Technical Papers
Meeting Critical Medical Demands with X-ray Inspection
How continuous reflow monitoring supports lean manufacturing
Using True3D Inspection Data as a Process Control Tool in a Smart Factory
Selective Soldering Fine Pitch Components on High Thermal Mass Assembly
An Engineer's Guide to Testing and Evaluating The Performance of Desiccant Bags
High-Performance, Light and Moisture Dual-Curable Encapsulant
Smaller Components and Increasing Placement Density
The Value of Accurate Inspection
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Electronics Industry Welcomes Supply Chain Review
North American PCB Industry Sales Begin 2021 Up 4%
Connected Cars: Show Me The Money
Allowing Machines to Listen, and Understand
China guides its self-driving startups into the fast lane
Treat Smart City Tech like Sewers, or Better
Target expands Apple partnership, will open mini shops inside stores
Suggested Stencil Wipe Frequency?
MORE INDUSTRY NEWS
February 25, 2021
Suggested Stencil Wipe Frequency?
Suggested Stencil Wipe Frequency?
How do we determine what is the best under stencil wipe frequency? As always, the Assembly Brothers Phil Zarrow and Jim Hall, share their own insights and experiences on this matter.
Board Talk
Low Temperature SMT Solder Evaluation
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Production Floor
Aerial Ridesharing in 2021 and Beyond
Aerial Ridesharing in 2021 and Beyond
When last explored the world of flying taxis and personal aviation vehicles, the climate for business in general and transportation, was very different.
Technology Briefing
i4.0, Are We Really Ready?
This paper evaluates SMT production and inspection machines and attempts to define their potential to act as ‘smart sensors’, the first building blocks towards i4.0.
Analysis Lab
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Materials Tech
The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry to Realize Smart Manufacturing
The future of manufacturing is dependent on the ability to develop and deploy suites of technology platforms to realize Smart Manufacturing and Industry 4.0.
Production Floor
Rework Practices for MicroLEDs and Other Highly Miniaturized SMT Components
This paper will focus on practices and innovative solutions to successfully repair these miniaturized, sensitive and often fragile components.
Analysis Lab
Can Tape Residue Contaminate a Clean Tank?
Can Tape Residue Contaminate a Clean Tank?
We leave masking and Kapton tapes that fall off during cleaning in the bottom of our wash tank. Can the adhesives contaminate the recycled solution?
Board Talk
pH neutral Cleaning Agents - Market Expectation & Field Performance
Study reviews performance of pH neutral cleaning agents compared to alkaline cleaning alternatives and includes field data.
Materials Tech
Lithium-Ion Batteries More Efficient By Adding Polymers and Fireproofing
Lithium-Ion Batteries More Efficient By Adding Polymers and Fireproofing
Adding polymers and fireproofing to a lithium-ion battery’s current collectors makes it lighter, safer and about 20 percent more efficient.
Technology Briefing
Concentration Monitoring & Closed Loop Control
In this study, the Flowsensor or acoustic concentration measurement system was evaluated at the original beta site detailing 20 days of concentration monitoring data.
Production Floor
Achieving Solder Reliability for LGA Ceramic Image Sensors
The stencil aperture design has more influence on overcoming CTE mismatch between the ceramic LGA and the FR4 PCB than the reflow oven temperature profile cool down slope.
Analysis Lab
Trapped in the Vacuum Chamber
Trapped in the Vacuum Chamber
A worker was cleaning inside a vacuum chamber when the door slammed shut. His partner turned the vacuum pump on. What happened?
Mysteries of Science
Aerosol Jet Printing of Conductive Epoxy for 3D
The authors describe efforts to improve both the dispensability of small volume dots and correspondingly improve the consistency and conductivity of the dots.
Production Floor
Increased Computer Chip Processing with Conductive Titanium Oxide
Increased Computer Chip Processing with Conductive Titanium Oxide
A method to make non-volatile computer memory which may help solve a problem that has been holding back machine learning has been developed.
Technology Briefing
Weibull Distribution and Analysis: 2019
This paper provides an overview of the Weibull distribution, its variables, types of data required, and interpretations that can be drawn.
Analysis Lab
Embedding Passive and Active Components: PCB Design and Fabrication
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech
Innovative Panel Plating for Heterogeneous Integration
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
Kyocera
Kyocera
Kyocera's global operations include a diverse range ...
Microscan Systems Inc.
Microscan Systems Inc.
Founded in 1982, Omron Microscan has a ...
Mycronic AB
Mycronic AB
Mycronic is a Swedish high-tech company that ...
Optimum Design Associates
Optimum Design Associates
Optimum Design is a diversified EMS company ...
Technology Corner
About XIMEA company video
XIMEA GmbH
Making Ovens Smarter
KIC
A Full-Line of Programming Solutions
BPM Microsystems
Light-Cure Conformal Coatings
Dymax Corporation
Component Rework Services
Circuit Technology Center Inc.
MORE TECHNOLOGY CORNER
Board Talk
Suggested Stencil Wipe Frequency?
Can Tape Residue Contaminate a Clean Tank?
When To Use Adhesive To Bond SMT Components
Reflow Oven Zone Separation Challenges
PCBA Inspection Concerns
How To Clean a Vintage Circuit Board Assembly?
Keys for Moisture Sensitive Device Control
When is it Time to Switch from Manual Assembly to Automation?
MORE BOARD TALK
Questions and Comments
When To Use Adhesive To Bond SMT Components
You also need to consider gluing when you have mixed ...
Sundaram Kumaravelu, EIT LLC
PCBA Inspection Concerns
There are different performance characteristics of ESD matting. The of ...
Jeffry Brake, Desco
How To Clean a Vintage Circuit Board Assembly?
Jim and Phil make a good point in saying that ...
Russell Claybrook, MicroCare, LLC
PCBA Inspection Concerns
I have seen a lot of mechanical damage to SMT ...
Alan Woodford, NeoTech
PCBA Inspection Concerns
If there are screw holes in the PCBA's, you can ...
Thomas Lundman, CrossControl AB
MORE COMMENTS
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