Technical Papers
Effects of Long-Term Storage on Mechanical and Electrical Integrity
Selective Equipment in Spec?
Why the need for 3D SPI?
Dealing with the Results of the Pandemic
Direct Immersion Gold as a Final Finish
Essential Practices for Gold Mitigation of Electronic Components
Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
Solder Alloy Contribution to Robust Selective Soldering Process
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Why Apple is Diversifying and Looking to Vietnam
Nearshoring to Mexico: 3 Strategic Considerations
iPhone 14: Can India replace China as the world's factory?
Reality Gets Closer to Dream of Humanoid Robots
IHMC's Nadia Is a Versatile Humanoid Teammate
MORE INDUSTRY NEWS
October 6, 2022
Is No-Clean the Trend for QFN Components?
Is No-Clean the Trend for QFN Components?
Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question and share their own experiences.
Board Talk
Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor
Mastering Innovation's Toughest Trade-Offs
Mastering Innovation's Toughest Trade-Offs
Innovation in dynamic environments is rife with critical tensions. When left unaddressed or mishandled, these tensions sink teams and organizations.
Technology Briefing
Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Analysis Lab
Microalloyed Sn-Cu Pb-Free Solder for High Temp
Microalloyed Sn-Cu Pb-Free Solder for High Temp
While susceptibility to tin whisker growth remains a barrier to the transition to Pb-free, there is now general acceptance that there are reliable alternatives.
Materials Tech
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor
Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
Analysis Lab
Acceptable Rate for Head in Pillow?
Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable?
Board Talk
High Performance Light and Moisture Dual Curable Encapsulant
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Materials Tech
Diodes As One Way Regulator Valves
Diodes As One Way Regulator Valves
Diodes are in nearly every electronic device, acting as one-way regulator valves. Diodes allow electricity to flow in only one direction through the device.
Technology Briefing
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab
Sealed Membrane Switch Mystery
Sealed Membrane Switch Mystery
A factory was building membrane switches but all the switches from units in Denver failed. What was unusual about Denver?
Mysteries of Science
Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor
Neuromorphic Chip Runs Computations Directly in Memory
Neuromorphic Chip Runs Computations Directly in Memory
NeuRRAM neuromorphic chip brings AI closer to running on edge devices, performing tasks without relying on a network connection to a centralized server.
Technology Briefing
Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
Analysis Lab
Design and Fabrication of Ultra-Thin Flexible Substrate
Design and Fabrication of Ultra-Thin Flexible Substrate
This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
Materials Tech
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor
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Board Talk
Is No-Clean the Trend for QFN Components?
Acceptable Rate for Head in Pillow?
What Rate is World Class for SMT Machines?
Why Do Our Boards Warp During Reflow?
Should Apertures be Home Plate or Inverted Home Plate?
Is Customer Approval Required for Class 3 Repair?
Selective Solder Pot Temperatures
Solder Pallets With Titanium Inserts - Yes/No?
MORE BOARD TALK
Questions and Comments
What Rate is World Class for SMT Machines?
Actually, it is not how fast nor how accurately a ...
Richard Stadem, General Dynamics Mission Systems
What Rate is World Class for SMT Machines?
Basically, it would seem that this is a comparison between ...
Jaye Waas, Renkus-Heinz
Selective Solder Pot Temperatures
Selective pots using common Pb-Free alloys (SAC305, SAC0307 etc) are ...
Timothy ONeill, AIM
MORE COMMENTS
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