Electronics Manufacturing and Electronics Assembly

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PCBA Cleaning Process Decisions Made Easy
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ZESTRON Europe

Technical Papers

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

MORE TECHNICAL PAPERS

Ask the Experts

BGA Placement Paste or Only Flux

BGA BAll Sheer Testing

Hand Soldering at Low Temperature

Spotting After DI Water Cleaning

Cause of Green/Blue Oxide Buildup

Floor Life of MSD Parts

Reflow Oven Calibration Schedule

Trichloroethylene Alternative

MORE ASK THE EXPERTS

Design Considerations That Influence LED Solder Joint Reliability
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA.
Technical Paper

Insulation Between Overhanging Component Lead and Circuit Conductor
We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor?
Board Talk

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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering

Low Temperature Soldering: Reflow Enhanced Mechanical Reliability
In this work, we further discuss solderability and mechanical reliability of a novel low temperature proprietary alloy (generically called as X46).
Technical Paper

Investigation into Low Temperature Solder Reliability
This paper presents an examination of three low temperature solders and provides a comparison with tin-silver-copper solder.
Technical Paper

Conformal Coating Prevention and Analysis of Resistor Silver Sulfide Corrosion
This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions. Physical analyses were completed to investigate possible differences in the failure mode at the various FoS test temperatures.
Technical Paper

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Low Temperature SMT Solder Evaluation
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Technical Paper

Blow Holes After Switching from Lead-Free HASL to ENIG
After switching our PCB finish from lead-free HASL to ENIG blow holes started occurring in the solder joints of the through-hole LEDs. The PCBs and LEDs are from the same suppliers as before, only the finish changed.
Board Talk

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Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
The industry standard for accelerated temperature cycling, IPC-9701B, defines test conditions for characterizing solder interconnect fatigue. The document specifies a maximum cycling ramp rate of 20 °C/minute to avoid thermal shock conditions that can accelerate failure modes other than low cycle fatigue in the bulk solder.
Technical Paper

Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used.
Technical Paper

Challenges Reliably Soldering Large Ground Pad on LGAs
We are experiencing difficulties reliably soldering large ground pad on land grid array packages using a single large window as a stencil. Should we use all four windows?
Board Talk

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Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies

Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.
Technical Paper

Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions.
Technical Paper

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Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Intentional contamination of PWBs offers a practical and controlled approach for evaluating cleanliness analysis techniques and for developing meaningful and effective cleanliness guidelines.
KYZEN

Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Technical Paper

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Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

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Implement Engineering Changes Without Production Delays
Design revisions are a normal part of manufacturing, but they don’t have to disrupt production. Circuit Technology Center delivers fast PCB rework services.
Circuit Technology Center

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