Electronics Manufacturing and Electronics Assembly

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Technical Papers

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

MORE TECHNICAL PAPERS

Ask the Experts

BGA Die and Pry Testing

Rise of Bismuth Levels in our Solder Pots

Inspection for Hidden Solder Joints

Solution for Warped PCBAs

BGA Component Cleaning Spec

Tin Whiskers and Vapor Phase Reflow

Soldering Station Calibration

Solder Paste Stencil Inactivity

MORE ASK THE EXPERTS

Adding OSP to Pads that are Missing ENIG Plating Process
A fabricator notified us that during the ENIG plating process, several pads had been “skipped”. The fabricator would like to add OSP to the pads that are missing the ENIG.
Board Talk

Engineered Flux for Low Temperature Solders
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper.
Technical Paper

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AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Technical Paper

Automated Optical Inspection Performance with Different Solder Alloys
This paper presents the performance of AOI systems when applied to PCBs soldered with SAC305 and a third-generation, low-silver, bismuth-containing alloy.
Technical Paper

The Impact of the Gold Layer Thickness on Layer Properties
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives.
Technical Paper

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

The Best Method for Reworking Ultra-Micro Chips
We are soldering and reworking 0201s and 01005s using hot air solder rework station with adjustable air flow. The minimum air flow will blow parts.
Board Talk

Drop/Shock Behavior of Low Temperature Solder BGA
This study examines challenges posed by aging, a critical factor influencing the long-term performance of solder joints.
Technical Paper

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Circuit Technology Center

Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Technical Paper

Supercooled Solder Pastes in Low-Temperature Attach Applications
This paper presents progress-to-date using supercooled solder pastes of core-shell bismuth-tin (BiSn) particles to accomplish solder interconnects below the melting point of the alloy. Comparisons between supercooled BiSn solder pastes and traditional BiSn pastes are discussed.
Technical Paper

QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.
Technical Paper

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ZESTRON Europe

How To Rework Warped PCBAs?
From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them?
Board Talk

Optimizing Throughput and Cost with Manufacturing Simulation
This paper describes the design and implementation of several manufacturing simulation use-cases at an electronics assembly factory in Nanjing, China.
Technical Paper

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DL Technology

Technology for Optical Co-Packaging
A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper.
Technical Paper

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Your Award-Winning Cored Wire
Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications.
Indium Corporation

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Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies

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