Electronics Manufacturing and Electronics Assembly

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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Ultrasonic Cleaning and Surfactants

Frequency of Temperature and Relative Humidity Tracking

Pin-in-Paste Hole Stencil Printing

Pre-bake in a Vacuum

Considering Plasma Cleaning

Critical Part Fixture During Reflow

Causes of Annular Ring Dewetting

Class 2 vs. Class 3

MORE ASK THE EXPERTS

New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Technical Paper

Vapor Phase and Backward Compatibility
We use lead-free solder paste with a melting point of 217 degrees C, along with 230 degree C Galden. We have a new project that uses tin-lead solder. The Assembly Brothers, Phil Zarrow and Jim Hall, offer their suggestions.
Board Talk

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You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH

Discrete Carbon Nanotube Implementation for use in ESD Tooling
This research illustrates the improvement in volume and surface resistivity for trays and tooling fixtures manufactured usin functionalized carbon nanotubes.
Technical Paper

System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)] in a fine pitch ball grid array (FPBGA).
Technical Paper

Via-In Pad Plated Over (VIPPO) Design Considerations
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints.
Technical Paper

Sponsor

pH Employment in Electronic Cleaning
The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Download now.
KYZEN

Wetting and Solidification of Tin on Polycrystalline Intermetallic Substrates
This study analyzes the wetting and interface formation between polycrystalline CuxAly intermetallic substrates and the pure Beta-Sn phase.
Technical Paper

Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk

Sponsor

Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.

Managing blooming in an adhesives process
If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Technical Paper

High-density PCB Technology Assessment for Space Applications
The goal of the project is to design and qualify HDI PCBs that can provide a platform for assembly and the routing of small pitch AAD for space projects.
Technical Paper

Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses.
Technical Paper

Sponsor

What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK Electronic Solutions

How AI can Accelerate R&D for Solder Paste Formulations
In this study, AI was used to predict the results of the key characteristics to better select the choice of formulas, to understand the relationship between molecules and to spend time on other aspects of the developments. To be able to exploit AI data in a relevant way, we highlight that the input database itself is crucial to generating reliable output data.
Technical Paper

Cure for the Grape Effect
We are processing lead-free boards with large components. Our parts are showing the grape effect. What is the best solution for this?
Board Talk

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The New Smart Rack Mobile
Optimize your workflow with Smart Rack Mobile: intelligent storage, mobility, and real-time component management. Discover more!
Essegi Automation

5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk

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MORE INDUSTRY NEWS

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Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology

Sponsor

X-Ray Inspection Verifies Quality of Complex PCBs
A Netherlands-based PCB supplier relies on real-time X-ray inspection to ensure the quality of HDI, hybrid, multi- layer, flex-rigid & other complex boards.
Glenbrook Technologies

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