Electronics Manufacturing and Electronics Assembly

From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this situation and offer their own suggestions.
Board Talk

Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly
Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable.
Production Floor

Electric Vehicle Driving Range Expanded Through Polymer Binders
Volume expansion of high-capacity anode materials during a reaction with lithium poses a threat to electric vehicle battery performance and stability.
Technology Briefing

Evaluation of High Speed Plating for Copper Post with Flat Top Shape
In developing high-speed electro “copper post” plating bath the shape of the post and the uniformity of the post height throughout the wafer were considered.
Analysis Lab

Exploring the Reliability Limits for Silicone Adhesives
Paper determines "life expectancies" as well as an extrapolated estimate of the Underwriter's Laboratories' "continuous use" temperature rating.
Materials Tech

Process Control and Reliability of Reworked BGAs
The lead-free solder does not wet metal surfaces as well as tin-lead metallurgy. This narrows down the process window for lead-free solder.
Production Floor

Effects of Substrate Material and Package Pad Design on Solder-Joint Reliabilty
This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications.
Analysis Lab

Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time?
Board Talk

Engineered Flux for Low Temperature Solders
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper.
Materials Tech

Plastic Alternative That Disintegrates on Demand
New research reported in the journal ACS Sustainable Chemistry & Engineering has created a sturdy, lightweight material that disintegrates on-demand.
Technology Briefing

Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor

Reliability of Polymeric Encapsulation Materials on SnAgCu Solder Joints
This study determined the processability, mechanical and temperature cycle reliability of SAC BGA solder joints reinforced by encapsulation using SJEMs.
Analysis Lab

What Caused the Viscosity Variations?
Over time liquid encapsulant will thicken. On one occasion the viscosity that was too low. What was causing the viscosity too drop?
Mysteries of Science

Innovative of CU Electroplating Process for Any Layer Via Fillwith Planer Via Top and Thin Surface Copper
PCB manufacturers need another additional processing step to chemically etch the deposit until they reach a planer surface to build the next layer without issues.
Production Floor

Promising Alternative for Storing Hydrogen

Battery technology provides a poor solution for energy storage. Hydrogen avoids most of these problems, but we need a safe way to store and transport.
Technology Briefing

Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Analysis Lab

Ultrathin Fluoropolymer Coatings to Mitigate PCB Damage

Ultra-thin fluoropolymer coatings were tested by industry approved test methods to determine whether this level of process was possible.
Materials Tech

Press Fit Roadmap for High Performance Process
Paper investigates the roadmap for press fit technology, with attention to placement and insertion, inspection, repair, pin design, challenges and solutions.
Production Floor

Supplier Spotlight

Circuit Technology Center Inc.
Circuit Technology Center continues to be recognized as the country's ...

Mirtec Corp
MIRTEC Corp is comprised of an extremely talented and knowledgeable ...

Besi North America, Inc.
Besi is a leading supplier of semiconductor assembly equipment for ...

Den-on Instruments Co., Ltd.
The company was first founded under the name of DEN-ON ...

FULL SUPPLIER DIRECTORY

Board Talk

How To Rework Warped PCBAs?

Should We Invest in 3D Optical Inspection?

How Long Solder Paste Can Be Left On a Stencil Without Activity

Issues With BGA Rework Residue

Intrusive Soldering vs. Wave Solder

Reliability of Tin Lead Solder vs. Lead Free Solder

Limits for HASL with Complex Products

How To Prevent Mid-chip Solder Balls?

MORE BOARD TALK

Questions and Comments

Issues Mixing Silicone and Acrylic Conformal Coatings

Silicones are primarily used for thermal resistance, flexibility, and a ...
Rick Perkins, Chem Logic

V-Score and Depanel in One Step

IPC-782 doesn't exist anymore. It was superseded in 2005 by ...
Frank, PIEK

Help With Lead to Hole Ratio

On top of above, You also need to consider the ...
Gabriele Sala, GSC

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