circuit insight
Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk
Effects of Substrate Material and Package Pad Design on Solder-Joint Reliabilty
This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications.
Technical Paper
Sponsor
BEST-Inc.

Bring IPC Training to Your Facility
Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team.
BEST Inc.
Bi-Based Solders for Low Temperature to Reduce Cost and Improve Yield
The use of BiSnbased solder paste improves the BGA solder joint yield relative to SAC based solder pastes during low temperature reflow soldering.
Technical Paper
Reliability of Polymeric Encapsulation Materials on SnAgCu Solder Joints
This study determined the processability, mechanical and temperature cycle reliability of SAC BGA solder joints reinforced by encapsulation using SJEMs.
Technical Paper
Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste.
Technical Paper
Sponsor
Circuit-Technology-Center

Tech Paper - Keys to Component Lead Tinning Success
This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques.
Circuit Technology Center
Can Silver Cause Solder Embrittlement?
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario.
Board Talk
3D Printed Electronics for Printed Circuit Structures
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
Technical Paper
Sponsor
AI-Technology-Inc

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
Semi-Additive Process for High Frequency Signal Substrates
A new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions is covered.
Technical Paper
Effect of Thermal Cycling on Subsequent Drop Behavior of Assemblies
This paper presents the effect of a priori thermal cycle on subsequent drop to failure behavior of CGAs with 1272 columns.
Technical Paper
Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
Technical Paper
Sponsor
Aim-Solder

Reliable Solder Performance for Less Silver
Stop overpaying for silver. REL61 offers equivalent mechanical strength and thermal stability to SAC305 with a decade of field-proven success. Switch without the risk.
AIM Solder
What is Considered Acceptable PCB Rework and Repair?
An operator attempted to repair three damaged conductors using bus wire overcoated with epoxy. Do you consider this repair acceptable?
Board Talk
Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
Technical Paper
Sponsor
Nordson-ASYMTEK

A Lifespan of Reliability
Nordson Electronics Solutions makes reliable electronics an everyday reality. Selective soldering, dispensing, coating, and plasma solutions.
Nordson Electronics Solutions
Assembly Reliability of TSOP/DFN PoP Stack Package
This paper presents thermal cycle reliability evaluations of 2-high and 4-high 3D stacks built with a mix of TSOP and DFN daisy-chain package assembly.
Technical Paper
Latest Industry News
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kyzen
Sponsor
Glenbrook-Technologies

X-Ray Inspection Verifies Quality of Complex PCBs
A Netherlands-based PCB supplier relies on real-time X-ray inspection to ensure the quality of HDI, hybrid, multi- layer, flex-rigid & other complex boards.
Glenbrook Technologies
Viscom-SE
Sponsor
Circuitnet

Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC
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