Technical Papers
Cleaning Performance Evaluations for Jettable Pastes for Advanced SMT Assembly Processes
Dispensing 2-Part Adhesives
Advanced Materials in Power Electronics
The Impact of Thermocouple Attachment Methods on Thermal Profiling Accuracy
Utilizing SIR and Analytical Tools to Determine Impact to Reliability for Process Improvements
Factors Affecting the Cost of PCB Fabrication
The Critical Role of RHSD in High-Reliability Applications
Advanced High Frequency PCB Materials
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Google to Start Manufacturing Pixel Smartphones in India by Next Quarter
VIEWPOINT 2024: Andrew Williams, Director of Product Engagement, PRIDE Industries
Intuitive Machines lands on moon in nail-biting descent of private Odysseus lander, a 1st for US since 1972
How Home-Based Startups Harness Supply Chain Tech
Profiteering Hampers U.S. Grid Expansion
MORE INDUSTRY NEWS
February 22, 2024
PCBA Cleaning with Sodium Bicarbonate
PCBA Cleaning with Sodium Bicarbonate
Is there an effect on PCBA long-term reliability when cleaned with a sodium bicarbonate scrub followed by DI water rinse? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this secnario and share their own experiences.
Board Talk
Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
Production Floor
AI and Precision Agriculture Address Farming Problems
AI and Precision Agriculture Address Farming Problems
Automation with biology and chemistry to create a farming revolution which enabled a fraction of the population to deliver more than had formerly produced.
Technology Briefing
Developing a Low Palladium Activation System for Electroless Copper Deposition
This paper summarizes experiences gained while developing a new cost effective Palladium containing ionic activation system.
Analysis Lab
Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech
Condensation Testing - A New Approach
The data for a range of conformal coatings are correlated back to the material type, and coverage and thickness by cross-sectioning.
Production Floor
Process Characterization for Acceptable Levels of Flux
Analysis of residues and their effects has shifted from a global examination of ionic residues to a more site-specific examination of spot or local contamination.
Analysis Lab
Solder Paste Inspection - When and Why
Solder Paste Inspection - When and Why
Our facility is considering a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one?
Board Talk
Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Materials Tech
Solar Desalination System Turns Saltwater to Drinkable Water
Solar Desalination System Turns Saltwater to Drinkable Water
New research, just published in the journal Joule, outlines the design for a new solar desalination system that takes in saltwater and heats it with natural sunlight.
Technology Briefing
Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
Production Floor
Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
Failures in PCBs account for a significant percentage of field returns. Studies have found that path formation is often along the glass fiber to epoxy matrix interface.
Analysis Lab
Flying Saucer Over The Factory
Flying Saucer Over The Factory
At a new circuit factory an employee heard a thud and saw a bright metal dome-shaped object falling from the sky. Where did it come from?
Mysteries of Science
Choosing the Right Stencil Options
Quality and yield are directly linked to the solder printing process. A constant paste depot is critical to a stable soldering process.
Production Floor
A Better Way to Pilot Emerging Technologies
A Better Way to Pilot Emerging Technologies
For companies adopting a particular technology, it’s much harder to quantify the value of emerging technologies that are not yet being widely used.
Technology Briefing
Mechanical Behavior of Bi-Containing Pb-Frees
The objective of this research was to characterize the mechanical metallurgy of alternative solder alloys for high-reliability applications.
Analysis Lab
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech
Development of a Robust 03015 Process
This paper reviews major steps considered and taken for the development of a robust 03015 process. It focuses on the activities for the solder paste print process.
Production Floor
Board Talk
PCBA Cleaning with Sodium Bicarbonate
Solder Paste Inspection - When and Why
Big Problems with HASL Finish
Will Typical No Clean Paste Pass an SIR Test?
Shelf Life Before Conformal Coating
Consensus for Baking Prior to Rework?
Cleaning Reballed BGA Components
What is Causing Dimples in Blind Via Pads?
MORE BOARD TALK
Questions and Comments
Big Problems with HASL Finish
HASL flux will easily remove fingerprints from either brushed or ...
Gregory York, BLT Circuit Services Ltd
Big Problems with HASL Finish
It could be any number of things, but if it's ...
Bradley Fern, Entrust
Reflow For Rigid Flex
I just felt that it should be mentioned that IPC-1601 ...
Bill Belanger, Janco Electronics, Inc.
MORE COMMENTS
Cartoon
"There's going to be a lot of finger pointing around here and I'd like to put you in charge. You have exquisite hands."
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