Electronics Manufacturing and Electronics Assembly

Sponsor

Touchless Solder Ball Removal
Watch our video showcasing touch-free BGA component deballing. This revolutionary approach achieves unparalleled reliability and precision when preparing BGA components for re-balling.
Circuit Technology Center

Technical Papers

Recycling vs Circularity: Minimising E-Waste in Manufacturing

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

Probe Card Manufacturer 'Sees the Unseen' With X-ray

Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods

An Eight-Step Methodology for Bringing a Process Under Statistical Control

Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel

Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry

Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment

MORE TECHNICAL PAPERS

Ask the Experts

Cleaning Under Low Clearance Components

What Is This Contamination?

Baking Old PCBs Prior To Reflow

A Generic Reflow Profile

Organic Flux Residue Concerns

Reflow Profile for Mixed Lead-Free and Leaded

Solder Joint Blow Holes

Cleaning No-Clean Solder Paste

MORE ASK THE EXPERTS

March 20, 2025

Artificial Intelligence and Its Role in Improving Automated Optical Inspection

With the help of AI we hope to ease the workload of engineering and operation teams while also improving labor cost, efficiency, and product quality. After reviewing the four AI use cases presented in this paper, it is very apparent the overwhelming benefit AI can have with our AOI process and programs.
Production Floor

Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor

Sponsor

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD

Heterogeneous Data Teaches Robots Range of Tasks
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks.
Technology Briefing

Board Level Reliability of Large Body Size WlCSP for Automotive Applications
This paper will outline the board-level assembly development and reliability that was undertaken to demonstrate this WLCSP could meet the demands of automotive.
Analysis Lab

How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.
Materials Tech

Sponsor

Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond

In-Line Testing of Highly Panelized PCBAs with Parallel Functional Test
The manufacturing process challenges faced by electronics manufactures producing large panels of small boards is discussed.
Production Floor

A Method to Investigate PCB Supplier Rework Processes and Best Practices
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality.
Analysis Lab

Sponsor

Enhance Your Project with Expert Assembly
Bring your designs to life with PCBWay's expert assembly services. You'll benefit from fast turnaround times, high-quality components and rigorous testing.
PCBWay

Calculating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework on one SMT part? Phil Zarrow and Jim Hall, also known as The Assembly Brothers, offer their own expertise and experience when answering this question.
Board Talk

Novel Lead-Free Solder Alloys Based on Sn-Ag-Cu-Sb
In this work, thermal performance of five Sn/3.2Ag/0.7Cu/xSb (x is in the range of 4.5 to 6.5 wt.%) alloys were compared to select the optimized Sb content.
Materials Tech

Palm Size Portable 3 Printer
Imagine a portable 3D printer you could hold in your palm. The tiny device could enable a user to rapidly create customized, low-cost objects on the go.
Technology Briefing

Sponsor

Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic

QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.
Production Floor

Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection
The reliability of castellated vias as a rigid-flex interconnection method is evaluated. This is split into metallurgical aging of joints and investigating mechanical robustness/integrity.
Analysis Lab

Sponsor

How solder ball technology can facilitate QFP device transition
Unique application of solder ball technology facilitates QFP to BGA device transition on PC boards with existing QFP pads, eliminating solder processing issues.
Advanced Interconnections Corp.

The Metallic Paint Secret
A technician determined how super-bright metallic paint was made without analyzing the material. How could this be done?
Mysteries of Science

Reservoir Printing in Deep Cavities
Guidelines for stencil designs and aperture placement in cavities are presented, including stencil design, paste material, experimentation, and results.
Production Floor

America Risks Losing Its Status As the Most Innovative Place on Earth
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography.
Technology Briefing

Analyzing 0402 Capacitor Defects With Stencil Printing Misalignment
This study investigated the cause of tombstoning for 0402 capacitors in surface mount technology. Statistical analysis methods were used to determine if there was any difference.
Analysis Lab

Low-Voiding High-Reliability Lead-Free Solder Paste for Automotive
A novel lead-free solder paste, Durafuse® HR (DFHR), has been developed using Durafuse® technology.
Materials Tech

Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers

To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, without compromising quality, cost, and throughput.
Production Floor

Reclaim Valuable Components Quickly!

Do you have BGA, QFP, or LGA components that meet your needs but are currently soldered to obsolete PCBs? We can salvage components from PCBs and place them on reels for reassembly.

LEARN MORE

Latest Industry News

Nvidia CEO Huang Says He Was Wrong About Timeline for Quantum

VIEWPOINT 2025: Shoich Rashed, Sales Director, Mek (Marantz Electronics)

Electronics Manufacturers Double Down on Sustainability Efforts Despite Challenges

Huawei's $1,000 foldable will run self-developed HarmonyOS 5 as it pushes Apple, Google alternative

Forget Apple Intelligence, Siri doesn't even know what month it is

MORE INDUSTRY NEWS

Sponsor

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.

Questions and Comments

Palm Size Portable 3 Printer

Impressive start. I look forward to further reports on the ...
Jaye Waas, Renkus-Heinz

Impact of PCB Manufacturing, Design, and Material to PCB Warpage

Symmetrical stack ups and copper distribution is key to maintaining ...
Gerry Partida, Summit Interconnect

Additive Manufactured Electronics for Next Generation Microelectronics

AME is necessary to manufacture advanced electronics do to need ...
Voya Markovich

MORE COMMENTS

Sponsor

Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics—no trade-offs needed.
AIM Solder

"I'd like to give you a raise and promotion, but that wouldn't be fair to others who don't stay late or work as hard as you."
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