Electronics Manufacturing and Electronics Assembly

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Drop-in SAC305 Alternative: Try REL61
Upgrade your alloy without the downtime. REL61 requires no pot cleaning and your SAC305 scrap value often covers the cost of the changeover. Optimize your process today.
AIM Solder

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

Requirements for Installing Leaded vs. Lead-free Press Fit Connectors

Class 3 Pin Contact Question

Maximum Allowable Time Prior to Washing When Using Water Soluble Paste

What's Causing Cloudy Conformal Coating

What Is Causing Slanted Pins After Reflow

Components Falling Off During Wave Soldering

ESD Ground Wire Gauge

Looking for Long-term Component Storage Options

MORE ASK THE EXPERTS

Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Technical Paper

Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability.
Technical Paper

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Bring IPC Training to Your Facility
Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team.
BEST Inc.

Process-Property Relationships for Flexible Additive-Printed Electronics
In this paper, a detailed study of the effect of aerosol-jet process parameters on the resistance, shear strength, and elastic modulus has been presented.
Technical Paper

Can Solder Mask Be Considered an Insulator?
Is solder mask considered an insulating material and not a defect if proven the solder mask has dielectric withstanding voltage greater than 500 volts?
Board Talk

The Causes of Tiny Solder Balls After Reflow
We have been seeing tiny solder balls across our boards after reflow. It appears that the solder is exploding as the balls are in areas where there is no paste or components.
Board Talk

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BGA Component Rework Simplified
When you're confronted with tough BGA rework, who do you turn to? Discover the #1 resource used by military contractors. We have solutions for all your BGA rework and repair needs.
Circuit Technology Center

Rework and Reball Challenges for Wafer-Level Packages
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature.
Technical Paper

Heterogeneous Integration Roadmap: Technology for Systems of the Future
The new Heterogeneous Integration Roadmap provides a long-term vision for the electronics industry, identifying future challenges and potential solutions.
Technical Paper

Sponsor

High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation

Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Technical Paper

Moisture Effects in Common Solderable RF Connector Dielectrics
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized.
Technical Paper

Issue with BGAs and SAC Balls After Switching to Low-Temp Solder Paste
If we switch to low temp solder paste, will we have issues with BGAs and SAC balls? We are trying to build a product with low temperature solder.
Board Talk

Sponsor

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK

Effect of TIM Compression Loads on BGA Reliability
This work aims to provide guidance for the potential trade-offs between thermal performances and second level interconnect reliability.
Technical Paper

Solder Paste Inspection Tools to Support Industry 4.0 & Package Scaling
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability.
Technical Paper

Sponsor

New SELECT Synchro soldering system
A multi-station selective soldering system that uses a unique, synchronous motion to increase throughput, improve cost-of-ownership, and provide flexibility for electronics manufacturers.
Nordson Electronics Solutions

Compatibility and Mechanical Reliability in Low Temperature Soldering for BGA Components
This study investigated the mechanical shock reliability of various SAC and LTS ball-paste combinations, revealing key insights into LTS compatibility and performance. Building on previous research demonstrating superior thermal reliability for LTS ball components soldered with SAC paste.
Technical Paper

Latest Industry News

India's PC Market Records Its Strongest-Ever Year, Shipping 15.9 Million Units

VIEWPOINT 2026: Mike Buetow, President, Printed Circuit Engineering Association

Deloitte Expert Says AI Enhances Manufacturing Instead of Replacing Human Workers

Broadcom CEO sees AI chip sales topping US$100 billion in 2027

Amazon Quietly Abandoned Its Robot Innovation

MORE INDUSTRY NEWS

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Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect

Sponsor

The New Smart Rack Mobile
Optimize your workflow with Smart Rack Mobile: intelligent storage, mobility, and real-time component management. Discover more!
Essegi Automation

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