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Handheld Plasma Activation
Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more.
Plasma Etch
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Can Silver Cause Solder Embrittlement?
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario.
Board Talk
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New SELECT Synchro soldering system
A multi-station selective soldering system that uses a unique, synchronous motion to increase throughput, improve cost-of-ownership, and provide flexibility for electronics manufacturers.
Nordson Electronics Solutions
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Unitech PCB Cleaners
The basic PCB cleaning equipment from Unitech Corp., includes a large surface vacuum that sucks up dust and particles, a small brush to pick up dirt and a soft cloth for wiping down.
Seika
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The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys
This paper aimed to investigate the impacts of printed circuit board (PCB) design, including the PCB thickness and solder mask opening, on the fatigue performance of lead-free solders. Each test vehicle includes one of two component types: CABGA192 and MLF32, assembled using SnAgCu solder paste with an Organic Solderability Preservative (OSP) surface finish.
Technical Paper
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Panel Level Package (PLP) – Scaling up Fan-Out Packaging
The persistent push for electronics miniaturization calls for a different approach to make packages smaller, higher performance and lower cost. Fan-out (FO) packages are well suited to serve this market trend. Via interconnects between the chip and package RDL (redistribution layers) provide higher interconnect density and lower inductance.
Technical Paper
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Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk
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