Electronics Manufacturing and Electronics Assembly

We are processing lead-free boards with large components. Our smaller parts are showing the grape effect. What is the best solution for this? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and offer their suggestions for the best solution.
Board Talk

Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor

The Tumultuous Birth of Our New Golden Age
Per capita income and quality of life rise, during Techno-Economic Revolutions. Each wave was enabled by a general-purpose breakthrough technology.
Technology Briefing

Wettable-Flanks On Bottom-Termination Components in Mass Production
Paper investigates the influence of wetting height of lead-frame based bottom-termination components on the performance of AO joint inspection.
Analysis Lab

Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
This paper covers a type of 'crack free' flux paste designed to inhibit cracking under extreme environments. Includes electro-chemical migration tests dew ...
Materials Tech

Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor

Effects of Composition and Isothermal Aging on Microstructure Performance
Investigations of alloy composition and isothermal aging on solder microstructure and shear fatigue were performed on Pb-free alloy solder joints.
Analysis Lab

Removing Warpage from PCBAs
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them?
Board Talk

How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.
Materials Tech

Putting the Great Stagnation Behind Us
We had begun our shift from the Great Stagnation which started with the Dot.com crash. But COVID19 has convinced many that mediocrity is here to stay.
Technology Briefing

Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor

Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab

Flying Saucer Over The Factory
At a new circuit factory an employee heard a thud and saw a bright metal dome-shaped object falling from the sky. Where did it come from?
Mysteries of Science

Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor

Increased Computer Chip Processing with Conductive Titanium Oxide

A method to make non-volatile computer memory which may help solve a problem that has been holding back machine learning has been developed.
Technology Briefing

Controlling Voiding Mechanisms in the Reflow Soldering Process
This paper reviews the factors that influence the incidence of voids in small and large area solder joints in LED modules.
Analysis Lab

Lower Temperature Solder Joint Encapsulant

The strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved.
Materials Tech

Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing.
Production Floor