Electronics Manufacturing and Electronics Assembly

What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Would the spacing be different for lead-free solder compared to leaded solder? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss these questions.
Board Talk

How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Production Floor

Bifunctional Polymer Allows Strength and Speed in Artificial Muscles
Strength and speed could not be achieved simultaneously because increasing muscle strength slows speed reduces the strength, until now.
Technology Briefing

Copper-Tin Intermetallics: Their Importance, Growth Rate and Nature
This paper will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance.
Analysis Lab

New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
The roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

Selective Reflow Rework Process
This paper discusses some aspects of the process optimization and changes made to improve the quality of the rework process.
Production Floor

A Case Study of Nickel Dendritic Growth on Printed Circuit Boards
This paper is a case study of nickel dendritic growth under moisture condensation condition on freshly produced circuit boards contaminated with sulfuric acid etchant.
Analysis Lab

Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk

Atomristors: Non-Volatile Resistance Switching in 2D Monolayers
Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13.
Materials Tech

Portable Desalination Unit Addresses Drinking Water Shortage
Researchers have developed a portable desalination unit that generates clean drinking water without the need for filters or high-pressure pumps.
Technology Briefing

Protecting the Reliability and Integrity of Electronic Products and Assemblies when Disinfecting for SARS-CoV-2
This paper offers guidance for protecting the integrity of electronic products and assemblies when disinfecting equipment surfaces for SARS-CoV-2 virus.
Production Floor

Crack Propagation Mechanism Study on Bismuth Contained Base Lead Free Solder
The thermal cycling reliability characteristics of solder containing a small amount of Bismuth which is below 4wt% in accordance with the new requirements were investigated.
Analysis Lab

Lightning Stikes in the Chemistry Lab
As a lightning bolt hit near a lab, a blue spark jumped from a radio in the lab room to a student. Was the spark lightning?
Mysteries of Science

Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint.
Production Floor

Demography AI and the Future of Economic Growth

Our lives are shaped by demographic and techno-economic trends. A demographically driven change intersects history’s techno-economic wave.
Technology Briefing

Reliability for High Temperature Power Computing
This experiment considers the reliability of different electronic components and evaluates them on 0.200" power computing printed circuit boards with OSP.
Analysis Lab

Embedded Components: A Comparative Analysis of Reliability

Paper covers a series of comparative analyses, testing the reliability of standard SMT components vs their embedded counterparts.
Materials Tech

The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor

Supplier Spotlight

ECI Technology, Inc.
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ALL Circuits
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Circuit Check Inc.
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Corelis, Inc.
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Board Talk

Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components

Moisture Barrier Bag Issues

Calculating Failure Rate During Rework

Can Mixing Wave Solder Pallets Cause Contamination?

Can Silver Cause Solder Embrittlement?

How to Reduce Voiding on QFN Components

Can Water Contamination Cause Failure?

Do BGA Components Warp During Reflow?

MORE BOARD TALK

Questions and Comments

Stencil Aperture Design for Next Generation Ultra Fine Pitch Printing

In this paper you claim that the area of a ...
Dennis Cote, Harding Instruments

What is Causing Long-Term Soldering Joint Cracking in Automotive Application?

Just wondering if the connector solder tails are plated with ...
Bill Belanger, Janco Electronics, Inc.

What is Causing Long-Term Soldering Joint Cracking in Automotive Application?

Hand soldering should not be allowed for professional electronics, including ...
Claus W. Nielsen, E-Consult International ApS

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