Electronics Manufacturing and Electronics Assembly

Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Stencil Pattern for Thermal Pads on QFNs

Component Shifting

What Is Causing Connectors to Bow?

Cleaning No-Clean Solder Paste

Solder Paste Alloy Check

Challenge Wetting Solder to Brass Pins

Class 3 Cleaning Requirements

Mixing Different SAC305 Solders

MORE ASK THE EXPERTS

Assembly Optimization for Thin Flip-Chip Chip-Scale Packages
In this study, PC board design and solder stencil designs are evaluated for board attach defectivity for core-less FCCSP packages. It is observed that with properly engineered package materials and mechanical configuration, as well as optimization of PC board pad design, a robust board assembly solution exists for thin FCCSP packages.
Technical Paper

Non-Toxic Stabilization for Mixed Reaction Gold
In this paper a novel gold electrolyte with autocatalytic properties is introduced. It is capable of depositing high layer thicknesses and defect-free ENIG deposits.
Technical Paper

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk

Fluxless Reflow Technology for Fine-Pitch and SMT-Level Component Attach
The objective to be discussed in this paper is to determine a solution for component attach in a formic acid environment with the appropriate combination of soldering material and equipment.
Technical Paper

Beyond ECM Additional Reasons for Cleaning Circuit Assemblies
The level of importance of a clean circuit assembly has been demoted. How did the cleanliness of circuit assemblies, once required, get shoved aside?
Technical Paper

Sponsor

Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering

A Near-Eutectic Sn-Bi Low-Temp Alloy with Thermal Fatigue Resistance
This study reports a new near-eutectic Sn-Bi-based low-temperature solder alloy (Bi+) which can reflow between 165°C and 190°C.
Technical Paper

High Speed Transmission Characteristics on RDL Interposer
This paper presents the demonstration of RDL interposers with fine pitch firing and low loss dielectric layers.
Technical Paper

Sponsor

Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.

Removing Warpage from PCBAs
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss their recommendations.
Board Talk

Predicting Mid-Chip Solder Balling
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling.
Board Talk

Assembly and Reliability of a Novel High Density Dual Row MaxQFP
The paper focuses on all aspects of SMT assembly of the MaxQFP. The robustness of the assembly in automotive type board-level thermal cycling will be demonstrated.
Technical Paper

Sponsor

Affordable Excellence - iS6052 AOI
The latest addition to Viscom's esteemed lineup of AOI systems. This new system offers a compelling option for manufacturers looking to enhance their PCB inspection processes.
Viscom

Enhance the Shock Performance of Ultra-Large BGA Components
A study on the rubber standoffs and gaskets. The effectiveness of rubber standoffs and rubber gaskets as shock/vibration mitigation have been evaluated.
Technical Paper

Not All Things Are Created Equal - OSP and Cleaning Chemistries
To better understand OSP and de-flux interactions, a study of OSP with four different de-flux cleaning chemistries is discussed.
Technical Paper

Sponsor

pH Employment in Electronic Cleaning
The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Download now.
KYZEN

Complex Board Design Induced Solder Separation Failure
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. An in-depth analysis on the solder joint microstructure utilizing Electron-backscattered diffraction (EBSD) supports the test results leading to the mechanism associated with the solder separation failure.
Technical Paper

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MORE INDUSTRY NEWS

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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

Sponsor

Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions