Electronics Manufacturing and Electronics Assembly

Sponsor

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Solder Paste Mixing

Polyurethane Conformal and Acrylic Coating on the Same PCB

Conformal Coating in Nitrogen Environment

Double Sided Reflow for Micro BGA Components

Baking After Cleaning Hand Placed Parts

Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Coils Rotated After Reflow

MORE ASK THE EXPERTS

Protecting the Reliability and Integrity of Electronic Products and Assemblies
The COVID-19 crisis has prompted increasing inquiries on how to disinfect electronic equipment and assemblies without detrimental impact on the electronics.
Technical Paper

Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
This paper introduces line confocal technology that was developed to characterize 3D features of surface and material types at sub-micron resolution.
Technical Paper

Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint.
Technical Paper

Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package
Lower-temperature paste can be reflowed under a relatively lower peak temperature profile and outperform SAC305 paste in the current WLP256 application.
Technical Paper

Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Cleaning and No-Clean Process Control Using the SIR Test Method
This research is to design electrical twin test boards in the waste area of a panel of production boards, which are representative of production hardware.
Technical Paper

What is the Suggested Humidity Level for Electronics Assembly?
I am aware of the suggested humidity level for an electronics assembly facility. Do the same limits apply within a 100,000 class clean room?
Board Talk

Sponsor

Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch

Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Technical Paper

Continuous Improvement: The Task That Never Ends in the Cleaning World
The job of a cleaning agent is to remove an unwanted contaminant, or simply some kind of “dirt”. How can you efficiently remove that soil while minimizing total waste and improving worker safety? While that answer evolves based on updated impact studies and new regulations, the goal of removing those undesired contaminants remains fixed.
Technical Paper

Microalloying Effects of Sb and Ag on the Microstructural of Eutectic Sn-Bi Alloys
In this paper, we will compare the bulk microstructure of eutectic Sn-Bi with Sb and Ag additions to solder joints on Cu substrates and ENIG surface finishes.
Technical Paper

Sponsor

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

Ductile Low Temperature Solders for Mass Production of Assemblies
This paper reports results of the behaviour of Sb in a Sn-Bi alloy and consider the implications of the findings for the reliability of LTS solder joints.
Technical Paper

Cause of Long-Term Soldering Joint Cracking in Automotive Application
We are seeing field returns due to solder joint cracking on the pin of a 16-pin through-hole connector. What might be the cause of the joint cracking?
Board Talk

Sponsor

Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions

Hand Soldering Reliability
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount?
Board Talk

Latest Industry News

How to Source Hard-to-Find Electronic Components During Shortages

Taiwan's Foxconn says driverless technology coming sooner than expected

Intel Foundry Improves Execution, but External Customers Remain the Test

Industrial PC orders rise on edge AI demand

Why Are Data Centers Moving Into Rural Areas?

MORE INDUSTRY NEWS

Sponsor

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology

Sponsor

Cleaning advanced packages? The stakes are rising.
Flux residues under low-standoff components risk field failures. Get IPC-validated insights on optimizing inline spray cleaning.
ZESTRON Americas

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