Electronics Manufacturing and Electronics Assembly

Sponsor

Tech Paper - Keys to Component Lead Tinning Success
This paper explores the challenges and best practices of component tinning, emphasizing temperature control, flux selection, and soldering techniques. Download this free tech paper.
Circuit Technology Center

Technical Papers

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

Maintenance: The Basics of Cleaning Series Part 4

The Economics of Electronic Component Salvage and Reuse

Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing

The "Fried Egg" Effect in Soldering

Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices

Innovative Power Module Assembly Solutions

MORE TECHNICAL PAPERS

The Economics of Electronic Component Salvage and Reuse

This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.

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Ask the Experts

Insufficient Barrel Fill on Through-hole Components

Is Solder Mask Considered an Insulator

Challenges with 01005 Components

MELF Component Misalignment

Point to Point Soldering vs Drag Soldering

Contamination Using Solvent Dispensers

Gold Plated Hole Defects

Shelf Life Limit for Soldering Old Components

MORE ASK THE EXPERTS

June 19, 2025

The Impact of Harsh Environments and Ionic Contamination on Post-Reflow Circuit Assemblies

Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM).
Analysis Lab

In-Situ Thermal Radiographic Failure Analysis of Capacitor Encapsulant Fracturing
Multiple tantalum capacitors are SMT attached to PCBs. Failures or fractures were observed at contractor SMT assembly lines and not on RTX lines.
Production Floor

Sponsor

Bismuth in Solder Alloys
Bismuth is a primary constituent in many low-temp solders. It also serves as an additive element in SAC solders that reinforces joint durability & optimizes wetting characteristics.
AIM Solder

Kinetics of a Layer of Bismuth at the Anode of a Sn-Bi Based Solder Joint
Measurements of the electrical resistance of low temperature solder during current stressing were shown to provide indicators of the thickness of continuous layers of Bi accumulated at the anode.
Production Floor

Living With PB-Free in High Performance Engineering Design
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by this material.
Analysis Lab

Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating.
Materials Tech

Sponsor

Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond

Minimizing Printed Circuit Board Warpage in Assembly Process
The purpose of this paper is to present a cleaning process for difficult no-clean, lead-free and high temperature flux residues on reflowed PCBs.
Production Floor

Advanced Substrate Technology for Heterogeneous Integration
The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process.
Analysis Lab

Sponsor

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Dross Contamination After Selective Soldering
We have discovered a fine low density dross on PCBs after selective soldering. The dross is difficult to see. Is there an effective way to clean this?
Board Talk

2nd Generation of indium TIM
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Materials Tech

Materials for Advanced Ball-Attach Processes for Advanced Packages
This paper will discuss advantages of advanced ball-attach materials developed to meet the challenges of advanced packaging.
Materials Tech

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Managing Thermomechanical Behaviour in Automotive Electronics
With high density interconnection designs, advanced packaging, localised self heating, sources of thermomechanical stress are introducing complex failures.
Production Floor

Selective Soldering Design for Reliability Using SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

The Static Charge Overload
A plastic molding plant had been running for less than a year. Suddenly parts began testing positive for an electrical charge. What caused it?
Mysteries of Science

Low Temperature Solder-SMT Manufacturability and Quality Considerations
This paper focuses on establishing package warpage boundary conditions and identifying key process parameters for a successful LTS assembly.
Production Floor

Autonomous Vehicles Still Decades Away: 2019
This paper examines the challenges to progress from existing advanced driver-assistance systems to level 4 and 5 autonomous vehicles.
Analysis Lab

Understanding Creep Corrosion Field Fails

Dendrites, Electrochemical Migration and parasitic leakage, can be caused by process related contamination. This paper explores aspects of the creep corrosion chemical reaction.
Analysis Lab

Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Materials Tech

Acid Copper Electroplating Processes for Flash Etching

The focus of this study was to investigate the underlying mechanism of V-pitting and to develop a process to withstand or resist the pitting.
Production Floor

Latest Industry News

Apple Looking to Make 'Premium' Priced Folding iPhones Starting Next Year

Gartner Announces 2025 Rankings of the Global Supply Chain Top 25

Amazon CEO Andy Jassy tells workers: AI will replace some of you

Self-driving cars may only lower ride-hailing prices under specific conditions

Meta is offering up to $100 million to lure AI talent, says OpenAI's Sam Altman

MORE INDUSTRY NEWS

Sponsor

Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics - no trade-offs needed.
AIM Solder

Questions and Comments

Lead Poisoning - Was it from Wine?

Similar as to how tomatoes got their bad rap for ...
Richard Gwaltney, Kyocera-AVX Components Jacksonville

High Thermal, High Temperature Interconnects for Ultra High Power LEDs

As power densities rise, managing localized thermal loads is more ...
Ethan, Summit Interconnect

iNEMI Board Assembly –Press-Fit Technology Roadmap

A very interesting article. UIBEL CONSULTING is participating in the ...
Frank Alexander Uibel, Uibel Consulting

MORE COMMENTS

Sponsor

Underfill Epoxy Offers Thermal Conductivity
Master Bond EP29LPTCHT is a low viscosity adhesive that can be used for underfill & encapsulation apps. It offers thermal conductivity & electrical insulation.
Master Bond