Electronics Manufacturing and Electronics Assembly

Sponsor

How pH Cleaning Agents Affect Production Performance
Establishing a reliable cleaning process requires a good understanding of all influencing factors, including pH, and defining the correct balance to meet final product reliability.
KYZEN

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

Components Falling Off During Wave Soldering

ESD Ground Wire Gauge

Looking for Long-term Component Storage Options

Question About PPM Defect Rate for Reversed Packages

ESD and Humidification

SMT Target Component Placement

Old Components and Blow Holes

Pin in Paste Solder Dropping

MORE ASK THE EXPERTS

Seeking Alternatives to Solvent Cleaning
We are using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene.
Board Talk

An Investigation in Rinse Water Sustainability
This paper investigates options for improving sustainability in Class II and III manufacturing environments by studying options for reusing and/or recycling rinse water.
Technical Paper

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Capital Expenses Significantly Reduced by Eliminating Dispensed Adhesives and Underfills
Learn how you can potentially save $300K-$900K in capital expense with our PLACE-N-BOND Underfilms. Click here.
Alltemated Inc.

New Interconnection for High Temperature Application: HotPowCon (HPC)
Interconnection technology is capable for resistant joints for SMT components, bigger dies, like MOSFETs or IGBTs and even large area substrates, like baseplate or heat sinks.
Technical Paper

NSOP Reduction for QFN RFIC Packages
NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes.
Technical Paper

Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Technical Paper

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Improving Efficiency of Through-Hole PCBAs
We are trying to improve the efficiency of the through-hole of our mixed tech, surface mount through-hole PCBAs. What are our options?
Board Talk

Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Technical Paper

Sponsor

3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Technical Paper

Advanced in Packaging for Emerging Technologies
A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper.
Technical Paper

Analysis of Mechanism About Data Retention Characteristic in TANOS Structure
The long-term evaluation of TANOS structure is investigated and the prediction of retention characteristic can be evaluated through the accelerated tests.
Technical Paper

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Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC

Solder Boards Not Holding Up to Shock Testing
We are using a vapor phase oven. We have experienced problems with a no-lead BGA that has low silver solder balls. The solder boards do not hold up to shock testing.
Board Talk

Evaluation of High Speed Plating for Copper Post with Flat Top Shape
In developing high-speed electro “copper post” plating bath the shape of the post and the uniformity of the post height throughout the wafer were considered.
Technical Paper

Sponsor

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

The Impact of Harsh Environments and Ionic Contamination on Post-Reflow Circuit Assemblies
Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM).
Technical Paper

Latest Industry News

Surging Memory Costs Will Reduce Global PC & Smartphone Shipments in 2026

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Rare earth shortages worsen in US aerospace, chips despite trade truce, sources say

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Future-Proofing the Electronics Workforce Through the Global Electronics Association’s Emerging Engineer Program

MORE INDUSTRY NEWS

Sponsor

Speed That Scales With You
High-throughput 10-head MC388HS pick and place machines built for accuracy at high-speed—helping you scale production without compromising placement quality.
Manncorp Inc.

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Significantly Reduce Silver-Driven Costs
REL61 is a proven alloy that slashes costs for mid-to-large manufacturers. Get better thermal stability and lower overhead with AIM’s global technical support.
AIM Solder