circuit insight
Strain During Press Fit Connector Insertion in PCB Assembly
Locations closer to the insertion site experienced the highest level of strain, which progressively decreased further from the insertion location.
Technical Paper
Limits for HASL with Complex Products
What are the limits for the future with more complex products? HASL and the actual HASL process, hot air solder leveling, has been with us since the mid-70s.
Board Talk
Sponsor
DL-Technology

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology
A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
Technical Paper
Cohesive Zone Modeling of Failure Underfilled BGA-PCB Assemblies
A model was developed to simulate the delamination behavior of multilayer PCBs assembled with BGA components reinforced with an underfill epoxy adhesive.
Technical Paper
Screen Making for Printed Electronics
This study presents a DOE method to pre-test materials to categorize ink and substrate rheology, compatibility and printed feature requirements.
Technical Paper
Sponsor
Viscom-SE

Viscom: Next Level of Inspection at APEX
Viscom Inc. presents its AI-powered inspection software vAI ProVision at APEX Expo 2026 in Anaheim. See live demos of faster AOI and AXI programming at Booth #2836.
Viscom SE
SN-CU-NI Composite Solder Paste High Temperature Use
Research on a prototype paste is being completed to improve reliability and survivability of PCB and SMT solder joints under extreme temperatures (< 500° Celsius).
Technical Paper
How To Prevent Mid-chip Solder Balls?
Is there a mathematical calculation that can be used to predict solder balling for a given package size?
Board Talk
Sponsor
SEHO

You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH
Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process.
Technical Paper
Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Technical Paper
Process Optimization for Fine Feature Solder Paste Dispensing
In this paper the authors evaluate variables in the solder paste dispensing process, and review the impact on dispense quality of the solder paste.
Technical Paper
Sponsor
BEST-Inc.

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee.
Technical Paper
The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards.
Board Talk
Sponsor
SEIKA-America

Sayaka Table-Top PCB Router, SAM-CT23S with online camera
Advanced image processing software offers easy programming and CAD base offline programming. Automatic alignment compensation.
Seika
Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk
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Sponsor
Plasma-Etch

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
Ormet-TLPS
Sponsor
Nordson-ASYMTEK

Trailblazing Process News for Conformal Coating
Say goodbye to clogged nozzles and hello to flawless conformal coating with the ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station.
Nordson Electronics Solutions
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