Technical Papers
Benefits of Manual X-ray Inspection
The Elimination of Whiskers from Electroplated Tin
Thermal Profiling: Integral to a Process in Control
Test Series Covering miniLED Print & Inspection Challenges
Engineer's Guide to Component Re-Conditioning Using RHSD Process
X-Ray Inspection is Critical for Counterfeit Detection
Eight Steps to Ensure PCB Assembly Success
The Process Audit: One of the Most Important Procedures
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
A Chip Industry for All Seasons
Electronics Counterfeiting: Risks and Remedies
Take a look inside Google's first retail store ahead of its opening
The new wave of robotic automation
Kia partners with Uber to supply EVs in Europe
Intel CEO sees '10 good years' of chip industry growth
Democrats and Republicans show rare unity in desire to crack down on big tech companies
Experts say hackers might exploit work-from-home trend
MORE INDUSTRY NEWS
June 17, 2021
Component Moisture Question?
Component Moisture Question?
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Phil Zarrow and Jim Hall, The Assembly Brothers, dicsuss this scenario and offer their suggestions.
Board Talk
Combing Automated Advanced Process Control with Feedback to Revolutionize the Printed Circuit Board Assembly Process
This presentation will explore Industry 4.0, and then explore how Advanced Process Control (APC) can increase production yields and reduce defects.
Production Floor
The Tumultuous Birth of Our New Golden Age
The Tumultuous Birth of Our New Golden Age
Per capita income and quality of life rise, during Techno-Economic Revolutions. Each wave was enabled by a general-purpose breakthrough technology.
Technology Briefing
Reliability of No-clean and Water-soluble Solder Pastes
The purpose of this paper is to highlight the differences between these two families of solder pastes to guide users in their choice.
Analysis Lab
Design and Fabrication of Ultra-Thin Flexible Substrate
Design and Fabrication of Ultra-Thin Flexible Substrate
This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
Materials Tech
Vapor Phase - Improvement Under Oxidation Free Soldering Conditions
Modern vapor phase soldering systems based on new technologies have eliminated the disadvantages inherent to condensation systems.
Production Floor
The Perfect Copper Surface
To provide the functionality in today's electronics, printed circuit boards are approaching the complexity of semiconductors.
Analysis Lab
5 vs 8-Zone Ovens
5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk
Atmospheric Plasma Surface Engineering of Printed Circuit Boards
Plasma treatment is a method to increase the adhesion strength of the conformal coatings to PCBs through the removal of organic contaminants and surface activation.
Materials Tech
Putting the Great Stagnation Behind Us
Putting the Great Stagnation Behind Us
We had begun our shift from the Great Stagnation which started with the Dot.com crash. But COVID19 has convinced many that mediocrity is here to stay.
Technology Briefing
Stencil Aperture Design for Next Generation Ultra Fine Pitch Printing
The work reported here represents the start of a series of experiments to help further understand the significance of square vs circular aperture formats.
Production Floor
Hybrid Conformal Coatings Used for Mitigating Whisker Growth
In this work, we have synthesized a conformal polyurethane coating consisting of hard (hexamethylene di-isocyanate) and soft (polyol) segments.
Analysis Lab
Brighter Chrome on the Third Shift
Brighter Chrome on the Third Shift
Why was one third shift operator at a plating shop producing parts with a superior chrome finish compared to the other two shifts?
Mysteries of Science
The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor
How Our Techno-Economic Revolution Prevents Inflation
How Our Techno-Economic Revolution Prevents Inflation
We’re in the midst of the most aggressive surge in the deployment of technological innovation that has occurred in at least seventy years.
Technology Briefing
Detect PCB Stack-up Error with Machine Learning Methods
With high frequency and high-speed transmission in information industry, PCB customers demand stricter signal transmission integrity of PCB.
Analysis Lab
Nano Silver Replacement for High Lead Solders
Nano Silver Replacement for High Lead Solders
This paper details mechanical and reliability testing of joints made with materials under a range of temperature, pressure and atmosphere.
Materials Tech
Reduce Pollution of Process Gasses in an Air Reflow Oven
This paper gives detailed information of catalyst systems designed and implemented in SMD production lines to reduce pollution of process gasses.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
Numerical Innovations
Numerical Innovations
Numerical Innovations Inc. is a minority owned ...
PCB Assembly Express
PCB Assembly Express
PCB Assembly Express has state-of-the-art assembly plants ...
PCBASupplies
PCBASupplies
Founded by a former owner of a ...
Kodiak Assembly Solutions LP
Kodiak Assembly Solutions LP
Kodiak Assembly Solutions, is an Electronic Manufacturing ...
Technology Corner
Training and Certification Continues
Blackfox Training Institute
AOI Delivers Mission Critical Quality
Koh Young Technology Inc.
World-class Surface Modification Technologies
Aculon
MORE TECHNOLOGY CORNER
Board Talk
Component Moisture Question?
5 vs 8-Zone Ovens
How To Verify Cleanliness After Rework and Prior to Re-coating?
BGA Components and Coplanarity
Demise of the Plated-Through Hole?
What is Solder Paste Working Life on a Stencil?
Simple Test for Flux Penetration
Step Stencil Setup
MORE BOARD TALK
Questions and Comments
How To Verify Cleanliness After Rework and Prior to Re-coating?
I agree That some cleaning can be done and is ...
Alan Woodford, NeoTech
Demise of the Plated-Through Hole?
I agree with Jim and Phil and most of the ...
Ranganath M A, TQM Consultancy
Demise of the Plated-Through Hole?
Thru hole connectors - I have been designing board level ...
D. Greig
Problem Meeting Minimum Hole Fill During Wave Soldering
We have found in hundreds of experiments that the temperature ...
Mitch Holtzer, Alpha Assembly Solutions
What is Ideal Humidity for Final Assembly?
There's no need to control humidity for ESD control in ...
Jeremy Smallwood, Electrostatic Solutions Ltd
MORE COMMENTS
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'Ever have one of those days when you're not sure whether you're in the zone, out of the box, under the gun, over the hump, or behind the curve?'
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