Electronics Manufacturing and Electronics Assembly

Sponsor

Keeley Pedals Perfected with Manncorp
Keeley Electronics revolutionizes production with Manncorp pick & place machines, achieving unprecedented speed, precision, and innovation in the guitar pedal industry.
Manncorp Inc.

Technical Papers

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

MORE TECHNICAL PAPERS

Ask the Experts

Solder Paste Stencil Inactivity

Solder Mask Thickness Tolerance

Question About ESD Ionizer Guns

Bottom Terminated Components and Vias

Cleanliness Standards for Electronic Components

Baking Concerns for Stacked Trays of Components

Cleanliness Requirement for Populated Printed Boards

Flux Residue During Pin-in-Paste

MORE ASK THE EXPERTS

Performance Comparison: Liquid and Pad Thermal Interface Material
This study tested the hypothesis that a liquid TIM with the same effective thermal conductivity as a gap pad will have lower thermal resistance in application due to its ability to wet out the interface better than a solid pad. Also hypothesize here, bondline thickness has a significant effect over total thermal resistance.
Technical Paper

Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk

Sponsor

Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions

Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Technical Paper

Optimization of PCB SI Coupon Design that Minimizes Discontinuity
In this study, we tried to minimize the discontinuous path of Delta-L coupon by using the VIPPO (Via In Pad Plated Over) technique to improve the signal integrity.
Technical Paper

Direct Imaging and Direct Jetting of Solder Mask
PCB manufacturers are challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components.
Technical Paper

Sponsor

The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation

Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, without compromising quality, cost, and throughput.
Technical Paper

Requirements for Depaneling and Rescoring Boards with BGA Components
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components?
Board Talk

Sponsor

Unlock Operational Success with Insights from Global Leaders
4-part series focused on achieving excellence while facing the operational challenges of advanced electronics and SMT manufacturing. No registration required.
Intraratio

Effect of Thermal Cycling Dwell Time on High-Performance Solder Alloys
This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time.
Technical Paper

Low Temperature Solder “Reverse Hybrid” Method
This paper will review the implementation of LTS “Reverse Hybrid”, which is the assembly of a ball grid array component with LTS solder balls to the motherboard.
Technical Paper

Machine Vision-based Defect Inspection for Plated Through Hole Components
This study delineates the conceptualization of a machine vision-based defect inspection model, meticulously engineered to confront the intricacies of high-throughput PCB assembly.
Technical Paper

Sponsor

Solve Pad-to-Component Mismatch Without Scrapping Your Assembly
Pad-to-part mismatches can derail production and challenge IPC compliance. The right rework approach can restore reliability and keep builds on track.
Circuit Technology Center

Single Device Traceability in Assembly without ECID
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance.
Technical Paper

Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk

Latest Industry News

Why Consumer Electronics Will Continue to Lead the Edge AI Chip Market

Electronics in the Eye of the Storm

Paul Tudor Jones says U.S. is late to regulating AI: 'We should have already done it'

Jim Cramer says the AI boom has 'the power to keep the country's economy humming'

Turn Your Business Idea Into Reality Faster With AI — Without Costly Mistakes

MORE INDUSTRY NEWS

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Sponsor

You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH