Technical Papers
Increase Production Yield by Investing in Leading-Edge Equipment
The Essential Guide to Large-Volume Thermal Interface Materials (TIM) Dispensing
Reduction of voids in solder joints with vacuum
Selective Soldering High Thermal Mass and Fine-Pitch Components
Not All 3D Inspection Is Created Equal
Essential Tools For High Accuracy Thermal Profiling
Inductive Soldering for High Thermal Demand Applications
X-Ray Supports Solder Paste Development
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Cognition Without Computation
Remote Work Is Here To Stay
Microsoft beats revenue expectations, reporting 22% growth
Putting 5G Into Practice for the Industrial IoT
Tips to avoid work stress for your employees
Am I Going SMAD?
Verizon partners with Amazon to use tech giant's satellite internet system for rural broadband
Exploring Quantum Technology: Qiskit and RasQberry
MORE INDUSTRY NEWS
October 28, 2021
How to Cost a Board
How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly. The Assembly Brothers, Phil Zarrow and Jim Hall, share their suggestions and experience with creating a cost matrix.
Board Talk
Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Production Floor
Space the Next Frontier for Business
Space the Next Frontier for Business
Few things will be more important in the coming decades than who wins the game-changing struggle for control of space.
Technology Briefing
Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab
The Role of Organic Amines in Soldering Materials
The Role of Organic Amines in Soldering Materials
Paper shows that tests can be developed to characterize fundamental properties of activator packages that directly impact performance.
Materials Tech
Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor
Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
Analysis Lab
Issues With Solder Paste Transfer Efficiency
Issues With Solder Paste Transfer Efficiency
With transfer efficiency and its relationship to solder paste volume, can you produce a transfer efficiency over 100% of the theoretical volume?
Board Talk
Behavior of Materials in the Manufacturing Environment
This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead-free assembly.
Materials Tech
Plastics That Can Be Recycled Immediately
Plastics That Can Be Recycled Immediately
A team announced the invention of a new plastic that could tackle the waste crisis head-on. It’s called polydiketoenamine, or PDK.
Technology Briefing
Hot Air BGA Rework Process Improvement with a Touchless Temperature- Dependent Live-Feedback Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Production Floor
Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Analysis Lab
The Day They Shut Down Intel
The Day They Shut Down Intel
Chipmaker Intel had just started up a new chip factory when something odd caused a shut down. What lead to this development?
Mysteries of Science
Reliability of Stacked Microvia
Study was designed to understand the reliability of Type 1, 2, and 3 Microvias. The reliability test coupons included four stacks of microvias and a buried via.
Production Floor
Ultra-Precise GPS could Unleash a Robot Revolution
Ultra-Precise GPS could Unleash a Robot Revolution
Upgrades are boosting the accuracy of the most powerful global satellite positioning systems from several meters to a few centimeters.
Technology Briefing
AOI Capabilities Study with 03015 Components
Paper covers tests working with five AOI vendors to ensure successful testing of 03015 components, with emphasis on optimizing algorithm threshold settings.
Analysis Lab
Endocrine Disrupting Chemicals and Bioaccumulative Substances
Endocrine Disrupting Chemicals and Bioaccumulative Substances
The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the materials that require control or replacement.
Materials Tech
Good Quality Comes From Good Design for Test
This paper discusses how to maximize the benefits of boundary scan test, with examples of how designers should select the right components.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
Allvia, Inc.
Allvia, Inc.
ALLVIA, a leader in Through-Silicon Via (TSV) ...
SMT Parts, Inc.
SMT Parts, Inc.
At SMT Parts, Inc. we are dedicated ...
Pemtron
Pemtron
Based on 3D precision measurement and vision ...
Beta LAYOUT
Beta LAYOUT
The Beta LAYOUT group, with 170 employees ...
Technology Corner
Peel-A-Way Removal Terminal Carriers
Advanced Interconnections Corp.
Unitech PCB Cleaner Intro
Seika Machinery, Inc.
Real-time Visual PCB Analysis and Debug
XJTAG
Introducing Ni-Less ENIG-Premium
LiloTree
MORE TECHNOLOGY CORNER
Board Talk
How to Cost a Board
Issues With Solder Paste Transfer Efficiency
Variations in SAC 305 Solder
How Frequently Should We Recheck Profiles?
Solder Paste Beyond The Shelf Life?
Issues With Fillets on Via Holes?
Can Tape Residue Contaminate a Clean Tank?
Suggested Stencil Wipe Frequency?
MORE BOARD TALK
Questions and Comments
Solder Paste Beyond The Shelf Life?
I completely agree with Andrew Williams, but I would like ...
R. Dean Stadem, Analog Technologies Corp
The Impact of VIA and Pad Design on QFN Assembly
Overall very interesting article. I didn't know 9mil drill can ...
Guy, ePiccolo Engineering
Reflow Oven Zone Separation Challenges
Always keep in mind that life as a single board ...
R. Dean Stadem, Analog Technologies Corp
Reflow Oven Zone Separation Challenges
As Paul said, these tools should not be the only ...
John Burris, Carrier / Automated Logic
How Can We Prevent Our 0201 Nozzles From Clogging?
Mr. Mahilum was close... Sounds like the placement machine is ...
Ike Sedberry, ISEDS
MORE COMMENTS
Cartoon
"I'm sorry if I smell like a farm animal. My boss made me his scapegoat."
Copyright © Randy Glasbergen