Technical Papers
Investigation & Results on the Phenomenon of "Flying" SMD Components
The Transformation of the New Generation of X-ray Machine
Master Advanced Packaging Inspection
Keys to Component Lead Tinning Success
X-Ray Supports Quality Assurance, Counterfeit Detection
Be Selective in Partnering with a Soldering Equipment Supplier
Effects of Long-Term Storage on Mechanical and Electrical Integrity
Selective Equipment in Spec?
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
How Tech Tackles Security Issues in the Supply Chain
VIEWPOINT 2023: Jonathan Wol, President, Pillarhouse USA Inc.
Slowing Consumer Device Sales Brought Down Revenue Growth of Top-Tier North American Distributors in Q4 2022
IBM tops revenue estimates, says it will cut 3,900 jobs
Identifying Counterfeit Goods Through Additive Manufacturing
MORE INDUSTRY NEWS
January 26, 2023
Wet-Based vs. Dry-Based Cleaning
Wet-Based vs. Dry-Based Cleaning
For automatic under-stencil cleaning there are many cleaning methods including dry vacuum cleaning, wet dry vacuum cleaning. What factors should we consider to select wet based cleaning versus dry based cleaning? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this scenario and offer their suggestions.
Board Talk
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Paper documents experimental work performed to understand the impact on mid-chip solder balling from the manufacturing process and flux chemistry.
Production Floor
Cobalt Supply Chain Problem
Cobalt Supply Chain Problem
Cobalt is one of the most significant supply chain risks threatening the widespread adoption of electric cars, trucks, and other electronic devices requiring batteries.
Technology Briefing
High Reliability Techniques For Benchtop PCB Cleaning
The purpose of this study was to determine whether or not aerosol benchtop cleaning can consistently and reliably clean reworked circuit boards.
Analysis Lab
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations.
Materials Tech
Early Design Review of Boundary Scan To Enhancing Testability
Paper reviews what portions of a design can be covered structurally and what are covered functionally, to provide the best diagnostics to discover faults?
Production Floor
Reliability Testing of Consumer Products
We will look at reliability testing of consumer products and which of these test and analytical tools can be used, and how they affect the product development process.
Analysis Lab
Has My Flux Expired?
Has My Flux Expired?
What specific attributes occur in an expired flux? How do you know if a flux is bad and shouldn't be used? Are there any simple tests?
Board Talk
75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures.
Materials Tech
Artificial Intelligence System Can Track Autonomous Aircraft
Artificial Intelligence System Can Track Autonomous Aircraft
A new AI system can track aircraft; predict the intent of other aircraft; coordinate with their actions; and communicate with pilots and air traffic controllers.
Technology Briefing
An Interesting Approach to Yield Improvement
The approach involves spending a little more money than normal at the start of project and the results show savings of many times more than this outlay.
Production Floor
On-Board Package Decapsulation Techniques for Failure Analysis
Various on-board decapsulation techniques to remove package overmold while preserving wire bonds either gold (Au) or Copper (Cu) were evaluated.
Analysis Lab
The Phantom Switch
The Phantom Switch
A flat panel switch turned on but only when a nearby door was slammed shut. What was causing the switch to activate?
Mysteries of Science
Stencil Design for Ultra Fine Pitch Printing
Miniaturization is pushing the stencil printing process. As features become smaller, solder paste transfer efficiency is becoming more critical.
Production Floor
Chemical Oxidation to Break Down Plastic Waste
Chemical Oxidation to Break Down Plastic Waste
Technology uses oxygen and catalysts to break down plastics into biologically friendly chemical building blocks. Then into a biopolymer for nylon production.
Technology Briefing
Low Temperature SnBi Containing Solder Pastes with Lead-Free Solder Balls
A detailed study has been carried out on low temperature lead-free solder paste that utilizes Bi bearing alloys.
Analysis Lab
Dissolution Rate of Specific Elements in SAC305 Solder
Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Materials Tech
Evaluating Manual and Automated Heat Sink Assembly
This paper illustrates the use of strain gauge testing and Finite Element Analysis as a simulation tool to optimize the heat sink assembly process.
Production Floor
Supplier Spotlight
XACT PCB
The world's leading provider of factory integrated Printed Circuit Board ...
Promex Industries, Inc.
Promex is a rare breed of microelectronics assembly specialist. Our ...
Nihon Superior Co., Ltd.
Nihon Superior was founded in 1966 when it began marketing ...
Specialty Coating Systems, Inc.
With over 45 years of application and engineering expertise, SCS ...
FULL SUPPLIER DIRECTORY
Board Talk
Wet-Based vs. Dry-Based Cleaning
Has My Flux Expired?
Seeking Alternatives to Solvent Cleaning
Processing Circuit Boards with BGAs On Both Sides
Solder Boards Not Holding Up to Shock Testing
What is the Life Span of a Profile Board?
The Best Method for Reworking Ultra-Micro Chips
Dross Contamination After Selective Soldering
MORE BOARD TALK
Questions and Comments
The Best Method for Reworking Ultra-Micro Chips
For these micro passives, we typically use irons with micro ...
Alan Couchman, Process Sciences, Inc.
Reliability of Tin Lead Solder vs. Lead Free Solder
To Back-up what the brothers say, between 2007 and 2021 ...
Alan Woodford, Zentech Manufacturing
How To Rework Warped PCBAs?
Here is the military procedure to restore a warped PCB ...
Frank Honyotski, STI Electronics Inc.
MORE COMMENTS
Cartoon
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