Technical Papers
Essential Tools For High Accuracy Thermal Profiling
Inductive Soldering for High Thermal Demand Applications
X-Ray Supports Solder Paste Development
Functional Test of RF Boards with MMCX Connectors
Data Exchange in Electronics Manufacturing
Benefits of Manual X-ray Inspection
The Elimination of Whiskers from Electroplated Tin
Thermal Profiling: Integral to a Process in Control
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Future Manufacturing: Bracing for and Embracing the Postpandemic Era
China's digital yuan could pose challenges to the U.S. dollar
Intel's planned comeback: 10nm production now surpassing 14nm, 7nm remains a work in progress
Apple said to be testing a new external display with a dedicated A13 Bionic SoC
3 Tips for Making Supply Chain Management More Sustainable
Smartphones Could Be Next in Global Chip Shortage
Electrical Slip Ring, All You Need to Know
Why Manufacturers Will Embrace Surface-Mount Tech--Sooner or Later
MORE INDUSTRY NEWS
July 22, 2021
Moisture Barrier Bag Issues
Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
New Approaches to Develop a Scalable 3D IC Assembly Method
In this paper, we will discuss various assembly options and the challenges posed by each.
Production Floor
Two-Dimensional Antennas Allow Extreme Thinness and Flexibility
Two-Dimensional Antennas Allow Extreme Thinness and Flexibility
Antennas so thin they can be sprayed into place are robust enough to provide a strong signal used by 5G mobile devices.
Technology Briefing
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab
Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech
Training Service Robots for the Mainstream
Researchers are making steady progress toward creating robots that can be cost-effectively trained to perform real-world service tasks.
Technology Briefing
Vapor Phase Quality Improvement
Today's state of the art single-phase vapor phase provide the solutions needed for lead-free soldering and requirements for a void-less solder joint.
Production Floor
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Analysis Lab
Lubricant Causes Quality Problems
Lubricant Causes Quality Problems
Cylinder locks coated with a light oil spray started to stick. Did a change in the process affect quality, and if so how?
Mysteries of Science
Trouble With Skewed DPAK Components
Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture. The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this concern.
Board Talk
Capacitive Sensor System Using Printed Electronics on Window Glass
The authors demonstrate how to produce a capacitive sensor system on three millimeter window glass by combining the piezo-jet technology and a pick-and-place system.
Production Floor
Aerial Ridesharing in 2021 and Beyond
Aerial Ridesharing in 2021 and Beyond
When last explored the world of flying taxis and personal aviation vehicles, the climate for business in general and transportation, was very different.
Technology Briefing
Voiding/Drop Test for Mixed Alloy BGA Assembly
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated.
Analysis Lab
High and Matched Refractive Index Liquid Adhesives for Optical Device
High and Matched Refractive Index Liquid Adhesives for Optical Device
High and matched refractive index liquid adhesives are required in several electronics devices, where the liquid adhesives are in the optical pathway.
Materials Tech
Control of the Underfill of Surface Mount Assemblies
Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
West-Tech Materials
West-Tech Materials
West-Tech Materials represents leading manufacturers specializing in ...
Air-Vac Engineering Company, Inc.
Air-Vac Engineering Company, Inc.
Air-Vac Engineering develops innovative solutions for almost ...
Glenbrook Technologies Inc.
Glenbrook Technologies Inc.
Since 1983, Glenbrook Technologies has continuously reinvented ...
Weller Tools
Weller Tools
When you say "soldering", you mean Weller. ...
Technology Corner
About XIMEA company video
XIMEA GmbH
Making Ovens Smarter
KIC
A Full-Line of Programming Solutions
BPM Microsystems
Light-Cure Conformal Coatings
Dymax Corporation
Base Board Repair and Rework
Circuit Technology Center Inc.
MORE TECHNOLOGY CORNER
Board Talk
Moisture Barrier Bag Issues
Trouble With Skewed DPAK Components
Can Mixing Wave Solder Pallets Cause Contamination?
How to Reduce Voiding on QFN Components
Calculating Failure Rate During Rework
Do BGA Components Warp During Reflow?
Can Water Contamination Cause Failure?
Why Uneven Conformal Coating?
MORE BOARD TALK
Questions and Comments
Moisture Barrier Bag Issues
We are a manufacturer of flexible and rigid flex circuits ...
Bob Burns, Printed Circuits LLC
Can Water Contamination Cause Failure?
Yes even boards get water washed must to dried properly ...
Sandip Raut, Jabil Ckt India Pvt Ltd
What is the Suggested Humidity Level for Electronics Assembly?
The concern here is only for Electronics Manufacturing. MSL Classification ...
Pascal Dumontet, RENAULT SAS
What is the Suggested Humidity Level for Electronics Assembly?
I have run SMT assembly lines on the west coast ...
Andrew Dalisa, LinkIt Associates
What is the Suggested Humidity Level for Electronics Assembly?
I have run SMT assembly lines on the west coast ...
Andrew Dalisa, LinkIt Associates
MORE COMMENTS
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