Electronics Manufacturing and Electronics Assembly

Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question.
Board Talk

In-Line Testing of Highly Panelized PCBAs with Parallel Functional Test
The manufacturing process challenges faced by electronics manufactures producing large panels of small boards is discussed.
Production Floor

6G Mobile Communications to Utilize AI to Control Devices
The 6th generation of mobile communications promises higher data rates, shorter latency, and increased densities of terminal devices..
Technology Briefing

Electrochemical Reliability as a Function of Component Standoff
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance.
Analysis Lab

Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses.
Materials Tech

Enclosed Media Printing as an Alternative to Metal Blades
This paper explores the latest developments in enclosed media print head technology and how it can impact the bottom line.
Production Floor

Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab

Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk

Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech

Smart Algorithm Improves Material Search Efficiency 100x
Researchers have developed a deep learning-based smart algorithm that uses a technique to improve the material search efficiency by roughly 100 times.
Technology Briefing

Fluxless Die Attach by Activated Forming Gas
As demonstrated in the study, the fluxless and oxide-free technology using EA has made it possible to achieve a high quality die attach with zero or near-zero voids.
Production Floor

Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab

Was the Contamination From Silicone?
Black enamel was sprayed onto metal followed by a clear coating when a contamination problems surfaced. What was causing the contamination?
Mysteries of Science

Soft Intelligence Epidermal Communication Platform A Path to A Wearable Future
Wearable electronics will need to be stretchable to a considerable degree which in turn will require an adjusted production strategy for the commercial manufacturing of the products.
Production Floor

Reduce Energy Loss in Electric Vehicles

A new technology has the potential to revolutionize energy storage in electric vehicles and reduce energy loss in the national grid.
Technology Briefing

Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Analysis Lab

Managing blooming in an adhesives process

If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Materials Tech

Assembly of POP with Novel Epoxy Flux on Solder Paste
In this paper, a newly developed epoxy flux, that is compatible with solder paste, was evaluated for assembly and reliability.
Production Floor