Technical Papers
Eight Steps to Ensure PCB Assembly Success
The Process Audit: One of the Most Important Procedures
ENEPIG Deposit Enhancement Achieves Ultimate Goal: Thicker, Lower Porosity Gold
Meeting Critical Medical Demands with X-ray Inspection
How continuous reflow monitoring supports lean manufacturing
Using True3D Inspection Data as a Process Control Tool in a Smart Factory
Selective Soldering Fine Pitch Components on High Thermal Mass Assembly
An Engineer's Guide to Testing and Evaluating The Performance of Desiccant Bags
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
MacBook, iPad Production Delayed as Supply Crunch Hits Apple
Microsoft unveils liquid cooling solution for datacenters
A Theory of (Almost) Everything
Toyota unveils new models in advanced driver-assist technology push
Tech Giants Enter Their Chips in the Race for Self-driving Cars
What will self-driving trucks mean for truck drivers?
4 Great Things That Happened When We Went Remote
iPhone 13 is going to be worth the wait: All the major upgrades we're looking forward to
MORE INDUSTRY NEWS
April 8, 2021
Solder Paste Volume for BGA Rework
Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk
Implementing Robust Bead Probe Test Processes
This paper defines a process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly.
Production Floor
6G Mobile Communications to Utilize AI to Control Devices
6G Mobile Communications to Utilize AI to Control Devices
The 6th generation of mobile communications promises higher data rates, shorter latency, and increased densities of terminal devices..
Technology Briefing
Via-In Pad Plated Over (VIPPO) Design Considerations
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints.
Analysis Lab
Screening of Lower Melting Point Pb-Free Alloys
Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech
Condensation Testing - A New Approach
The data for a range of conformal coatings are correlated back to the material type, and coverage and thickness by cross-sectioning.
Production Floor
Case Study for Improving the PCB Print Process Using Factory Data
The analytics of big data could help us to understand that process better. We can buy better equipment and select the parameters more carefully.
Analysis Lab
Reflow For Rigid Flex
Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider?
Board Talk
DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech
Increased Computer Chip Processing with Conductive Titanium Oxide
Increased Computer Chip Processing with Conductive Titanium Oxide
A method to make non-volatile computer memory which may help solve a problem that has been holding back machine learning has been developed.
Technology Briefing
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor
Wetting and Solidification of Pure Tin on Polycrystalline Intermetallic Substrates
This study analyzes the wetting and interface formation between polycrystalline CuxAly intermetallic substrates and the pure Beta-Sn phase.
Analysis Lab
The Olympics Balloon Fiasco
The Olympics Balloon Fiasco
As the opening ceremonies for the 1984 Olympics were being broadcast reports of "lost signal" started coming into the control center.
Mysteries of Science
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
This paper presents the studies on flip chip thermo-compression bonding (TCB) of gold stud bumps on MID substrate.
Production Floor
Two-Dimensional Antennas Allow Extreme Thinness and Flexibility
Two-Dimensional Antennas Allow Extreme Thinness and Flexibility
Antennas so thin they can be sprayed into place are robust enough to provide a strong signal in the bandwidths that will be used by 5G mobile devices.
Technology Briefing
Void Reduction in Reflow Soldering Processes by Sweep Stimulation
The insights of the feasibility study were the basis for the integration of the voidless technique into an industrial production process.
Analysis Lab
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance.
Materials Tech
Choosing the Right Stencil Options
Quality and yield are directly linked to the solder printing process. A constant paste depot is critical to a stable soldering process.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
Kyzen Corporation
Kyzen Corporation
KYZEN has been pioneering award-winning, environmentally responsible, ...
AI Technology, Inc.
AI Technology, Inc.
AI Technology has more than 29 years ...
Ultrasonic Systems, Inc.
Ultrasonic Systems, Inc.
Ultrasonic Systems, Inc. (USI) manufactures high performance ...
Conductive Containers, Inc
Conductive Containers, Inc
It’s always fun and rewarding to be ...
Technology Corner
Where Soldering is a Passion
SEHO Systems GmbH
SMT Components Storage Solutions
ESSEGI AUTOMATION S.r.l.
Assure X-ray Component Counters
Nordson Dage
High Performance 3D AOI – S3088 DT
Viscom Inc.
MORE TECHNOLOGY CORNER
Board Talk
Solder Paste Volume for BGA Rework
Reflow For Rigid Flex
Delay Before Cleaning Partial Assemblies
Problems With Starved "J" Lead Joints
Solder Paste Transfer Efficiency - What/Why
Can a CTE Mismatch Cause Reliability Problems?
Going Beyond Your Solder Paste Work Life
Issues Mixing Silicone and Acrylic Conformal Coatings
MORE BOARD TALK
Questions and Comments
Why Battery Powered Cars Are Not the Future
The author gives irrational reasons for negativity about the electric ...
Egdir Trebor
Solder Paste Volume for BGA Rework
Since rework can never be as controlled or consistent as ...
Richard Stadem, Analog Technologies Corp.
Going Beyond Your Solder Paste Work Life
Over time, the ratio of powder to flux will increase, ...
Mitch Holtzer, Alpha Assembly Solutions
Cause of Damage During Through-hole Component Insertion
This comment pertains more to operations which utilize wave soldering ...
Tim Hufnell, Retired, Smiths Aerospace
Cause of Damage During Through-hole Component Insertion
Agree with the brothers on checking equipment but hole size ...
Bradley Fern, Entrust
MORE COMMENTS
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