|
|
|
|
|
|
|
|
Removing Warpage from PCBAs
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss their recommendations.
Board Talk
|
|
Predicting Mid-Chip Solder Balling
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling.
Board Talk
|
|
|
|
|
|
|
|
|
|
|
|
Complex Board Design Induced Solder Separation Failure
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. An in-depth analysis on the solder joint microstructure utilizing Electron-backscattered diffraction (EBSD) supports the test results leading to the mechanism associated with the solder separation failure.
Technical Paper
|
|
Vapor Phase and Backward Compatibility
We use lead-free solder paste with a melting point of 217 degrees C, along with 230 degree C Galden. We have a new project that uses tin-lead solder. The Assembly Brothers, Phil Zarrow and Jim Hall, offer their suggestions.
Board Talk
|
|
|
|
The Next Generation of Si-Interposers
This paper explores the next generation of silicon interposers, focusing on the technical advantages of using thicker interposers[1] with larger TSVs, specifically 50μm in diameter and 300μm in length. These larger TSVs offer several benefits, including enhanced electrical interconnectivity.
Technical Paper
|
|
|
|
|
|
|
|
