Electronics Manufacturing and Electronics Assembly

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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

How Many Fiducials Per Solder Paste Stencil?

Solder Alloy Investigation

Reliability Concerns When Converting to Lead-free

Contamination Using Solvent Dispensers

Mixed Process Solder Joint Appearance, Smooth or Grainy?

What Caused SMT Pads to Oxidize After Reflow

Viscosity of Solder Paste Before Printing

Solder Splashing During Wave Soldering

MORE ASK THE EXPERTS

Heterogenous Integration using Fan-out Wafer-level Packaging Technology
An overview of packages having multiple die along with double-sided build up layers will be presented. This technology can provide high module yields.
Technical Paper

How to Manage Material Outgassing in Reflow Oven
This study investigates the evaporation of chemicals during the reflow process from preheating until cooling. Different solder pastes are compared.
Technical Paper

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Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology

The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards.
Board Talk

Hybrid Sintering for High-power Density Devices Aerospace Applications
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications.
Technical Paper

Extending 3D MRS Sensor Technology to Address Challenging Applications
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets.
Technical Paper

Sponsor

How pH Cleaning Agents Affect Production Performance
Establishing a reliable cleaning process requires a good understanding of all influencing factors, including pH, and defining the correct balance to meet final product reliability.
KYZEN

High Performance Light and Moisture Dual Curable Encapsulant
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Technical Paper

How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Technical Paper

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk

Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk

Ultra Low Profile Copper Foil for Very Low Loss Material
A new almost no profile copper foil has been developed to achieve this property while maintaining a good adhesion with low loss resins. Electrodeposited copper foil production is divided in two steps. First, the foil is plated on a titanium drum from a copper sulfate solution. Then a treatment is applied to increase roughness and ensure oxidation resistance.
Technical Paper

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The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect

Comparison of Contemporary Stencil Coatings and Under Wipe Solvents
The tests examined the effects of wiping on different sized packages, different wipe frequencies, and different wipe chemistries.
Technical Paper

Establishing Design Rules for the Laser Depaneling of Printed Circuit Boards
This paper presents design guidelines for laser depaneling such as contour limitations as well as required channel widths and component distances to the cutting edge.
Technical Paper

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High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch

Surface Finish Can Achieve Robustness Against Copper Creep Corrosion
We evaluate conventional surface finishes i.e., ENIG, ImmSn, HASL, OSP, and novel Ni-free surface finish for their robustness against creep corrosion.
Technical Paper

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MORE INDUSTRY NEWS

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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC