Technical Papers
Smart pH Employment in Electronic Cleaning
Mastering the EV Revolution with Expertise in High-Voltage & E-Mobility
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
2D SPI and a 2D AOI now integrated in your SMT Production Machine
Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes
An Essential Guide to Optimize Selective Soldering Processing
Is My Printed Circuit Board Wash Concentration in Check?
Ultraminiature Soldering: Techniques, Technologies, and Standards
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
China Detains Employees at Apple iPhone Factory Run by Foxconn
Why does it feel so weird to ride in a driverless car?
Canada Has Quantum Computing Game
The Hidden Challenges of the EV Supply Chain
Tesla robotaxi event comes after a decade of unfulfilled promises from Elon Musk
MORE INDUSTRY NEWS
October 10, 2024
Intrusive Soldering Through-Hole Connector
Intrusive Soldering Through-Hole Connector
We are SMT soldering a through-hole PC 104 connector. We have tried preforms and are unable to get all of the pins soldered. Phil Zarrow and Jim Hall, The Assembly Brothers, share their own suggestions in this scenario.
Board Talk
Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Production Floor
Flexible Sensors Provide Versatility or Wearable Electronics
Flexible Sensors Provide Versatility or Wearable Electronics
Robots are becoming more agile and wearable electronics' traditional silicon-based sensors won’t make the cut in many applications.
Technology Briefing
Living With PB-Free in High Performance Engineering Design
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by this material.
Analysis Lab
Material Selection and Optimization for TMV PoP
Material Selection and Optimization for TMV PoP
Materials selection and parameter optimization to better understand the critical factors with successful TMV PoP assembly are investigated.
Materials Tech
Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor
Ball Pull Test Efficiency for the PCB Pad Cratering Validation
In the study cold ball pull testing is used to validate the resistance of PCB pad cratering for different ultra-low loss dielectrics materials.
Analysis Lab
Solder Paste Transfer Efficiency - What/Why
Solder Paste Transfer Efficiency - What/Why
I've heard the term transfer efficiency relating to printing. What does this term refer to? What actions impact solder paste transfer efficiency?
Board Talk
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution.
Materials Tech
Leveraging America's Enormous Deep Tech Advantage
Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build have atrophied, it’s advantage in so-called “Deep Technologies” has exploded.
Technology Briefing
Pick-and-Place Feeder density within SMT and Electronics Assembly
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Production Floor
Autonomous Vehicles Still Decades Away: 2019
This paper examines the challenges to progress from existing advanced driver-assistance systems to level 4 and 5 autonomous vehicles.
Analysis Lab
Corrupted Magnetic Tracking System
Corrupted Magnetic Tracking System
Magnetic traveler cards were being used to track information. Suddenly one section was unable to read the data. What was the cause?
Mysteries of Science
Good Quality Comes From Good Design for Test
This paper discusses how to maximize the benefits of boundary scan test, with examples of how designers should select the right components.
Production Floor
Palm Size Portable 3 Printer
Palm Size Portable 3 Printer
Imagine a portable 3D printer you could hold in your palm. The tiny device could enable a user to rapidly create customized, low-cost objects on the go.
Technology Briefing
Impact of Thermal Loading on the Structural Intergrity of 3D TSV Package
In this paper, the different types of crack that can happen along the TSV/Si interface has been determined with the study of behaviors of crack.
Analysis Lab
HDI Structures Using Thin Films and Low Temp Paste
HDI Structures Using Thin Films and Low Temp Paste
Conductors and dielectrics have to be considered when building any layer HDI. New methods and materials are becoming available for building HDI.
Materials Tech
Reliability of Stacked Microvia
Study was designed to understand the reliability of Type 1, 2, and 3 Microvias. The reliability test coupons included four stacks of microvias and a buried via.
Production Floor
Board Talk
Intrusive Soldering Through-Hole Connector
Solder Paste Transfer Efficiency - What/Why
Help With Lead to Hole Ratio
Going Beyond Your Solder Paste Work Life
Vapor Phase and Backward Compatibility
Cause of Damage During Through-hole Component Insertion
How to Cost a Board
Flux Residue Causing Test Issues
MORE BOARD TALK
Questions and Comments
Variations in SAC 305 Solder
Curious, after dross recovery what phosphorus, at such a low ...
Scott E. Fiske, Lockheed Martin Space
Intrusive Soldering Through-Hole Connector
And remember this little tip, as it is the most ...
Richard Stadem, General Dynamics Mission Systems
Vapor Phase and Backward Compatibility
HI Jim and Phil, I love your Board Talk Podcasts. ...
Gerry Partida, Summit Interconnect
MORE COMMENTS
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