Electronics Manufacturing and Electronics Assembly

My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly. The Assembly Brothers, Phil Zarrow and Jim Hall, share their suggestions and experience with creating a cost matrix.
Board Talk

Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Production Floor

Space the Next Frontier for Business
Few things will be more important in the coming decades than who wins the game-changing struggle for control of space.
Technology Briefing

Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab

The Role of Organic Amines in Soldering Materials
Paper shows that tests can be developed to characterize fundamental properties of activator packages that directly impact performance.
Materials Tech

Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor

Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
Analysis Lab

Issues With Solder Paste Transfer Efficiency
With transfer efficiency and its relationship to solder paste volume, can you produce a transfer efficiency over 100% of the theoretical volume?
Board Talk

Behavior of Materials in the Manufacturing Environment
This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead-free assembly.
Materials Tech

Plastics That Can Be Recycled Immediately
A team announced the invention of a new plastic that could tackle the waste crisis head-on. It’s called polydiketoenamine, or PDK.
Technology Briefing

Hot Air BGA Rework Process Improvement with a Touchless Temperature- Dependent Live-Feedback Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Production Floor

Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Analysis Lab

The Day They Shut Down Intel
Chipmaker Intel had just started up a new chip factory when something odd caused a shut down. What lead to this development?
Mysteries of Science

Reliability of Stacked Microvia
Study was designed to understand the reliability of Type 1, 2, and 3 Microvias. The reliability test coupons included four stacks of microvias and a buried via.
Production Floor

Ultra-Precise GPS could Unleash a Robot Revolution

Upgrades are boosting the accuracy of the most powerful global satellite positioning systems from several meters to a few centimeters.
Technology Briefing

AOI Capabilities Study with 03015 Components
Paper covers tests working with five AOI vendors to ensure successful testing of 03015 components, with emphasis on optimizing algorithm threshold settings.
Analysis Lab

Endocrine Disrupting Chemicals and Bioaccumulative Substances

The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the materials that require control or replacement.
Materials Tech

Good Quality Comes From Good Design for Test
This paper discusses how to maximize the benefits of boundary scan test, with examples of how designers should select the right components.
Production Floor