Technical Papers
Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes
An Essential Guide to Optimize Selective Soldering Processing
Is My Printed Circuit Board Wash Concentration in Check?
Ultraminiature Soldering: Techniques, Technologies, and Standards
X-Ray Inspection Verifies Quality of Complex PCBs
Cold Underfill Component Removal
Cleaning Performance Evaluations for Jettable Pastes for Advanced SMT Assembly Processes
Dispensing 2-Part Adhesives
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
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MORE INDUSTRY NEWS
June 13, 2024
What Is the Recommended Component Storage Environment?
What Is the Recommended Component Storage Environment?
What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature? The Assembly Brothers, otherwise known as Jim Hall and Phil Zarrow, share their own recommendations and suggestions.
Board Talk
Impractical Stencil Aperture Designs to Enable M0201 Assembly
Implementation of metric 0201 or M0201 size surface mount passives will help enable the next generation form factor electronic packaging.
Production Floor
Implementing 3D Integration with 2D Materials
Implementing 3D Integration with 2D Materials
In a new study, researchers identify a potentially game-changing remedy: seamlessly implementing 3D integration with 2D materials.
Technology Briefing
Increased Reliability of Quad Flat No Lead Wettable Flank Connections
The focus of this study is to investigate the reliability of the immersion tin layers plated by a tailored immersion tin process for QFN flank plating.
Analysis Lab
Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions.
Materials Tech
3D Assembly Processes a Look at Today and Tomorrow
This paper explores various technologies available today and some that are starting to appear and illustrates some key items for each technology.
Production Floor
A Control-Chart Based Method for Solder Joint Crack Detection
The purpose of this study is to evaluate the effect of failure criteria on the reported thermal fatigue life and find out which failure criterion can detect failure sooner.
Analysis Lab
How To Prevent Mid-chip Solder Balls?
How To Prevent Mid-chip Solder Balls?
Is there a mathematical calculation that can be used to predict solder balling for a given package size?
Board Talk
Suitable Flux Medium for Cleanable and No-Clean Solder Pastes
This paper presents two concrete studies. Development steps will be validated by standardized tests, home-made testing, and industrial evaluations.
Materials Tech
Super-Capable Robots to Share Human Labor
Super-Capable Robots to Share Human Labor
Technology can do more jobs formerly performed by humans. This could result in AI automating tasks in the production of goods, services and ideas.
Technology Briefing
Vapor Phase Quality Improvement
Today's state of the art single-phase vapor phase provide the solutions needed for lead-free soldering and requirements for a void-less solder joint.
Production Floor
Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated. A total of nine groups of PCB were evaluated.
Analysis Lab
The Phantom Switch
The Phantom Switch
A flat panel switch turned on but only when a nearby door was slammed shut. What was causing the switch to activate?
Mysteries of Science
Heterogenous Integration using Fan-out Wafer-level Packaging Technology
Heterogenous Integration using Fan-out Wafer-level Packaging Technology
An overview of packages having multiple die along with double-sided build up layers will be presented. This technology can provide high module yields.
Production Floor
Real-World Implementation of Robotic Exoskeletons
Real-World Implementation of Robotic Exoskeletons
Research represents a step toward real-world implementation of robotic exoskeletons designed to help humans with walking and physically demanding work.
Technology Briefing
Thermal Fatigue Reliability of SAC305 due to Mixed Metallurgy Assembly
This study presents thermal fatigue data generated in thermal cycling for the case of BGA mixed metallurgy assembly.
Analysis Lab
Engineered Flux for Low Temperature Solders
Engineered Flux for Low Temperature Solders
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper.
Materials Tech
How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Production Floor
Board Talk
What Is the Recommended Component Storage Environment?
How To Prevent Mid-chip Solder Balls?
The Best Storage Method to Protect Against Corrosion
Risks Using Flux Only for Soldering BGAs
Solder Paste Printing First Pass
Gooey Flux Residue Left Behind
Requirements for Depaneling and Rescoring Circuit Boards with BGA Components
Modify Rework Procedures for Assemblies Fabricated Using OSP?
MORE BOARD TALK
Questions and Comments
The Best Storage Method to Protect Against Corrosion
Over-all Nitrogen is the best. But, if the boards have ...
Jaye Waas, Renkus-Heinz
Solder Paste Printing First Pass
The viscosity of paste reaches optimum during a few kneed ...
Robert Gray
What Causes Solder Icicles During Wave Soldering
All hints so far are very helpful. You can also ...
Luc Mitrea, Wittenstein SE
MORE COMMENTS
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