circuit insight
April 17, 2025
Cleaning under Bottom Terminated Components - The Importance of Good Rinsing
Cleaning under Bottom Terminated Components - The Importance of Good Rinsing
This paper demonstrates the possibility of continuously detecting the proper quality of rinsing water and the status of chemical filters, which provide the required parameters. Such a study should be helpful for these users of the cleaning process, which recirculate fully or partially the deionized water used for rinsing.
Production Floor
Reducing Dust Deposition on Electronic Equipment
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.
Production Floor
Sponsor
ECD

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
Robotic Systems Perform Experiments Speeding Up Research
Robotic Systems Perform Experiments Speeding Up Research
As explained recently in the journal Science Robotics, robots are rapidly, "Transforming Science Labs into Automated Factories of Discovery."
Technology Briefing
Effect of Matte-Sn Electroplating on Reliability of Lead-free Solder Joints
This study analyzes the impact of electroplating parameters of matte-Sn terminal layer on the thermo-mechanical reliability of solder joints.
Analysis Lab
High Performance Light and Moisture Dual Curable Encapsulant
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Materials Tech
Sponsor
Master-Bond

Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
Adiabatic & Isothermal Humidification for Electronics Manufacturing
Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
Production Floor
Electrical Plus Functional Testing in Designing Electronics for Harsh Conditions
This paper proposes a test method and vehicle to characterize soldering materials, assembly process steps, and conformal coating to determine reliability.
Analysis Lab
Sponsor
Glenbrook-Technologies

Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies
Requirements for Depaneling and Rescoring Boards with BGA Components
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components?
Board Talk
Hybrid Sintering for High-power Density Devices  Aerospace Applications
Hybrid Sintering for High-power Density Devices Aerospace Applications
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications.
Materials Tech
Stacking Multiple Surfaces of Transistors and Semiconducting Elements
Stacking Multiple Surfaces of Transistors and Semiconducting Elements
Chip manufacturers are looking to build up rather than out. The industry is aiming to stack multiple surfaces of transistors and semiconducting elements.
Technology Briefing
Sponsor
Smart-Sonic

Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic
Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
Production Floor
Finite Element Analysis of Tin-Bismuth Electromigration of Solder Joints
This paper is based on the planar solder joint approach which affords non-destructive real-time monitoring of the solder joint microstructure in a scanning electron microscope.
Analysis Lab
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
Role of Carbon Ink in Calculators
Role of Carbon Ink in Calculators
Texas Instrument's calculators made in the 80's used a flexible circuit made with carbon ink. What vital part did the carbon ink serve?
Mysteries of Science
Additive Manufacturing for Next Generation Microwave Electronics
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications.
Production Floor
Leveraging America's Enormous Deep Tech Advantage
Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing
Design Considerations That Influence LED Solder Joint Reliability
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA.
Analysis Lab
ENEPIG - How the Process Characteristics Influence the Layer Performance
This paper will focus on the comparison of pure Pd and PdP deposits and the interaction with the gold electrolyte type in use.
Materials Tech
Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
Production Floor
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Eliminate Cross Contamination
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Circuitnet

e-media Advertising Delivers Results!
Introduce your technology, new products or services in our e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 125,000 professionals.
Circuitnet Media LLC
Questions and Comments
A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
In re-reading this study, the results, of course are well ...
Jaye Waas, Renkus-Heinz
Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions
There really, at present, no such thing as "selective cleaning". ...
Phil Zarrow, ITM Consulting
Palm Size Portable 3 Printer
Impressive start. I look forward to further reports on the ...
Jaye Waas, Renkus-Heinz
MORE COMMENTS
Aim-Solder
Sponsor
Aim-Solder

Elevate Your Operations with REL61
Stop settling for cost-effective alternatives that underperform. REL61 delivers the best of both worlds: significant cost reductions and superior solder joint reliability.
AIM Solder
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