Electronics Manufacturing and Electronics Assembly

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Unlock Operational Success with Insights from Global Leaders
4-part series focused on achieving excellence while facing the operational challenges of advanced electronics and SMT manufacturing. No registration required.
Intraratio

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Contamination From Anti-static Foam

Organic Flux Residue Concerns

Lifted Lead on SOT Component

Ultrasonic Cleaning and Surfactants

Frequency of Temperature and Relative Humidity Tracking

Pin-in-Paste Hole Stencil Printing

Pre-bake in a Vacuum

Considering Plasma Cleaning

MORE ASK THE EXPERTS

Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Technical Paper

Process Characterization for Acceptable Levels of Flux
Analysis of residues and their effects has shifted from a global examination of ionic residues to a more site-specific examination of spot or local contamination.
Technical Paper

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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk

An Interesting Approach to Yield Improvement
The approach involves spending a little more money than normal at the start of project and the results show savings of many times more than this outlay.
Technical Paper

Pre & Post Solder AOI for THT
By implementing and automated THT AOI solution, first pass yields improve due to standardized consistent inspection results, increased margins by reducing labor for inspection and rework, production optimization and traceability data is automatically generated for analysis in real time.
Technical Paper

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Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.

Inline Assembly of Flex PET Circuits
This work further explores photonic soldering of PET flex circuits in the context of high-volume production.
Technical Paper

A Close look at IPC X-Ray Inspection Guidelines for BGAs
The massive amount of measurements and qualitative information provided by CT-Xray systems can now enable more inspections to be easily automated, ultimately reducing the burden on engineers. With access to this impressive technology, tighter processing parameters can be maintained to ultimately ensure higher quality electronic products for a variety of markets.
Technical Paper

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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Removing Warpage from PCBAs
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss their recommendations.
Board Talk

Predicting Mid-Chip Solder Balling
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling.
Board Talk

Impact of PCB Manufacturing, Design, and Material to PCB Warpage
This paper will use high temperature warpage metrology to evaluate the impact that PCB manufacturing, design, and material has on BGA and panel area PCB warpage.
Technical Paper

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Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.

Do We Need to Switch to Type 5 Solder Pastes?
The experiment should find the optimum printer parameters, compare type 4 vs. 4.5 vs. 5 solder paste and 4 different stencils.
Technical Paper

Void Reduction in Reflow Soldering Processes by Sweep Stimulation
The insights of the feasibility study were the basis for the integration of the voidless technique into an industrial production process.
Technical Paper

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Cut Your SAC305 Costs with REL61 Alloy
Silver prices have tripled. While silver is 2/3 of SAC305's cost, it's only 1/4 of REL61. Save hundreds of thousands annually with this proven, drop-in alternative.
AIM Solder

New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Technical Paper

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MORE INDUSTRY NEWS

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Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.

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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD