technologies, established in 1992, specializes in ...
SEICA SpA
SEICA SpA
Founded in 1986, Seica S.p.A. is a ...
PROMATION INC. USA
PROMATION INC. USA
Our devotion to providing customers with high ...
Technology Corner
Peel-A-Way Removal Terminal Carriers
Advanced Interconnections Corp.
Unitech PCB Cleaner Intro
Seika Machinery, Inc.
Real-time Visual PCB Analysis and Debug
XJTAG
Introducing Ni-Less ENIG-Premium
LiloTree
MORE TECHNOLOGY CORNER
Board Talk
Cure for the Grape Effect
Removing Warpage from PCBAs
Solder Paste Inspection - When and Why
Predicting Mid-Chip Solder Balling
Will Typical No Clean Paste Pass an SIR Test?
How Do You Remove Oxidation from PCBs?
Consensus for Baking Prior to Rework?
How Many Fiducials Per Stencil
MORE BOARD TALK
Questions and Comments
Cure for the Grape Effect
Incomplete coalescence of solder powder particles can be eliminated by ...
Mitch Holtzer, MacDermid Alpha Assembly Solutions
Solder Paste Inspection - When and Why
SMT inspection was a $500M+ market in 2019. So SPI ...
Allen Phung, Koh Young
Headaches at the Factory
A long, long time ago, in a galaxy far away ...
Richard Gwaltney, American Technical Ceramics
Will Typical No Clean Paste Pass an SIR Test?
What is the expected reliability level of the component that ...
Rick Perkins, Chem Logic
Consensus for Baking Prior to Rework?
I have seen a lot of PCB damage done to ...
Bradley J. Fern, Entrust
MORE COMMENTS
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