circuit insight
June 19, 2025
The Impact of Harsh Environments and Ionic Contamination on Post-Reflow Circuit Assemblies
The Impact of Harsh Environments and Ionic Contamination on Post-Reflow Circuit Assemblies
Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM).
Analysis Lab
In-Situ Thermal Radiographic Failure Analysis of Capacitor Encapsulant Fracturing
Multiple tantalum capacitors are SMT attached to PCBs. Failures or fractures were observed at contractor SMT assembly lines and not on RTX lines.
Production Floor
Sponsor
Aim-Solder

Bismuth in Solder Alloys
Bismuth is a primary constituent in many low-temp solders. It also serves as an additive element in SAC solders that reinforces joint durability & optimizes wetting characteristics.
AIM Solder
Kinetics of a Layer of Bismuth at the Anode of a Sn-Bi Based Solder Joint
Measurements of the electrical resistance of low temperature solder during current stressing were shown to provide indicators of the thickness of continuous layers of Bi accumulated at the anode.
Production Floor
Living With PB-Free in High Performance Engineering Design
Living With PB-Free in High Performance Engineering Design
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by this material.
Analysis Lab
Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating.
Materials Tech
Sponsor
Master-Bond

Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond
Minimizing Printed Circuit Board Warpage in Assembly Process
Minimizing Printed Circuit Board Warpage in Assembly Process
The purpose of this paper is to present a cleaning process for difficult no-clean, lead-free and high temperature flux residues on reflowed PCBs.
Production Floor
Advanced Substrate Technology for Heterogeneous Integration
The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process.
Analysis Lab
Sponsor
Circuitnet

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
Dross Contamination After Selective Soldering
We have discovered a fine low density dross on PCBs after selective soldering. The dross is difficult to see. Is there an effective way to clean this?
Board Talk
2nd Generation of indium TIM
2nd Generation of indium TIM
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Materials Tech
Materials for Advanced Ball-Attach Processes for Advanced Packages
Materials for Advanced Ball-Attach Processes for Advanced Packages
This paper will discuss advantages of advanced ball-attach materials developed to meet the challenges of advanced packaging.
Materials Tech
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Managing Thermomechanical Behaviour in Automotive Electronics
Managing Thermomechanical Behaviour in Automotive Electronics
With high density interconnection designs, advanced packaging, localised self heating, sources of thermomechanical stress are introducing complex failures.
Production Floor
Selective Soldering Design for Reliability Using SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
The Static Charge Overload
The Static Charge Overload
A plastic molding plant had been running for less than a year. Suddenly parts began testing positive for an electrical charge. What caused it?
Mysteries of Science
Low Temperature Solder-SMT Manufacturability and Quality Considerations
This paper focuses on establishing package warpage boundary conditions and identifying key process parameters for a successful LTS assembly.
Production Floor
Autonomous Vehicles Still Decades Away: 2019
This paper examines the challenges to progress from existing advanced driver-assistance systems to level 4 and 5 autonomous vehicles.
Analysis Lab
Understanding Creep Corrosion Field Fails
Understanding Creep Corrosion Field Fails
Dendrites, Electrochemical Migration and parasitic leakage, can be caused by process related contamination. This paper explores aspects of the creep corrosion chemical reaction.
Analysis Lab
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Materials Tech
Acid Copper Electroplating Processes for Flash Etching
Acid Copper Electroplating Processes for Flash  Etching
The focus of this study was to investigate the underlying mechanism of V-pitting and to develop a process to withstand or resist the pitting.
Production Floor
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MORE INDUSTRY NEWS
Advanced-Interconnections
Sponsor
Aim-Solder

Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics - no trade-offs needed.
AIM Solder
Questions and Comments
Lead Poisoning - Was it from Wine?
Similar as to how tomatoes got their bad rap for ...
Richard Gwaltney, Kyocera-AVX Components Jacksonville
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
As power densities rise, managing localized thermal loads is more ...
Ethan, Summit Interconnect
iNEMI Board Assembly –Press-Fit Technology Roadmap
A very interesting article. UIBEL CONSULTING is participating in the ...
Frank Alexander Uibel, Uibel Consulting
MORE COMMENTS
Master-Bond
Sponsor
Master-Bond

Underfill Epoxy Offers Thermal Conductivity
Master Bond EP29LPTCHT is a low viscosity adhesive that can be used for underfill & encapsulation apps. It offers thermal conductivity & electrical insulation.
Master Bond
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