Electronics Manufacturing and Electronics Assembly

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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Cleanliness Standards for Electronic Components

Baking Concerns for Stacked Trays of Components

Cleanliness Requirement for Populated Printed Boards

Flux Residue During Pin-in-Paste

Storage To Prevent Corrosion

Manual or Automated Assembly?

Soldering Station Calibration

Exposed Copper Risk

MORE ASK THE EXPERTS

Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk

Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders
This paper focuses on the effects of sustained high temperatures on the high strain rate of doped lead-free solders operating between -65°C to 200°C.
Technical Paper

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Want High-Quality BGA Reballing?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.

The Effect of Strain Rate on the Ductility of Bismuth-Containing Solders
In this paper the authors report some preliminary results from a wider study of the effects of bismuth on the properties and behaviour of solder alloys.
Technical Paper

Reservoir Printing in Deep Cavities
Guidelines for stencil designs and aperture placement in cavities are presented, including stencil design, paste material, experimentation, and results.
Technical Paper

SMT Processing using Printed Anisotropic Conductive Epoxy
There are many options on the market for unpackaged, bare die with advanced capabilities, however these chips are often designed for wire bonding interconnection. This paper discusses three designs successfully transitioned from previously wire-bonded die to bare die direct-to-circuit attachment using standard SMT pick-and-place equipment.
Technical Paper

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Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology

Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk

Kinetics of a Layer of Bismuth at the Anode of a Sn-Bi Based Solder Joint
Electrical resistance of low temperature solder during current stressing was shown to have the thickness of continuous layers of Bi accumulated at the anode.
Technical Paper

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"Flying" SMD Components
This paper deals with the fundamentals of heat transfer and the test procedures show how the SOD323 can be processed given a suitable selection of solder paste and oven settings. Read more.
Rehm Thermal Systems

Analyzing 0402 Capacitor Defects With Stencil Printing Misalignment
This study investigated the cause of tombstoning for 0402 capacitors in surface mount technology. Statistical analysis methods were used to determine if there was any difference.
Technical Paper

Temperature Cycling with Bending to Reproduce Typical Product Loads
A new methodology for solder joint reliability prediction taking into account the mechanical load as well as the thermal mismatch load between component, solder & PCB is proposed.
Technical Paper

Optimization of Robotic Soldering Process: Solder Spread and Spattering
Robotic soldering is a growing market. We will present how cored wires with different flux percentages will affect robotic soldering performance.
Technical Paper

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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk

Pb-Free Water-Soluble Solder Paste Improves Reliability
This paper details a water-soluble lead-free solder paste that has improved voiding performance and washability over previous generations of solder paste.
Technical Paper

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Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect

Thermal Radiographic Failure Analysis of Capacitor Encapsulant Fracturing
Multiple tantalum capacitors are SMT attached to PCBs. Failures or fractures were observed at contractor SMT assembly lines and not on RTX lines.
Technical Paper

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Engineering Changes Don’t Have to Slow You Down
When design updates demand precision and speed, trust the rework technicians at Circuit Technology Center to get it done right the first time.
Circuit Technology Center

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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.