Electronics Manufacturing and Electronics Assembly

A vintage computer board is contaminated with decomposed anti-static foam. The microprocessor and other ICs have a sticky grime on the leads. The Assembly Brothers, Phil Zarrow and Jim Hall, address this situation and share their own suggestions.
Board Talk

QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.
Production Floor

There Actually is an 'I' in Team
Robotic arms handle repetitive and precision movements. This change relieves operators of mundane work. They must adjust to the new work environment.
Technology Briefing

Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab

Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Materials Tech

Taking the LED Pick and Place Challenge
There has been a shift in the lighting industry that has carried over to surface mount technology. What is this shift? Is it the LED revolution?
Production Floor

Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
The progress of an experimental program for evaluating thermal fatigue performance of third generation alternative Pbfree solder alloys is discussed.
Analysis Lab

How Frequently Should We Recheck Profiles?
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically?
Board Talk

Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
This paper covers a type of 'crack free' flux paste designed to inhibit cracking under extreme environments. Includes electro-chemical migration tests dew ...
Materials Tech

Carbon Dioxide and Lignin Offer Alternative to Traditional Plastic
Researchers have created a potential alternative to traditional petroleum-based plastic made from carbon dioxide, plus lignin, a component of wood.
Technology Briefing

In-Line Testing of Highly Panelized PCBAs with Parallel Functional Test
The manufacturing process challenges faced by electronics manufactures producing large panels of small boards is discussed.
Production Floor

Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Cycles-to-failure versus Distance to Neutral Point (DNP) data for SnPb and lead-free assemblies under Accelerated Thermal Cycling (ATC) conditions are observed.
Analysis Lab

Odd Measurements On Fridays
A research group tested prehistoric fish for mercury. They noticed that test measurements on Fridays were much higher. What was causing this?
Mysteries of Science

The Evolution of ICT
Paper describes how ICT advancements contribute to lowering overall manufacturing test costs by improving fault coverage, reliability, and throughput of production tests.
Production Floor

Palm Size Portable 3 Printer

Imagine a portable 3D printer you could hold in your palm. The tiny device could enable a user to rapidly create customized, low-cost objects on the go.
Technology Briefing

PERM DoD Consortium Phase 3 Pb-free Solder Thermal Cycle Reliability
This paper documents the Collins Aerospace thermal cycle testing effort for the IPC PERM DoD consortium program.
Analysis Lab

Study of Lead-Free Solder Materials for Power Module Packaging Assembly

This study focused on the thermal fatigue performance and the microstructural evolution of five lead-free solders under harsh service conditions.
Materials Tech

Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor

Board Talk

How To Clean a Vintage Circuit Board Assembly?

How Frequently Should We Recheck Profiles?

When is it Time to Switch from Manual Assembly to Automation?

Issues With Fillets on Via Holes?

Questions About Handling Solder Paste

Suggested Stencil Wipe Frequency?

How Can We Prevent Our 0201 Nozzles From Clogging?

When To Use Adhesive To Bond SMT Components

MORE BOARD TALK

Questions and Comments

Questions About Handling Solder Paste

Once you're done with your shift, all the past on ...
David L Kearns, TinyCircuits

What Causes Board Delamination?

IPC-1601 has been superseded by IPC-1602. With HDI designs more ...
Gerry Partida, Summit Interconnect

Sticky Residue Under Low Clearance Parts

The key words in the description of the problem are ...
Richard Stadem, General Dynamics Mission Systems

MORE COMMENTS

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