Technical Papers
Stencil Printing 008004/0201 Aperture Components
Streamline & Improve Conformal Coating Results with Inline Inspection
Extending the Golden Hour in the SMT Assembly Line
High-Performance, Light and Moisture Dual-Cure Automotive Conformal Coating
11 Ways to Get Your PCBs Faster
Best Practices for Disinfecting for COVID-19 of Electronic Products & Assemblies
5G is Turning up the Heat
True3D™ Innovations Powered by AI
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Hon Hai's US Plant Wins Google Server Contract
Can Detroit Catch Tesla?
Xiaomi's revenue growth spikes after Huawei slide
Samsung takes one-third of global TV market in Q3
Conversational Commerce Is Revolutionizing Ecommerce
MIT Project Helps ALS Patients Communicate Using Sensors
Turning the Body Into a Wire
iPhone 12 Pro Max Teardown
MORE INDUSTRY NEWS
November 24, 2020
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper and a .4 - .8 micron thickness on tin-nickel. The Assembly Brothers, Phil Zarrow and Jim Hall, respond to this question.
Board Talk
Evaluating Manual and Automated Heat Sink Assembly
This paper illustrates the use of strain gauge testing and Finite Element Analysis as a simulation tool to optimize the heat sink assembly process.
Production Floor
Autonomous Vehicle Software Analyzes and Predicts Driving Events
Autonomous Vehicle Software Analyzes and Predicts Driving Events
Researchers at the Technical University of Munich have now developed a software module that continuously analyzes and predicts events while driving.
Technology Briefing
Bending Strength of Solder Joints as a Function of Joint Length
The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths.
Analysis Lab
Effect of Bi Content on Properties of Low Silver SAC Solders
Effect of Bi Content on Properties of Low Silver SAC Solders
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys.
Materials Tech
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor
Effect of Thermal Cycling on Subsequent Drop Behavior of Assemblies
This paper presents the effect of a priori thermal cycle on subsequent drop to failure behavior of CGAs with 1272 columns.
Analysis Lab
Can High Particle Concentrations Impact PCB Assembly?
Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control?
Board Talk
High and Matched Refractive Index Liquid Adhesives for Optical Device
High and matched refractive index liquid adhesives are required in several electronics devices, where the liquid adhesives are in the optical pathway.
Materials Tech
China and the U. S. Face-Off on the AI Battlefield
China and the U. S. Face-Off on the AI Battlefield
The Sino-American Cold War is likely to require gaining or retaining clear leadership in AI, quantum computing, nanotech and biotech.
Technology Briefing
Stencil Design for Ultra Fine Pitch Printing
Miniaturization is pushing the stencil printing process. As features become smaller, solder paste transfer efficiency is becoming more critical.
Production Floor
Pennies Converted To Dimes
Pennies Converted To Dimes
A vendor was sorting a vending machine's change when he came across some strange looking dimes that looked like silver pennies.
Mysteries of Science
Trouble With Skewed DPAK Components
Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture. The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this concern.
Board Talk
Virtual Reality and Augmented Reality for Businesses
Virtual Reality and Augmented Reality for Businesses
A team developed moldable nanomaterials using metamaterials, allowing the commercialization of inexpensive and thin VR and AR devices.
Technology Briefing
Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Analysis Lab
Hybrid Sintering for High-power Density Devices Aerospace Applications
Hybrid Sintering for High-power Density Devices  Aerospace Applications
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications.
Materials Tech
Evaluation of Stencil Technology for Miniaturization
The objective of this study is to assess the impact of various stencil materials and fabrication methods on the repeatability of solder paste deposition.
Production Floor
Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
Analysis Lab
✷ ✷ Supplier Spotlight ✷ ✷
Qualitek International Inc.
Qualitek International Inc.
Established in 1980 headquarter in Addison, IL. ...
GOEPEL Electronic
GOEPEL Electronic
With advanced testing and inspection systems for ...
Nordson MARCH
Nordson MARCH
Nordson MARCH is the global leader in ...
IEC Electronics Corp.
IEC Electronics Corp.
By utilizing our on-site analytical laboratories or ...
Technology Corner
ATS Ultra-Cool Active and Passive Coolers for High-Powered Devices
Advanced Thermal Solutions, Inc.
As the first city in Germany, Hanau buses run with UV-C air desinfection systems from Heraeus
Heraeus Materials Technology, LLC
Diffusion Bonding Furnace - PVA TePla Industrial Vacuum Systems GmbH
PVA TePla
How to Choose the Right Rigid Flex Manufacturer
Printed Circuits, LLC
Reducing Risk in Your Custom Cable Assembly
Epec Engineered Technologies
MORE TECHNOLOGY CORNER
Board Talk
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Can High Particle Concentrations Impact PCB Assembly?
Trouble With Skewed DPAK Components
Moisture Barrier Bag Issues
How to Reduce Voiding on QFN Components
Can Mixing Wave Solder Pallets Cause Contamination?
Do BGA Components Warp During Reflow?
Calculating Failure Rate During Rework
MORE BOARD TALK
Questions and Comments
Trouble With Skewed DPAK Components
I didn't see if they were all skewing the same ...
Steve Lee, IDA North America
Trouble With Skewed DPAK Components
I already corrected DPAK skewing by breaking the stencil aperture ...
Helio Jose Cantarino, Heson Consultoria, Brazil
How to Reduce Voiding on QFN Components
Through our various studies on ground pad voiding, AIM discovered ...
Logan Jelinske, AIM Solder
How to Reduce Voiding on QFN Components
Adjusting your reflow profile can be a tool to minimize ...
Mitch Holtzer, Alpha Assembly Solutions
How to Reduce Voiding on QFN Components
Voiding occurs because the gases generated by the flux and ...
Alan Woodford, NeoTech
MORE COMMENTS
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