June 19, 2025
|
|
|
Sponsor |
|
Bismuth in Solder Alloys
Bismuth is a primary constituent in many low-temp solders. It also serves as an additive element in SAC solders that reinforces joint durability & optimizes wetting characteristics.
AIM Solder
|
|
|
|
|
Sponsor |
|
Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond
|
|
|
|
Sponsor |
|
"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
|
|
|
2nd Generation of indium TIM
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Materials Tech
|
|
|
Sponsor |
|
Vapor Phase Profiling
Thermal profiling the vapor phase soldering process especially those with vacuum is challenging. ECD's M-VP sealed barrier can take it. Learn more.
ECD
|
|
|
|
Sponsor |
|
Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
|
|
The Static Charge Overload
A plastic molding plant had been running for less than a year. Suddenly parts began testing positive for an electrical charge. What caused it?
Mysteries of Science
|
|