Technical Papers
Advanced Materials in Power Electronics
The Impact of Thermocouple Attachment Methods on Thermal Profiling Accuracy
Utilizing SIR and Analytical Tools to Determine Impact to Reliability for Process Improvements
Factors Affecting the Cost of PCB Fabrication
The Critical Role of RHSD in High-Reliability Applications
Advanced High Frequency PCB Materials
10 Essential Rules for Circuit Board Jumper Wires
A Comprehensive Guide to Offline In-Socket Programming
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
The Coming Boom in Rare Earths
Foxconn accelerates Indian investments, expanding diversification beyond China
Driverless cars were once the future, now they are on the road to nowhere
IBM was early to AI, then lost its way. CEO Arvind Krishna explains what's next
Microsoft's president meets with the Chinese government to discuss AI co-operation
MORE INDUSTRY NEWS
December 7, 2023
Questions About Handling Solder Paste
Questions About Handling Solder Paste
We use lead-free solder and store it at a temperature of 4 to 5 degrees Celsius. What is the best practice for prepping this stored paste before use? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and offer their suggestions.
Board Talk
Rework Challenges for Smart Phones and Tablets
This paper reviews the challenges and process steps needed for successful repair of surface mount devices on very densely packaged circuit boards.
Production Floor
AI Robots Alleviate Loneliness
AI Robots Alleviate Loneliness
Robots enhanced with artificial intelligence may one day help alleviate loneliness. Researchers propose a way to measure whether a robot is helping someone.
Technology Briefing
Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented.
Analysis Lab
Solder Paste Selection for Bottom Termination Components Attach
Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech
The Versatile Preform
This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms.
Production Floor
Stencil Printing for Challenging Heterogeneous Assembly Applications
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography.
Analysis Lab
When To Use Adhesive To Bond SMT Components
When To Use Adhesive To Bond SMT Components
When should we use adhesive to bond SMT components to the bottom-side of a double-sided PWA before going through reflow soldering?
Board Talk
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
This paper covers a type of 'crack free' flux paste designed to inhibit cracking under extreme environments. Includes electro-chemical migration tests dew ...
Materials Tech
The Coming EV Debacle
The Coming EV Debacle
There is no clearer example of regulatory overreach than battery-electric vehicle mandates. What are the implications of prematurely pursuing this "EV fantasy?"
Technology Briefing
Technology for Optical Co-Packaging
A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper.
Production Floor
Nickel Hydroxide Corrosion Residues on Ceramic Packages
The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized.
Analysis Lab
Trapped in the Vacuum Chamber
Trapped in the Vacuum Chamber
A worker was cleaning inside a vacuum chamber when the door slammed shut. His partner turned the vacuum pump on. What happened?
Mysteries of Science
Via Filling: Challenges in the Plating Process
This paper describes the function and principles behind BMV filling processes together with methods for non destructive testing of the filled structures.
Production Floor
Safely Unlocking the Potential of Exponential Growth Innovation
Safely Unlocking the Potential of Exponential Growth Innovation
Some are worried that a shrinking labor force, limited natural resources and a rising “dependency ratio” will undermine economic growth.
Technology Briefing
Solderability Testing Protocols and Component Re-Tinning Methods
This paper addresses methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating.
Analysis Lab
Rheology of Solder Paste: Shelf Life Study
Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Materials Tech
Conformal Coating over No Clean Flux
The need to implement a tin whisker mitigation strategy has led to applying conformal coating over no clean residues.
Production Floor
Supplier Spotlight
Nikon Metrology, Inc.
For over 100 years, Nikon has pursued the possibilities of ...
Baja Bid
BajaBid is a SMT and PCBA asset management organization with ...
Hisco, Inc.
Hisco is a specialty distribution company serving the electronic assembly ...
IEC Electronics Corp.
By utilizing our on-site analytical laboratories or our proven industry ...
FULL SUPPLIER DIRECTORY
Board Talk
Questions About Handling Solder Paste
When To Use Adhesive To Bond SMT Components
How Can We Prevent Our 0201 Nozzles From Clogging?
PCBA Inspection Concerns
Is There a Limit to the Step in a Step Stencil?
Keys for Moisture Sensitive Device Control
How Effective Is Nano Coating On Stencils?
Why is Solder Dross Sticking to Our PCBAs?
MORE BOARD TALK
Questions and Comments
How Can We Prevent Our 0201 Nozzles From Clogging?
You don't say which paste type and its flux type ...
Richard Stadem, Analog Technologies Corp.
Is There a Limit to the Step in a Step Stencil?
One issue I did not see in the discussions is ...
Don Adams, Bose
How Effective Is Nano Coating On Stencils?
Nanocoating thickness can be measured by Ellipsometry and similar optical ...
Rajagopal
MORE COMMENTS
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