Technical Papers
Recent Advances in Final Finishes Push Past the Limits of Conventional Electrolytes
Smart pH Employment in Electronic Cleaning
Mastering the EV Revolution with Expertise in High-Voltage & E-Mobility
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
2D SPI and a 2D AOI now integrated in your SMT Production Machine
Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes
An Essential Guide to Optimize Selective Soldering Processing
Is My Printed Circuit Board Wash Concentration in Check?
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Explainer: What is Chip Binning?
Apple turns to Foxconn and Lenovo to build new AI servers based on Apple Silicon
Machine Learning Might Save Time on Chip Testing
FBI alerts tech companies of forged subpoenas used by data-stealing hackers
Biden Rushes CHIPS Subsidies as Trump Takes Over
MORE INDUSTRY NEWS
November 12, 2024
Big Problems with HASL Finish
Big Problems with HASL Finish
We are able to lift a SOIC off a PCBA using tweezers and no heat. The pads are bare copper, the PCB was manufactured using tin lead HASL finish. The Assembly Brothers, Phil Zarrow and Jim Hall, share their own experiences.
Board Talk
Embedded Components from Concept-To-Manufacturing
Use of embedded components has grown significantly in the defense, aerospace, telecommunications, medical and consumer markets.
Production Floor
3D-Printed Concrete Revolutionizes Home Building
3D-Printed Concrete Revolutionizes Home Building
Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste.
Technology Briefing
Effects of Substrate Material and Package Pad Design on Solder-Joint Reliabilty
This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications.
Analysis Lab
Alternative Solvent with Low Global Warming Potential
Alternative Solvent with Low Global Warming Potential
A new low global warming potential fluorinated solvent for precision cleaning is discussed. The paper covers the properties and performance.
Materials Tech
Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor
Evaluation of High Speed Plating for Copper Post with Flat Top Shape
In developing high-speed electro “copper post” plating bath the shape of the post and the uniformity of the post height throughout the wafer were considered.
Analysis Lab
Solder Paste Inspection - When and Why
Solder Paste Inspection - When and Why
Our facility is considering a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one?
Board Talk
Bi-Based Solders for Low Temperature to Reduce Cost and Improve Yield
The use of BiSnbased solder paste improves the BGA solder joint yield relative to SAC based solder pastes during low temperature reflow soldering.
Materials Tech
The Biggest Barrier to a Robotics Revolution
The Biggest Barrier to a Robotics Revolution
Experts believe robots will be able to cost-effectively perform a large share of physical tasks which, until now, have been performed only by humans.
Technology Briefing
Is Cleaning Critical to POP Assemblies?
Paper addresses the cleanliness level of package-on-package assemblies including underneath package-on-package components.
Production Floor
Board Level Reliability Comparison of BGA and LGA Packages
Study compares board level reliability of BGA and LGA packages mounted with an LGA footprint. Yield, drop test and thermal performance were evaluated.
Analysis Lab
Sealed Membrane Switch Mystery
Sealed Membrane Switch Mystery
A factory was building membrane switches but all the switches from units in Denver failed. What was unusual about Denver?
Mysteries of Science
Miniaturization with Help of Reduced Component to Component Spacing
This paper covers layout, assembly and material selections to reduce component to component spacing down to 4-5mil from today's mainstream of 6-8mil.
Production Floor
Researchers Incorporate Machine Learning Into Brain-Computer Interface
Researchers Incorporate Machine Learning Into Brain-Computer Interface
Researchers incorporated machine learning into the brain-computer interface. This solution can understand the needs of a subject and self-calibrate.
Technology Briefing
BVA: Molded Cu Wire Contact Solution
BVA: Molded Cu Wire Contact Solution
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Materials Tech
Jetting Fine Lines onto 2D and 3D Electronic Packages
The demand for smaller dispense doses including fine lines, small dots and accurate dispensing requires examination of available products and technologies.
Production Floor
Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Analysis Lab
Board Talk
Big Problems with HASL Finish
Solder Paste Inspection - When and Why
Shelf Life Before Conformal Coating
Will Typical No Clean Paste Pass an SIR Test?
Cleaning Reballed BGA Components
Consensus for Baking Prior to Rework?
Reflow For Rigid Flex
What is Causing Dimples in Blind Via Pads?
MORE BOARD TALK
Questions and Comments
Shelf Life Before Conformal Coating
There are a couple of standards that have requirements for ...
Alan Woodford, Zentech
Reflow For Rigid Flex
Depending on the overall thickness of the flex, bake times ...
Philip H. Provencal, Jr., Columbia Tech
Variations in SAC 305 Solder
Curious, after dross recovery what phosphorus, at such a low ...
Scott E. Fiske, Lockheed Martin Space
MORE COMMENTS
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