Electronics Manufacturing and Electronics Assembly

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura

Technical Papers

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

MORE TECHNICAL PAPERS

Ask the Experts

BGA Reballing Question

Conformal Coating Press Fit Connectors

HASL vs. Immersion Gold

Requirement for Toe Fillets

What is Causing Oxidation?

BGA Solder Ball Shelf Life

A Generic Reflow Profile

Soldering Components with Silver Pads

MORE ASK THE EXPERTS

November 18, 2025

Low-Voiding High-Reliability Lead-Free Solder Paste for Automotive

A novel lead-free solder paste, Durafuse® HR (DFHR), has been developed using Durafuse® technology. This technology demonstrates the combined merits of each constituent solder powder in the paste. DFHR is based on Sn-Ag-Cu alloy system and contains bismuth (Bi), indium (In), and antimony (Sb).
Materials Tech

Improving Reliability of High Performing PCB With Advanced Conformal Coating Use
The paper discusses a newly developed conformal coating system that meets the high performance, reliability and cycle time demand based on the hybrid polymer approach.
Production Floor

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e-media Advertising Delivers Results!
Introduce your technology, new products or services in our e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 125,000 professionals.
Circuitnet Media LLC

Variations in SAC 305 Solder
We use SAC 305 bar solder. We want to use a different supplier. Can we mix the new solder in with the current solder in our wave soldering systems?
Board Talk

Fine Pitch CU Pillar with Bond on Lead Assembly Challenges

A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution.
Production Floor

Interconnect Mechanical Performance with Variable UBM and Decreasing Bump Size
Current work seeks to better understand how the indium (In) bump size affects the respective interface kinetics and subsequent mechanical properties.
Analysis Lab

Sponsor

The new Smart Rack Mobile
Optimize your workflow with Smart Rack Mobile: intelligent storage, mobility, and real-time component management. Discover more!
Essegi Automation

Industry 4.0 for Inspection in the Electronics Industry

This paper investigates how the connected at-line x-ray system can improve production yield and lower costs when connected to the production line.
Production Floor

Conductive Cu Paste as a Via Filling Material for Through Glass Via (TGV)
We developed a Cu paste that can be used as a filling material for a through-glass via (TGV). A TGV substrate can be filled with Cu paste without voids.
Materials Tech

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Refurbished and Demo X-ray Inspection Systems
2024 Demo JewelBox-70T X-ray System and 2024 Demo JewelBox-100T X-ray System Refurbished & Demo Systems on sale with warranty. Learn more.
Glenbrook Technologies

Tenting Via In Pad - Yes or No?
Should the thermal vias on the bottom terminated components be tented on both sides to prevent flux trapping or is it okay to tent the top side only?
Board Talk

Pad-to-Pad Electrical Field Effects on Surface Insulation Resistance

In this paper, we examine the effect that various design factors of SIR test patterns has on the electric field on the surface of the PCB.
Analysis Lab

Novel Lead-Free Solder Alloys Based on Sn-Ag-Cu-Sb

In this work, thermal performance of five Sn/3.2Ag/0.7Cu/xSb (x is in the range of 4.5 to 6.5 wt.%) alloys were compared to select the optimized Sb content.
Materials Tech

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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Technical Cleanliness Assessments to Reduce Manufacturing Defects

This paper will detail a Contamination Assessment Protocol that conforms to the guidelines in VDA19 Part 2 which will not only enable areas with the highest risk of contamination to be targeted for improvement measures but will also provide documentary evidence of the effect of any such improvements.
Production Floor

A New X-Ray Source Technology for Demanding SMT Inspection
The paper contains data and images from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Analysis Lab

Sponsor

Sayaka Table-Top PCB Router, SAM-CT23S with online camera
Advanced image processing software offers easy programming and CAD base offline programming. Automatic alignment compensation.
Seika

Was It Acid Rain Itch?

Something in Jean's environment was not agreeing with her and it was causing her skin to itch. Could acid rain be the cause?
Mysteries of Science

Latest Industry News

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Tariffs Will Not Solve America's Copper Problem, Smarter Recycling Will

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Built to Last: Why Human-Centered Businesses Will Flourish in the Age of AI

MORE INDUSTRY NEWS

Sponsor

Tech Paper - Keys to Component Lead Tinning Success
This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques.
Circuit Technology Center

Sponsor

One Component, Fast Curing Epoxy
Master Bond EP4EN-80 is a NASA low outgassing approved adhesive for potting and encapsulation. It cures at 80°C and features thermal conductivity and electrical insulation.
Master Bond

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