Electronics Manufacturing and Electronics Assembly

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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

Technical Papers

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

MORE TECHNICAL PAPERS

Ask the Experts

BGA BAll Sheer Testing

Hand Soldering at Low Temperature

Spotting After DI Water Cleaning

Cause of Green/Blue Oxide Buildup

Floor Life of MSD Parts

Reflow Oven Calibration Schedule

Trichloroethylene Alternative

Is Solder Mask Considered an Insulator

MORE ASK THE EXPERTS

Conformal Coating Prevention and Analysis of Resistor Silver Sulfide Corrosion
This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions. Physical analyses were completed to investigate possible differences in the failure mode at the various FoS test temperatures.
Technical Paper

Low Temperature SMT Solder Evaluation
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Technical Paper

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Discover Real Operational Strategies from Proven Global Leaders
In this 4-part series we asked three experienced global leaders for their insights on the biggest challenges faced by manufacturing operations today. No Registration required.
Intraratio

Blow Holes After Switching from Lead-Free HASL to ENIG
After switching our PCB finish from lead-free HASL to ENIG blow holes started occurring in the solder joints of the through-hole LEDs. The PCBs and LEDs are from the same suppliers as before, only the finish changed.
Board Talk

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
The industry standard for accelerated temperature cycling, IPC-9701B, defines test conditions for characterizing solder interconnect fatigue. The document specifies a maximum cycling ramp rate of 20 °C/minute to avoid thermal shock conditions that can accelerate failure modes other than low cycle fatigue in the bulk solder.
Technical Paper

Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used.
Technical Paper

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AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.

Challenges Reliably Soldering Large Ground Pad on LGAs
We are experiencing difficulties reliably soldering large ground pad on land grid array packages using a single large window as a stencil. Should we use all four windows?
Board Talk

Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.
Technical Paper

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Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH

Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions.
Technical Paper

Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Technical Paper

Finding the Cause of Cold Solder Joints
We have problems with our wave soldering system, especially cold solder joints. Could this be caused by using a selective soldering frame?
Board Talk

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Maximize Yield with Patented Vacuum Reflow
Heller's innovative, patented vacuum reflow solves the throughput bottleneck by shortening cycle times for maximum yield and minimal voiding. Experience the speed with us.
Heller Industries

Electromigration in Tin-Bismuth Planar and Bottom Terminated Solder Joints
The electromigration rates and behavior of eutectic Sn-Bi alloy in planar and in BTC solder joints were compared and shown to be similar.
Technical Paper

Development and Testing of a Lead-Free Low Melting Point Alloy
This paper describes the development and testing procedure of a new lead-free low melting point alloy.
Technical Paper

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Advancing Bonding Techniques for Electronic Interconnects
This study focuses on two major bonding techniques: Cu nanoparticle (Cu NP) sintering and Cu-Sn3.0Ag0.5Cu (Cu-SAC305) hybrid paste bonding. Both methods aim to address the limitations of conventional soldering processes, especially in high-temperature, high-power applications.
Technical Paper

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vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE

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Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

"I can complete the project under budget and ahead of schedule, but you'll need to allocate additional time and money for that."
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