Electronics Manufacturing and Electronics Assembly

Sponsor

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Solder Paste Alloy Check

Challenge Wetting Solder to Brass Pins

Class 3 Cleaning Requirements

Mixing Different SAC305 Solders

Rework of Underfilled Array Packages

What Causes Solder Balls During Rework?

Advise and suggestions for assembly using 01005 capacitors.

Selective Printing for BGA Components

MORE ASK THE EXPERTS

A.I. Deployment in Verification Tool for Inspection Equipment
AI has been deployed in the verification tool with studies conducted to compare the effectiveness and efficiency of the tool versus human operation.
Technical Paper

Isothermal Aging of BGA Packages Using Doped Lead Free Solder Alloys
This paper evaluates the long term aging effect of various doped lead free solders built using Megtron6 substrate under other, different aging conditions.
Technical Paper

Sponsor

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology

The Effect of Fine Mesh Solder Powder on Flux Residue Removal
There is a drive to miniaturize solder paste deposits. A key element to success is the incorporation of smaller solder particles in the solder paste.
Technical Paper

Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk

How X-Ray Technology is Improving the Electronics Assembly Process
X-ray inspection of electronic components is now standard practice for any company working in the electronics industry.
Technical Paper

Sponsor

Reimagined EOS/ESD Symposium 2026
Experience the enhanced EOS/ESD Symposium with expanded learning, collaboration, and industry connections. Join experts exploring challenges and solutions in EOS/ESD control. September 28-30.
EOS/ESD Association

Adhesive Bonding of Polymeric Substrates Through Plasma Treatment
This study assesses the effect of atmospheric plasma treatment used with compressed air. and te effect of plasma surface treatment on adhesive bond strength.
Technical Paper

Cure for the Grape Effect
We are processing lead-free boards with large components. Our parts are showing the grape effect. What is the best solution for this?
Board Talk

Sponsor

The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect

Reliability in Low Temperature Soldering for BGA Components
The adoption of LTS presents compatibility challenges. This study explores the reliability of different ball-paste combinations for LTS soldering.
Technical Paper

Metal Organic Decomposition Inks for Electromagnetic Interference Shielding
In this paper, we will review different printing techniques, and spray coating. We will review 5-sided metallization to provide shielding via spray coating, film performance parameters including coating thickness uniformity, EMI shielding effectiveness, adhesion to different substrates, and reliability.
Technical Paper

Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders.
Technical Paper

Sponsor

Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond

Examination of Cutting-Edge Quality and the Influences of Laser Depaneling
This paper presents an in-depth analysis of potential influences of the cutting quality variation on the characteristics of the printed circuit board.
Technical Paper

5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk

Sponsor

Want High-Quality BGA Reballing?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.

Surface Treatment Enabling Low Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates.
Technical Paper

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MORE INDUSTRY NEWS

Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

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