Electronics Manufacturing and Electronics Assembly

Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

New Approaches to Develop a Scalable 3D IC Assembly Method
In this paper, we will discuss various assembly options and the challenges posed by each.
Production Floor

Two-Dimensional Antennas Allow Extreme Thinness and Flexibility
Antennas so thin they can be sprayed into place are robust enough to provide a strong signal used by 5G mobile devices.
Technology Briefing

Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab

Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech

Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor

Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab

Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech

Training Service Robots for the Mainstream
Researchers are making steady progress toward creating robots that can be cost-effectively trained to perform real-world service tasks.
Technology Briefing

Vapor Phase Quality Improvement
Today's state of the art single-phase vapor phase provide the solutions needed for lead-free soldering and requirements for a void-less solder joint.
Production Floor

The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Analysis Lab

Lubricant Causes Quality Problems
Cylinder locks coated with a light oil spray started to stick. Did a change in the process affect quality, and if so how?
Mysteries of Science

Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture. The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this concern.
Board Talk

Capacitive Sensor System Using Printed Electronics on Window Glass
The authors demonstrate how to produce a capacitive sensor system on three millimeter window glass by combining the piezo-jet technology and a pick-and-place system.
Production Floor

Aerial Ridesharing in 2021 and Beyond

When last explored the world of flying taxis and personal aviation vehicles, the climate for business in general and transportation, was very different.
Technology Briefing

Voiding/Drop Test for Mixed Alloy BGA Assembly
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated.
Analysis Lab

High and Matched Refractive Index Liquid Adhesives for Optical Device

$High and Matched Refractive Index Liquid Adhesives for Optical Device$

High and matched refractive index liquid adhesives are required in several electronics devices, where the liquid adhesives are in the optical pathway.
Materials Tech

Control of the Underfill of Surface Mount Assemblies
Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations.
Production Floor

✷ ✷ Supplier Spotlight ✷ ✷

West-Tech Materials
West-Tech Materials represents leading manufacturers specializing in ...

Air-Vac Engineering Company, Inc.
Air-Vac Engineering develops innovative solutions for almost ...

Glenbrook Technologies Inc.
Since 1983, Glenbrook Technologies has continuously reinvented ...

Weller Tools
When you say "soldering", you mean Weller. ...

FULL SUPPLIER DIRECTORY

Technology Corner

About XIMEA company video

XIMEA GmbH

Making Ovens Smarter

KIC

A Full-Line of Programming Solutions

BPM Microsystems

Light-Cure Conformal Coatings

Dymax Corporation

Base Board Repair and Rework

Circuit Technology Center Inc.

MORE TECHNOLOGY CORNER

Board Talk

Moisture Barrier Bag Issues

Trouble With Skewed DPAK Components

Can Mixing Wave Solder Pallets Cause Contamination?

How to Reduce Voiding on QFN Components

Calculating Failure Rate During Rework

Do BGA Components Warp During Reflow?

Can Water Contamination Cause Failure?

Why Uneven Conformal Coating?

MORE BOARD TALK

Questions and Comments

Moisture Barrier Bag Issues

We are a manufacturer of flexible and rigid flex circuits ...
Bob Burns, Printed Circuits LLC

Can Water Contamination Cause Failure?

Yes even boards get water washed must to dried properly ...
Sandip Raut, Jabil Ckt India Pvt Ltd

What is the Suggested Humidity Level for Electronics Assembly?

The concern here is only for Electronics Manufacturing. MSL Classification ...
Pascal Dumontet, RENAULT SAS

What is the Suggested Humidity Level for Electronics Assembly?

I have run SMT assembly lines on the west coast ...
Andrew Dalisa, LinkIt Associates

What is the Suggested Humidity Level for Electronics Assembly?

I have run SMT assembly lines on the west coast ...
Andrew Dalisa, LinkIt Associates

MORE COMMENTS

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