February 6, 2025
Robotic Systems Perform Experiments Speeding Up Research
Robotic Systems Perform Experiments Speeding Up Research
Robotic systems can perform experiments without fatigue, speeding up research. Robots execute experimental steps with greater consistency than humans. As explained recently in the journal Science Robotics, robots are rapidly, "Transforming Science Labs into Automated Factories of Discovery."
Technology Briefing
Protecting the Reliability and Integrity of Electronic Products and Assemblies
This paper offers guidance for protecting the integrity of electronic products and assemblies when disinfecting equipment surfaces for SARS-CoV-2 virus.
Production Floor
Sponsor
Advanced-Interconnections

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
2nd Generation of indium TIM
2nd Generation of indium TIM
A new generation of indium TIM is introduced. This class of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Materials Tech
Design for Manufacture and Test Using Thermal Cycling Under Bia
There are many factors contributing to electrochemical failures on electronic devices including pitch, electrical field, ionic contamination and environmental conditions.
Analysis Lab
Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating.
Materials Tech
Sponsor
AI-Technology

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.
Homogeneous Low Temperature Soldering Technology
Homogeneous Low Temperature Soldering Technology
This paper presents key findings of enabling LTS technology on AMD’s Client BGA Packages using surface mount technology (SMT).
Production Floor
Low Temperature SnBi Containing Solder Pastes with Lead-Free Solder Balls
A detailed study has been carried out on low temperature lead-free solder paste that utilizes Bi bearing alloys.
Analysis Lab
Sponsor
Aim-Solder

Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics—no trade-offs needed.
AIM Solder
Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk
Engineered Flux for Low Temperature Solders
Engineered Flux for Low Temperature Solders
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper.
Materials Tech
Method Produces Metals with Low Thermal Expansion without Emitting CO2
Method Produces Metals with Low Thermal Expansion without Emitting CO2
Production of metals with low thermal expansion, called Invar, are critical for the aerospace, cryogenic transport, energy, and precision instrument sectors.
Technology Briefing
Sponsor
Circuit-Technology-Center

Touchless Solder Ball Removal
Watch our video showcasing touch-free BGA component deballing. This revolutionary approach achieves unparalleled reliability and precision when preparing BGA components for re-balling.
Circuit Technology Center
Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented.
Production Floor
Comparing Past Board Assembly iNEMI Roadmaps to Technology Outcomes
This project compares past board assembly roadmaps with technological outcomes, drawing conclusions on the outline and readability of the board assembly roadmaps.
Analysis Lab
Sponsor
ECD

How Precise are Your Temp. Readings?
Did you know thermocouple attachment method can significantly impact the accuracy of thermal profiling temperature readings? Find out what this study revealed.
ECD
Pennies Converted To Dimes
Pennies Converted To Dimes
A vendor was sorting a vending machine's change when he came across some strange looking dimes that looked like silver pennies.
Mysteries of Science
Qualitative Model Describing Hot Tear Above VIPPO and Other Design Elements
The mechanism for the formation of Hot Tears is discussed and applied to other design elements that can be found on Printed Circuit Board Assemblies.
Production Floor
Stacking Multiple Surfaces of Transistors and Semiconducting Elements
Stacking Multiple Surfaces of Transistors and Semiconducting Elements
Chip manufacturers are looking to build up rather than out. The industry is aiming to stack multiple surfaces of transistors and semiconducting elements.
Technology Briefing
PBGA Solder Stress Analyses Under Random Vibration
Large size commercially available plastic ball grid array chip packaging was tested and analyzed under random vibration to assess its application feasibility on satellite electronics.
Analysis Lab
The Impact of the Gold Layer Thickness on Layer Properties
The Impact of the Gold Layer Thickness on Layer Properties
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives.
Materials Tech
A Fracture Mechanics-Based Approach to Simulate Die Pick-up Process
This paper provides a procedure to simulate die pick-up process based on contact-debonding fracture mechanics approach.
Production Floor
Aim-Solder
Latest Industry News
North American PCB Industry Sales Up 59.6% in December
VIEWPOINT 2025: Rick Perkins, Chemical Process Engineer, Chem Logic
India Becomes the World's Second-Largest Mobile Manufacturing
Qualcomm tops estimates for earnings and revenue on strong smartphone demand
How 4PL is Transforming Supply Chains
MORE INDUSTRY NEWS
Sponsor
Master-Bond

Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
Questions and Comments
Issues With SMT Component Alignment
The fan speeds in your oven could be turned down ...
David S. Chapman, DCT
Simple Test for Flux Penetration
AIM has a helpful video found at: https://youtu.be/MRPRmOYORT8 ...
Timothy ONeill, AIM Solder
Problem Meeting Minimum Hole Fill During Wave Soldering
I've had these problems where there were no thermal reliefs ...
Scott W McKee, Golden West Technology
MORE COMMENTS
Circuit-Technology-Center
Sponsor
PCBWay

Choose Advanced Assembly with Precision Components
PCBWay handles complex assemblies with precision. Our lines handle fine pitch components such as 01005, 0201, BGAs & other challenging packages.
PCBWay
Cartoon
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