Technical Papers
Advanced High Frequency PCB Materials
10 Essential Rules for Circuit Board Jumper Wires
A Comprehensive Guide to Offline In-Socket Programming
Optimizing cycle times in the semiconductor industry with Openair-Plasma
Meeting Today's Challenge for Low VOC Defluxing Agents for Electronics Manufacturing
Electroless Copper Coverage in Small BVH for Fine Pattern SAP
Brazilian EMS Firm Ensures Quality with X-Ray Inspection
Selective Soldering: A Need for Innovation and Development
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
Latest Industry News
Inflation Bites U.S. Engineering Salaries
How the Worlds of Chiplets and Packaging Intertwine
Distributed vs. Remote Teams: Understanding the Differences
Unlock the Benefits of Endpoint AI Solutions for Laptop Computers
FCC to reintroduce rules protecting net neutrality
September 28, 2023
How To Rework Warped PCBAs?
How To Rework Warped PCBAs?
From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this situation and offer their own suggestions.
Board Talk
Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly
Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable.
Production Floor
Electric Vehicle Driving Range Expanded Through Polymer Binders
Electric Vehicle Driving Range Expanded Through Polymer Binders
Volume expansion of high-capacity anode materials during a reaction with lithium poses a threat to electric vehicle battery performance and stability.
Technology Briefing
Evaluation of High Speed Plating for Copper Post with Flat Top Shape
In developing high-speed electro “copper post” plating bath the shape of the post and the uniformity of the post height throughout the wafer were considered.
Analysis Lab
Exploring the Reliability Limits for Silicone Adhesives
Exploring the Reliability Limits for Silicone Adhesives
Paper determines "life expectancies" as well as an extrapolated estimate of the Underwriter's Laboratories' "continuous use" temperature rating.
Materials Tech
Process Control and Reliability of Reworked BGAs
The lead-free solder does not wet metal surfaces as well as tin-lead metallurgy. This narrows down the process window for lead-free solder.
Production Floor
Effects of Substrate Material and Package Pad Design on Solder-Joint Reliabilty
This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications.
Analysis Lab
Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time?
Board Talk
Engineered Flux for Low Temperature Solders
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper.
Materials Tech
Plastic Alternative That Disintegrates on Demand
Plastic Alternative That Disintegrates on Demand
New research reported in the journal ACS Sustainable Chemistry & Engineering has created a sturdy, lightweight material that disintegrates on-demand.
Technology Briefing
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor
Reliability of Polymeric Encapsulation Materials on SnAgCu Solder Joints
This study determined the processability, mechanical and temperature cycle reliability of SAC BGA solder joints reinforced by encapsulation using SJEMs.
Analysis Lab
What Caused the Viscosity Variations?
What Caused the Viscosity Variations?
Over time liquid encapsulant will thicken. On one occasion the viscosity that was too low. What was causing the viscosity too drop?
Mysteries of Science
Innovative of CU Electroplating Process for Any Layer Via Fillwith Planer Via Top and Thin Surface Copper
PCB manufacturers need another additional processing step to chemically etch the deposit until they reach a planer surface to build the next layer without issues.
Production Floor
Promising Alternative for Storing Hydrogen
Promising Alternative for Storing Hydrogen
Battery technology provides a poor solution for energy storage. Hydrogen avoids most of these problems, but we need a safe way to store and transport.
Technology Briefing
Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Analysis Lab
Ultrathin Fluoropolymer Coatings to Mitigate PCB Damage
Ultrathin Fluoropolymer Coatings to Mitigate PCB Damage
Ultra-thin fluoropolymer coatings were tested by industry approved test methods to determine whether this level of process was possible.
Materials Tech
Press Fit Roadmap for High Performance Process
Paper investigates the roadmap for press fit technology, with attention to placement and insertion, inspection, repair, pin design, challenges and solutions.
Production Floor
Supplier Spotlight
Circuit Technology Center Inc.
Circuit Technology Center continues to be recognized as the country's ...
Mirtec Corp
MIRTEC Corp is comprised of an extremely talented and knowledgeable ...
Besi North America, Inc.
Besi is a leading supplier of semiconductor assembly equipment for ...
Den-on Instruments Co., Ltd.
The company was first founded under the name of DEN-ON ...
Board Talk
How To Rework Warped PCBAs?
Should We Invest in 3D Optical Inspection?
How Long Solder Paste Can Be Left On a Stencil Without Activity
Issues With BGA Rework Residue
Intrusive Soldering vs. Wave Solder
Reliability of Tin Lead Solder vs. Lead Free Solder
Limits for HASL with Complex Products
How To Prevent Mid-chip Solder Balls?
Questions and Comments
Issues Mixing Silicone and Acrylic Conformal Coatings
Silicones are primarily used for thermal resistance, flexibility, and a ...
Rick Perkins, Chem Logic
V-Score and Depanel in One Step
IPC-782 doesn't exist anymore. It was superseded in 2005 by ...
Frank, PIEK
Help With Lead to Hole Ratio
On top of above, You also need to consider the ...
Gabriele Sala, GSC
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