Electronics Manufacturing and Electronics Assembly

Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

Technical Papers

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

MORE TECHNICAL PAPERS

Ask the Experts

Trichloroethylene Alternative

Is Solder Mask Considered an Insulator

Solder Balls During Selective Soldering

Concerns Replacing High Speed Components with No-Clean Solder

How to Remove Oxidization from SMT Component Leads?

Solder Ball Wrinkles

Assembly Question for Soldering USB Connectors

BGA Die and Pry Testing

MORE ASK THE EXPERTS

Pick-and-Place Feeder density within SMT and Electronics Assembly
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Technical Paper

Issue with BGAs and SAC Balls After Switching to Low-Temp Solder Paste
If we switch to low temp solder paste, will we have issues with BGAs and SAC balls? We are trying to build a product with low temperature solder.
Board Talk

Sponsor

Cut SAC305 Costs with REL61TM Lead–Free Alloy
Silver prices have tripled. While silver is 2/3 of SAC305's cost, it's only 1/4 of REL61. Save hundreds of thousands annually with this proven, drop-in alternative.
AIM Solder

Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds.
Technical Paper

Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating.
Technical Paper

Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Technical Paper

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See How Proven Leaders Make Operational Success Happen
4-part series addressing head-on the challenges faced by manufacturing operations in today's highly complex and hyper-competitive environment. No registration required.
Intraratio

Investigating the Metric 0201 Assembly Process
This paper will look at the challenges of assembling the M0201 component in a high-volume manufacturing environment.
Technical Paper

Wet-Based vs. Dry-Based Cleaning
For automatic under-stencil cleaning there are many cleaning methods. What factors should we consider to select wet based cleaning versus dry based cleaning?
Board Talk

Sponsor

Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.

Lessons Learned While Investigating Microvia Reliability Failures
There has been an increasing number of reports concluding that stacked micro vias are failing preferentially when compared to an alternative staggered via design.
Technical Paper

Thermal Cycle Fatigue Life of Low-Temperature Solders
Thermal cycling fatigue is one of the main reliability concerns for solder. For the introduction of low temperature solders with reflow peak temperatures below 200℃, their thermal cycle fatigue life must be characterized. This paper presents a multiple component type test and time to failure data for solder interconnects formed with low temperature solders for BGAs, QFNs, and SMR component types.
Technical Paper

Optimize the Dispensing Process with True 3D Inspection
The journey toward zero defects in dispensing is challenging but achievable. True 3D inspection technology has have emerged as a powerful ally in this quest to ensure the highest quality levels.
Technical Paper

Sponsor

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

Voids in SMT Solder Joints – Trends in Automotive Electronics
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints.
Technical Paper

Connector Bowing During Reflow Process
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this?
Board Talk

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Seeking Alternatives to Solvent Cleaning
We are using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene.
Board Talk

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MORE INDUSTRY NEWS

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Sponsor

Optimize Your Process on Full SMT Demo Line
Validate your process in our demo lab. Our full line—printing, P&P, reflow, and AOI—is ready to optimize your profile and prove performance. Send us your boards to start.
Heller Industries