Technical Papers
X-Ray Inspection Verifies Quality of Complex PCBs
Cold Underfill Component Removal
Cleaning Performance Evaluations for Jettable Pastes for Advanced SMT Assembly Processes
Dispensing 2-Part Adhesives
Advanced Materials in Power Electronics
The Impact of Thermocouple Attachment Methods on Thermal Profiling Accuracy
Utilizing SIR and Analytical Tools to Determine Impact to Reliability for Process Improvements
Factors Affecting the Cost of PCB Fabrication
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Supply Chain Data Points to Growing Demand
This Futuristic Wearable Smartphone Alternative Projects a Screen on Your Palm — And It's Now Widely Available
Apple shares just had their best day since last May
Embedded World 2024: Day Three Closing Thoughts
Apple will soon allow iPhone repairs with used parts
MORE INDUSTRY NEWS
April 11, 2024
How To Verify Cleanliness After Rework and Prior to Re-coating?
How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their expertise.
Board Talk
A.I. Deployment in Verification Tool for Inspection Equipment
AI has been deployed in the verification tool with studies conducted to compare the effectiveness and efficiency of the tool versus human operation.
Production Floor
There Actually is an 'I' in Team
There Actually is an 'I' in Team
Robotic arms handle repetitive and precision movements. This change relieves operators of mundane work. They must adjust to the new work environment.
Technology Briefing
Assessing Electronic Devices with 3D X-Ray Imaging and Electron Microscopy
This article presents workflows that combine 3D X-ray microscopy, nanoscale tomography, and electron microscopy for visualization of the interior of electronic devices.
Analysis Lab
Nanocopper Based Paste for Solid Copper Via Fill
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech
Jetting Solder Paste Opens Up New Possibilities
The differences between jet printing and dispensing will be highlighted and technical challenges with broad band technology will be discussed.
Production Floor
Double Reflow-Induced Brittle Interfacial Failures
This paper describes and characterizes an unusual open circuit failure mechanism in Pb-free ball grid array (BGA) solder joints.
Analysis Lab
Assembling Boards with BGAs on Both Sides
Assembling Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two?
Board Talk
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Materials Tech
Zinc-Air Batteries as an Alternative to Lithium-Ion Batteries
Zinc-Air Batteries as an Alternative to Lithium-Ion Batteries
Zinc-air batteries are a better alternative to lithium-ion batteries because of their low cost, environmental friendliness, high theoretical energy density, and safety.
Technology Briefing
Screen Making for Printed Electronics
This study presents a DOE method to pre-test materials to categorize ink and substrate rheology, compatibility and printed feature requirements.
Production Floor
Measuring the Impact of Test Methods for High-Frequency Circuit Materials
How can two different test methods provide Dk measurement that are different? When the methods measure the same circuit material in two different directions.
Analysis Lab
Danger on the Adhesive Coating Line
Danger on the Adhesive Coating Line
A plant worker adjusting rollers on an adhesive line suddenly began to act strangely. What caused the worker's spaced out appearance?
Mysteries of Science
Converting Cable Assembly Manufacturing to Lead Free Solder
This paper reviews soldering applications associated with cable assembly, including process modification and qualification with lead free solders.
Production Floor
Chip Use Light Waves to Perform Math Essential to AI Training
Chip Use Light Waves to Perform Math Essential to AI Training
Engineers have developed a new chip that uses light waves, rather than electricity, to perform the complex math essential to training AI.
Technology Briefing
Solder Joint Void Metrology to Monitor Solder Joint Quality
We are showing what could be done when using a 2D X-ray system to collect high resolution images and process them with Deep Learning using AI.
Analysis Lab
Expandable Bio-based Polymers: Future for Electronics Ruggedization
Expandable Bio-based Polymers: Future for Electronics Ruggedization
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components.
Materials Tech
Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee.
Production Floor
Board Talk
How To Verify Cleanliness After Rework and Prior to Re-coating?
Assembling Boards with BGAs on Both Sides
Demise of the Plated-Through Hole?
5 vs 8-Zone Ovens
Simple Test for Flux Penetration
BGA Components and Coplanarity
Problem Meeting Minimum Hole Fill During Wave Soldering
What is Solder Paste Working Life on a Stencil?
MORE BOARD TALK
Questions and Comments
Problem Meeting Minimum Hole Fill During Wave Soldering
Everything that has been described is correct. If it is ...
Juergen Friedrich, Ersa GmbH
Problem Meeting Minimum Hole Fill During Wave Soldering
Our past experience is that the use of an inert ...
Gregory K Arslanian, Air Products and Chemicals, Inc.
Is No-Clean the Trend for QFN Components?
We work with smaller assemblies with small QFN and smaller ...
Tim Smith, Base2 Engineering a BlueHalo Company
MORE COMMENTS
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