Technical Papers
Electroless Copper Coverage in Small BVH for Fine Pattern SAP
Brazilian EMS Firm Ensures Quality with X-Ray Inspection
Selective Soldering: A Need for Innovation and Development
Overcoming Mini-LED Paste Printing Challenges
Stencil Cleaning - The Basics of Cleaning Series Part 3
Counterfeit Components Identified With X-ray Inspection
Semiconductor Device Programming
Thermally Conductive Molding Significantly Improves Performance and Reliability
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
IBM Wants to Build a 100,000-Qubit Quantum Computer
China's Lenovo shrugs off concerns that global PC market is shrinking
Stitching Together A Multi-Layer PCB PDN
Cars That Can See at Night Will Save Lives
MEMs Sensors Play Role in Supply Chain Management
MORE INDUSTRY NEWS
May 25, 2023
How Many Fiducials Per Stencil
How Many Fiducials Per Stencil
We have seen as many as 180 fiducials per stencil with a step and repeat. How many fiducials are recommended for a solder paste stencil? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question and share their own experiences.
Board Talk
Choosing the Right Stencil Options
Quality and yield are directly linked to the solder printing process. A constant paste depot is critical to a stable soldering process.
Production Floor
Ferroelectric Semiconductor Demonstrates Reconfigurable Transistor
Ferroelectric Semiconductor Demonstrates Reconfigurable Transistor
A team at the University of Michigan has demonstrated a reconfigurable transistor which uses a revolutionary new ferroelectric semiconductor material.
Technology Briefing
Study on Solder Joint Reliability of Fine Pitch CSP
In the future more fine pitch CSP components will be required. However, product reliability has been a big challenge with the fine pitch CSPs.
Analysis Lab
Nano Silver Replacement for High Lead Solders
Nano Silver Replacement for High Lead Solders
This paper details mechanical and reliability testing of joints made with materials under a range of temperature, pressure and atmosphere.
Materials Tech
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
This paper presents the studies on flip chip thermo-compression bonding (TCB) of gold stud bumps on MID substrate.
Production Floor
Signal Loss in a High Speed High Frequency Transmission Line
High speed transmission applications in electronic product have become a developing trend and one of the most important issue in the electronic industry.
Analysis Lab
Solder Paste Inspection - When and Why
Solder Paste Inspection - When and Why
Our facility is considering a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one?
Board Talk
The Basics of Metal Thermal Interface Materials (TIMS)
Advancements in metal patterning have improved the effectiveness of metal TIMs by improving their compressibility.
Materials Tech
Lithium-Air Battery Offers Longer Range for Vehicles
Lithium-Air Battery Offers Longer Range for Vehicles
Researchers have developed a lithium-air battery that could make that a reality that could power an electric vehicle for more than a thousand miles.
Technology Briefing
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor
HALT Testing of Backward Soldered BGAs on a Military Product
This study evaluates reliability in a production design. Functional assemblies were built using Pb-free BGAs in a SnPb solder process and subjected to life testing.
Analysis Lab
Mystery of the Vanishing Foam
Mystery of the Vanishing Foam
A lab developed a new type of foam mattress. Samples were shipped to a customer, but upon arrival the foam had disappeared. What happened?
Mysteries of Science
Investigating the Metric 0201 Assembly Process
This paper will look at the challenges of assembling the M0201 component in a high-volume manufacturing environment.
Production Floor
Plastic Alternative That Disintegrates on Demand
Plastic Alternative That Disintegrates on Demand
New research reported in the journal ACS Sustainable Chemistry & Engineering has created a sturdy, lightweight material that disintegrates on-demand.
Technology Briefing
Simulation of Embedded Component
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level.
Analysis Lab
Optimizing Insulated Metal Substrate Application
Optimizing Insulated Metal Substrate Application
The growth in insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application.
Materials Tech
Converting Cable Assembly to Lead Free Solder
This paper reviews soldering applications associated with cable assembly. The focus is on process modification and qualification with lead free solders.
Production Floor
Supplier Spotlight
SEICA SpA
Founded in 1986, Seica S.p.A. is a global supplier of ...
AsteelFlash Group
AsteelFlash is an international electronic manufacturing services (EMS) company. Favoring ...
Machine Vision Products, Inc.
On the forefront of technology since its inception, Machine Vision ...
XJTAG
XJTAG is a leading supplier of IEEE Std. 1149.1 compliant ...
FULL SUPPLIER DIRECTORY
Board Talk
How Many Fiducials Per Stencil
Solder Paste Inspection - When and Why
PCBA Cleaning with Sodium Bicarbonate
Will Typical No Clean Paste Pass an SIR Test?
Big Problems with HASL Finish
Consensus for Baking Prior to Rework?
Shelf Life Before Conformal Coating
What is Causing Dimples in Blind Via Pads?
MORE BOARD TALK
Questions and Comments
Issues Mixing Silicone and Acrylic Conformal Coatings
Silicones are primarily used for thermal resistance, flexibility, and a ...
Rick Perkins, Chem Logic
V-Score and Depanel in One Step
IPC-782 doesn't exist anymore. It was superseded in 2005 by ...
Frank, PIEK
Help With Lead to Hole Ratio
On top of above, You also need to consider the ...
Gabriele Sala, GSC
MORE COMMENTS
Cartoon
"I am NOT sexist! I hired cheerleaders because they cost less than a motivational speaker."
Copyright © Randy Glasbergen