July 10, 2025
|
Challenges of Ultra-Fine Feature Printing Optimization of Pb-Free Solder Paste
Semiconductor manufacturing, flip chip, package on package (PoP), system in package (SiP), and miniature components like 0201M may require printing through stencil apertures of 50-100 μm (2-4 mils) in size. Creating these miniature solder joints requires solder pastes optimized for use with IPC Type 6 (5-15 μm) or smaller solder powder sizes.
Materials Tech
|
|
|
Sponsor |
|
Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic
|
|
The New Standard for Cyber Security
Productivity can be improved by implementing, catching counterfeits and counterfeiters closer in time and physical distance than ever before by taking a systematic approach.
Analysis Lab
|
|
|
|
Sponsor |
|
Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
|
|
|
|
|
|
|
|
Sponsor |
|
Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
|
|
|
|
Sponsor |
|
Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
|
|
Headaches at the Factory
A factory was experiencing health complaints from workers. What was causing the workers to experience these health problems?
Mysteries of Science
|
|