Electronics Manufacturing and Electronics Assembly

Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Implementing Robust Bead Probe Test Processes
This paper defines a process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly.
Production Floor

6G Mobile Communications to Utilize AI to Control Devices
The 6th generation of mobile communications promises higher data rates, shorter latency, and increased densities of terminal devices..
Technology Briefing

Via-In Pad Plated Over (VIPPO) Design Considerations
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints.
Analysis Lab

Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech

Condensation Testing - A New Approach
The data for a range of conformal coatings are correlated back to the material type, and coverage and thickness by cross-sectioning.
Production Floor

Case Study for Improving the PCB Print Process Using Factory Data
The analytics of big data could help us to understand that process better. We can buy better equipment and select the parameters more carefully.
Analysis Lab

Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider?
Board Talk

DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech

Increased Computer Chip Processing with Conductive Titanium Oxide
A method to make non-volatile computer memory which may help solve a problem that has been holding back machine learning has been developed.
Technology Briefing

Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor

Wetting and Solidification of Pure Tin on Polycrystalline Intermetallic Substrates
This study analyzes the wetting and interface formation between polycrystalline CuxAly intermetallic substrates and the pure Beta-Sn phase.
Analysis Lab

The Olympics Balloon Fiasco
As the opening ceremonies for the 1984 Olympics were being broadcast reports of "lost signal" started coming into the control center.
Mysteries of Science

Gold Stud Bump Flip Chip Bonding on Interconnect Devices
This paper presents the studies on flip chip thermo-compression bonding (TCB) of gold stud bumps on MID substrate.
Production Floor

Two-Dimensional Antennas Allow Extreme Thinness and Flexibility

Antennas so thin they can be sprayed into place are robust enough to provide a strong signal in the bandwidths that will be used by 5G mobile devices.
Technology Briefing

Void Reduction in Reflow Soldering Processes by Sweep Stimulation
The insights of the feasibility study were the basis for the integration of the voidless technique into an industrial production process.
Analysis Lab

Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads

In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance.
Materials Tech

Choosing the Right Stencil Options
Quality and yield are directly linked to the solder printing process. A constant paste depot is critical to a stable soldering process.
Production Floor

✷ ✷ Supplier Spotlight ✷ ✷

Kyzen Corporation
KYZEN has been pioneering award-winning, environmentally responsible, ...

AI Technology, Inc.
AI Technology has more than 29 years ...

Ultrasonic Systems, Inc.
Ultrasonic Systems, Inc. (USI) manufactures high performance ...

Conductive Containers, Inc
It’s always fun and rewarding to be ...

FULL SUPPLIER DIRECTORY

Technology Corner

Where Soldering is a Passion

SEHO Systems GmbH

SMT Components Storage Solutions

ESSEGI AUTOMATION S.r.l.

Assure X-ray Component Counters

Nordson Dage

High Performance 3D AOI – S3088 DT

Viscom Inc.

MORE TECHNOLOGY CORNER

Board Talk

Solder Paste Volume for BGA Rework

Reflow For Rigid Flex

Delay Before Cleaning Partial Assemblies

Problems With Starved "J" Lead Joints

Solder Paste Transfer Efficiency - What/Why

Can a CTE Mismatch Cause Reliability Problems?

Going Beyond Your Solder Paste Work Life

Issues Mixing Silicone and Acrylic Conformal Coatings

MORE BOARD TALK

Questions and Comments

Why Battery Powered Cars Are Not the Future

The author gives irrational reasons for negativity about the electric ...
Egdir Trebor

Solder Paste Volume for BGA Rework

Since rework can never be as controlled or consistent as ...
Richard Stadem, Analog Technologies Corp.

Going Beyond Your Solder Paste Work Life

Over time, the ratio of powder to flux will increase, ...
Mitch Holtzer, Alpha Assembly Solutions

Cause of Damage During Through-hole Component Insertion

This comment pertains more to operations which utilize wave soldering ...
Tim Hufnell, Retired, Smiths Aerospace

Cause of Damage During Through-hole Component Insertion

Agree with the brothers on checking equipment but hole size ...
Bradley Fern, Entrust

MORE COMMENTS

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