circuit insight
Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk
Non-Contact Measurement of Conformal Coating Thickness
Conformal coating is designed to provide protection and long-term reliability to printed circuit boards (PCB) in harsh environments where high humidity, high temperature, corrosive gases, or salt spray may be present. This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces.
Technical Paper
Sponsor
Rehm-Thermal-Systems-GmbH

"Flying" SMD Components
This paper deals with the fundamentals of heat transfer and the test procedures show how the SOD323 can be processed given a suitable selection of solder paste and oven settings. Read more.
Rehm Thermal Systems
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution.
Technical Paper
3D Aerosol Jet Printed Interconnects on Bare Die
Aerosol Jet Printing can provide many enhancements over traditional bare die attachment techniques. Previous studies have shown that AJ technology offers advantages in the millimeter wave frequency range, such as a significant reduction of insertion loss and the ability to design the line impedance as required.
Technical Paper
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
This paper reports an ensemble of strategies for the successful miniaturization of EEG in a fully-flexible, wearable and wireless platform.
Technical Paper
Sponsor
Summit-Interconnect

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk
High-Density Adaptive Redistribution Technology for Embedded High I/O Components
Improving the performance of semiconductor chips and advancing packaging features are critical. One solution is the use of miniaturized packages with advanced embedded components.
Technical Paper
Sponsor
BEST-Inc.

Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.
Electronic Assembly Rework Best Practices: Cleaning Conditions
Electronic Assembly reliability must consider process residues and cleanliness. This research studies the electrical effects of flux and process residues following rework.
Technical Paper
Pin-in-Ball and Non-Solder Ball Grid Arrays Demonstrate Advancements
This paper will focus on the research and development of the Next Gen Pin-in-Ball Grid Array connectors, and the non-solder ball versions.
Technical Paper
Qualitative Model Describing Hot Tear Above VIPPO and Other Design Elements
The mechanism for the formation of Hot Tears is discussed and applied to other design elements that can be found on Printed Circuit Board Assemblies.
Technical Paper
Sponsor
DL-Technology

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
Can Silver Cause Solder Embrittlement?
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario.
Board Talk
Superior Thermal Cycling Reliability of PB-Free Solder Alloy
Alternative solders meet stringent environmental regulations, requirements for greater mechanical reliability, and high temperature service environments.
Technical Paper
Sponsor
kyzen

pH Employment in Electronic Cleaning
The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Download now.
KYZEN
Non-Contact Measurement of Conformal Coating Thickness
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces. In this work, conformal coating wet and dry thicknesses were measured using CCM and traditional methods. FR4 boards with varied color solder masks and components were created for realistic use cases.
Technical Paper
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kyzen
Sponsor
Viscom

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom
Circuit-Technology-Center
Sponsor
AI-Technology-Inc

Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.
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