Technical Papers
Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes
An Essential Guide to Optimize Selective Soldering Processing
Is My Printed Circuit Board Wash Concentration in Check?
Ultraminiature Soldering: Techniques, Technologies, and Standards
X-Ray Inspection Verifies Quality of Complex PCBs
Cold Underfill Component Removal
Cleaning Performance Evaluations for Jettable Pastes for Advanced SMT Assembly Processes
Dispensing 2-Part Adhesives
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Spotify is shutting down Car Thing in December, and owners are begging for an SDK
Former IBM Chief Accessibility Officer envisions digital inclusion transformation for Taiwan's manufacturing industry
Absolics becomes first materials firm to get US CHIPS Act subsidy
Indonesia's smartphone market surges, Transsion gains ground, Apple dominates premium segment
Foxconn to make Pixel smartphones in India
MORE INDUSTRY NEWS
May 28, 2024
Can High Particle Concentrations Impact PCB Assembly?
Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk
Use of High Purity Water to Eliminate Contamination And Achieve Cleanliness
This paper discusses how high purity DI water can be produced at lower costs using a DI recycling approach in PCB production.
Production Floor
Wearable Devices to Operate Robotic Exoskeletons
Wearable Devices to Operate Robotic Exoskeletons
A team has developed a wearable, stretchy patch about the size of a BandAid, which sticks to your skin and picks up tiny signals coming from human muscles.
Technology Briefing
Impact of BGA Escape Trace Design on Performance of Solder Joint
In this paper, a comprehensive study is presented to demonstrate the impact of different BGA escaping trace design cases on solder joint reliability.
Analysis Lab
The Impact of the Gold Layer Thickness on Layer Properties
The Impact of the Gold Layer Thickness on Layer Properties
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives.
Materials Tech
The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor
Quantitative Analysis of Corrosion Resistance
An electrochemical method via sequential electrochemical reduction analysis instrument to quantify the corrosion resistance of the EN deposit is proposed.
Analysis Lab
Trouble With Skewed DPAK Components
Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk
75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures.
Materials Tech
Robots Begin to Develop Common Sense Knowledge
Robots Begin to Develop Common Sense Knowledge
MIT engineers are working to give robots a bit of “common sense” when faced with situations that push them off their trained paths.
Technology Briefing
Process Control and Reliability of Reworked BGA Solder Joint
This paper discusses the work done in identifying the key features for the right BGA rework equipment.
Production Floor
Embedded System Access
This paper discusses test access methodologies and elaborates on Embedded System Access strategies in particular.
Analysis Lab
Was Sodium Causing Factory Fires?
Was Sodium Causing Factory Fires?
One summer a factory producing coloring dyes was experiencing many alarms signaling a fire. What was causing these fires?
Mysteries of Science
Continuous Improvement: The Task That Never Ends in the Cleaning World
This paper investigates new processes that achieve cleaning effectiveness while balancing the environmental, human, and machine impacts for longevity.
Production Floor
Unleash the Unexpected for Radical Innovation
Unleash the Unexpected for Radical Innovation
The accelerometer chip is ubiquitous in digital devices. Its true impact didn't become apparent until many of today's most valued applications were developed.
Technology Briefing
BTC-QFN Test Board Design for Qualifying Soldering Materials
This research uses a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components.
Analysis Lab
Dissolution Rate of Specific Elements in SAC305 Solder
Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Materials Tech
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor
Board Talk
Can High Particle Concentrations Impact PCB Assembly?
Trouble With Skewed DPAK Components
Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
Moisture Barrier Bag Issues
Calculating Failure Rate During Rework
Can Mixing Wave Solder Pallets Cause Contamination?
Can Silver Cause Solder Embrittlement?
How to Reduce Voiding on QFN Components
MORE BOARD TALK
Questions and Comments
Can Silver Cause Solder Embrittlement?
I worked with boards and cabling for over 30 years. ...
Dave Good
Cause of Long-Term Soldering Joint Cracking in Automotive Application
Consider also the solder alloy. These failures occurred within the ...
Ike Sedberry, ISEDS
Cause of Long-Term Soldering Joint Cracking in Automotive Application
Is the failing pin at the same location, such as ...
Wallace Huson Ables, Dell Technologies
MORE COMMENTS
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