Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk
|
|
Addressing Low-Temperature Rework Concerns
This paper will detail the material properties and rework considerations of using a eutectic tin/bismuth solid wire and SAC305 flux cored wire in a rework setting.
Technical Paper
|
|
|
|
|
|
|
|
|
|
| Sponsor |
|
Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
|
|
|
|
|
|
| Sponsor |
|
Remove Underfilled BGAs Without the Risk
Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal.
Circuit Technology Center
|
|
DRAM damage due to X-Ray Inspections Post PCB Assembly
This paper outlines several mitigation strategies for minimizing radiation dosage during X-ray inspections, particularly in the context of printed circuit boards (PCBs). One key observation is that the PCB itself acts as an effective shield, significantly reducing radiation exposure.
Technical Paper
|
|
Understanding and Prediction of Bi Electromigration
This paper will review an effort to describe the expected microstructures in use case settings as well as a model to predict effective Bi boundary layer conditions created during current stress. The estimates will be compared with actual accelerated samples and the impacts of the current stress plus thermal aging on solder joint mechanical performance.
Technical Paper
|
|
|
|
| Sponsor |
|
Toughened, Non-Drip Epoxy
Master Bond Supreme 121AOND is a toughened, heat curing adhesive for bonding and sealing applications that offers chemical resistance and a high glass transition temperature.
Master Bond
|
|
|
|
|
|
| Sponsor |
|
iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
|
|
|
|
