Electronics Manufacturing and Electronics Assembly

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Solder Splashing During Wave Soldering

ENIG Solderability Issues

Solder Paste Mixing

Polyurethane Conformal and Acrylic Coating on the Same PCB

Conformal Coating in Nitrogen Environment

Double Sided Reflow for Micro BGA Components

Baking After Cleaning Hand Placed Parts

MORE ASK THE EXPERTS

Non-Contact Measurement of Conformal Coating Thickness
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces. In this work, conformal coating wet and dry thicknesses were measured using CCM and traditional methods. FR4 boards with varied color solder masks and components were created for realistic use cases.
Technical Paper

Solder Paste: Fundamental Material Property / SMT Performance
Aggressive form factors, reducing pitch, thinner packages, and larger die to package ratios are leading to higher package warpage during SMT reflow.
Technical Paper

Sponsor

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies

D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
This study looks at an analysis of why a D-PAK exhibits more voiding than other types of BTCs. Voiding results based on an analysis of several process variables.
Technical Paper

What is Considered Acceptable PCB Rework and Repair?
An operator attempted to repair three damaged conductors using bus wire overcoated with epoxy. Do you consider this repair acceptable?
Board Talk

Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk

Sponsor

High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering

Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Technical Paper

A Fracture Mechanics-Based Approach to Simulate Die Pick-up Process
This paper provides a procedure to simulate die pick-up process based on contact-debonding fracture mechanics approach.
Technical Paper

Sponsor

Is your PCB surface finish surviving the wash?
Aqueous cleaning can stain or strip ImSn, ImAg & ENIG finishes. Get test data on protecting surface finish integrity post-reflow.
ZESTRON Americas

Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Technical Paper

Protecting the Reliability and Integrity of Electronic Products and Assemblies
The COVID-19 crisis has prompted increasing inquiries on how to disinfect electronic equipment and assemblies without detrimental impact on the electronics.
Technical Paper

Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk

Sponsor

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.

High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
This paper introduces line confocal technology that was developed to characterize 3D features of surface and material types at sub-micron resolution.
Technical Paper

Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint.
Technical Paper

Sponsor

Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN

Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package
Lower-temperature paste can be reflowed under a relatively lower peak temperature profile and outperform SAC305 paste in the current WLP256 application.
Technical Paper

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MORE INDUSTRY NEWS

Sponsor

What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK

Sponsor

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

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