Electronics Manufacturing and Electronics Assembly

Our repair PWA assemblies have a silicone based conformal coating. During repair some of the coating is removed. Is there be a compatibility problem? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Low Temperature SMT Solder Evaluation
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Production Floor

3D-Printed Concrete Revolutionizes Home Building
Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste.
Technology Briefing

Conformal Coating - Performance Comparison Environmental Testing
The experiment compares the behavior of acrylic coating used on large scale in various applications and a specific super-hydrophobic nano conformal coating.
Analysis Lab

ENEPIG - How the Process Characteristics Influence the Layer Performance
This paper will focus on the comparison of pure Pd and PdP deposits and the interaction with the gold electrolyte type in use.
Materials Tech

Position Accuracy Machines for Selective Soldering Fine Pitch
Selective soldering is a robust soldering process. This paper explores the different process steps and critical parameters.
Production Floor

Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
The effect of aperture shape and orientation on solder paste printing performance is analyzed using stencil thicknesses, solder paste types and manufacturers.
Analysis Lab

We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this?
Board Talk

Nano Silver Replacement for High Lead Solders
This paper details mechanical and reliability testing of joints made with materials under a range of temperature, pressure and atmosphere.
Materials Tech

Real-World Implementation of Robotic Exoskeletons
Research represents a step toward implementation of robotic exoskeletons designed to help humans with walking and physically demanding work.
Technology Briefing

Innovative Panel Plating for Heterogeneous Integration
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing.
Production Floor

Advances in Power Electronics
This paper details some of the recent advances in power electronics systems and details some of the challenges that need to be overcome.
Analysis Lab

The Epoxy Mixing Mix-up
Epoxy resin batches were a little off target. Workers were rotated and the problem disappeared. Were employee causing this problem?
Mysteries of Science

Aerosol Jet Printing of Conductive Epoxy for 3D
The authors describe efforts to improve both the dispensability of small volume dots and correspondingly improve the consistency and conductivity of the dots.
Production Floor

Researchers Incorporate Machine Learning Into Brain-Computer Interface

Researchers incorporated machine learning into the brain-computer interface. This solution can understand the needs of a subject and self-calibrate.
Technology Briefing

The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Analysis Lab

Atmospheric Plasma Surface Engineering of Printed Circuit Boards

Plasma treatment increases the adhesion strength of the conformal coatings through the removal of organic contaminants and surface activation.
Materials Tech

Concentration Monitoring & Closed Loop Control
In this study, the Flowsensor or acoustic concentration measurement system was evaluated at the original beta site detailing 20 days of concentration monitoring data.
Production Floor

Board Talk

Issues Mixing Silicone and Acrylic Conformal Coatings

We Bake, But Still Have Delamination, Why?

What is the Best Way to Clean Solder Stencils?

Solder Paste Volume for BGA Rework

V-Score and Depanel in One Step

Delay Before Cleaning Partial Assemblies

Intrusive Soldering Through-Hole Connector

Solder Paste Transfer Efficiency - What/Why

MORE BOARD TALK

Questions and Comments

Variations in SAC 305 Solder

Curious, after dross recovery what phosphorus, at such a low ...
Scott E. Fiske, Lockheed Martin Space

Intrusive Soldering Through-Hole Connector

And remember this little tip, as it is the most ...
Richard Stadem, General Dynamics Mission Systems

Vapor Phase and Backward Compatibility

HI Jim and Phil, I love your Board Talk Podcasts. ...
Gerry Partida, Summit Interconnect

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