Technical Papers
X-Ray Provides Years of Quality Assurance
>3.0 µins Gold Now Achievable, Without Nickel Corrosion
Impact of high peak reflow temperature on flux removal of high Pb solder paste
Critical Considerations for Electronic Component Tin Whisker Mitigation
The Effects of Long-Term Storage on Solderability of Components
Augmented AI Component Counting and Managing
E-Motor PEEK Wire Insulation & Epoxy Secondary Insulation
Evaluating and Qualifying Candidate Selective Soldering Systems
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Apple's Growth and Cook Says Supply Chain Improving
VIEWPOINT 2022: Anthony Ambrose, President & CEO, Data I/O Corporation
VIEWPOINT 2022: Mr. Karel Tavernier, Managing Director, Ucamco
North American EMS Industry up 0.9% in December
Facebook's ambitious effort to bring cryptocurrency to the masses has failed.
MORE INDUSTRY NEWS
January 27, 2022
Is No-Clean the Trend for QFN Components?
Is No-Clean the Trend for QFN Components?
Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question and share their own experiences.
Board Talk
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
Augmented Reality Enters Mainstream Information Technology
Augmented Reality Enters Mainstream Information Technology
AR will grow exponentially, becoming the interface-of-choice between humans and machines, bridging the digital and physical worlds.
Technology Briefing
Nickel Hydroxide Corrosion Residues on Ceramic Packages
The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized.
Analysis Lab
High Reliability, Stress-free Copper Deposit
High Reliability, Stress-free Copper Deposit
To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector.
Materials Tech
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor
Strain Measuring Technology in Board Level Assembly Process
The study on strain measurement has just started, and there are still many unsolved puzzles, whether about strain gage selection or about measurement methodology.
Analysis Lab
Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board flexing has started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven.
Board Talk
Tools and Techniques for Material Assessment in Advanced Technologies
Paper identifies limitations in the methods used for evaluating solders, circuit board materials and surface finishes.
Materials Tech
Automated Science Triggers 21st Century Bonanza
Automated Science Triggers 21st Century Bonanza
After being relatively flat since early 2000s, many economists doubt that productivity will again match or exceed the growth rates seen in the 1990s.
Technology Briefing
Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor
The True Business Impact of IIoT Technology
Pitfalls and opportunities in IIoT solution technology, at the device level, the manufacturing execution management system layer, and enterprise business systems layer.
Analysis Lab
Why Did the Old Reactor Work Best?
Why Did the Old Reactor Work Best?
The expected color reaction at a dye manufacturing plant hadn't taken place. Why did the batch still work when moved into the old reactor?
Mysteries of Science
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor
New Glass Three Times Stronger and Fracture Resistant
New Glass Three Times Stronger and Fracture Resistant
Scientists have developed a glass material that is not only three times stronger than conventional glass, but also more than five times more fracture resistant.
Technology Briefing
Determination of Total Halogen Content in Halogen-Free Fluxes
It is important for laboratories to follow robust methods to assure commercial products meet the safety requirements established.
Analysis Lab
NanoCopper Based Solder-free Electronic Assembly
NanoCopper Based Solder-free Electronic Assembly
This paper explores a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 degrees.
Materials Tech
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor
Supplier Spotlight
ECI Technology, Inc.
ECI Technology is the leading provider of Chemical Management Systems ...
O.C. White Company
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VJ Technologies
VJ Electronix is your one-stop source for x-ray inspection systems ...
Zygo Corporation
Zygo Corporation is a global leader in the design and ...
FULL SUPPLIER DIRECTORY
Board Talk
Is No-Clean the Trend for QFN Components?
Why Do Our Boards Warp During Reflow?
What Rate is World Class for SMT Machines?
Is Customer Approval Required for Class 3 Repair?
Should Apertures be Home Plate or Inverted Home Plate?
Solder Pallets With Titanium Inserts - Yes/No?
Selective Solder Pot Temperatures
Top Side Reflow Causing Solder Balls
MORE BOARD TALK
Questions and Comments
NanoCopper Based Solder-free Electronic Assembly
In 2008, Dr. Alfred Zinn embarked on developing a reliable ...
Doug Dixon, 360Circuits
What Rate is World Class for SMT Machines?
Guys, This is beneath you, as entertaining as your replies ...
Ike Sedberry, Sedberry Sales Inc
NanoCopper Based Solder-free Electronic Assembly
Yes, it eliminates whiskers, exhibits much higher electrical and thermal ...
Alfred Zinn, Kuprion, Inc.
Selective Solder Pot Temperatures
We are using 280C for most of our selective solder ...
Terry Ruszin, Lutron Electronics
Cleaning R.F. Circuits - Aqueous or Vapor?
Of the two methods, I would greatly favor aqueous cleaning ...
Doug Pauls, Collins Aerospace
MORE COMMENTS
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