Panel Level Package (PLP) – Scaling up Fan-Out Packaging
The persistent push for electronics miniaturization calls for a different approach to make packages smaller, higher performance and lower cost. Fan-out (FO) packages are well suited to serve this market trend. Via interconnects between the chip and package RDL (redistribution layers) provide higher interconnect density and lower inductance.
Technical Paper
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Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.
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Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk
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Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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Addressing Low-Temperature Rework Concerns
This paper will detail the material properties and rework considerations of using a eutectic tin/bismuth solid wire and SAC305 flux cored wire in a rework setting.
Technical Paper
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The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
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DRAM damage due to X-Ray Inspections Post PCB Assembly
This paper outlines several mitigation strategies for minimizing radiation dosage during X-ray inspections, particularly in the context of printed circuit boards (PCBs). One key observation is that the PCB itself acts as an effective shield, significantly reducing radiation exposure.
Technical Paper
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What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK Electronic Solutions
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Understanding and Prediction of Bi Electromigration
This paper will review an effort to describe the expected microstructures in use case settings as well as a model to predict effective Bi boundary layer conditions created during current stress. The estimates will be compared with actual accelerated samples and the impacts of the current stress plus thermal aging on solder joint mechanical performance.
Technical Paper
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