Electronics Manufacturing and Electronics Assembly

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Circuitnet Media LLC

Technical Papers

The Economics of Electronic Component Salvage and Reuse

Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing

The "Fried Egg" Effect in Soldering

Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices

Innovative Power Module Assembly Solutions

Unlocking the Potential of Nanoscale Conformal Coatings

Recycling vs Circularity: Minimising E-Waste in Manufacturing

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

MORE TECHNICAL PAPERS

The Economics of Electronic Component Salvage and Reuse

This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.

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Ask the Experts

Polyurethane Conformal and Acrylic Coating on the Same PCB

Baking Concerns for Stacked Trays of Components

Manual or Automated Assembly?

Inspection for Hidden Solder Joints

Flux Residue During Pin-in-Paste

Soldering Station Calibration

Design Considerations and Impact on Assembly

What Causes Component Rotation During Reflow?

MORE ASK THE EXPERTS

May 22, 2025

Effect of Temperature and Current Stressing on Low Temperature Solder BGA Drop Performance

Simultaneous temperature and current stressing affect the performance of LTS BGA solder joints in drop testing, with both increased temperature and current level showing larger impacts for the same stress duration.
Analysis Lab

How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Production Floor

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REL61: Cost-Effective Soldering, Elevated Performance
Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance.
AIM Solder

Heterogeneous Data Teaches Robots Range of Tasks
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks.
Technology Briefing

Non-Contact Measurement of Conformal Coating Thickness
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces.
Analysis Lab

Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Materials Tech

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Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components. Download this free tech paper.
Circuit Technology Center

Extending 3D MRS Sensor Technology to Address Challenging Applications
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets.
Production Floor

Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
This paper reports an ensemble of strategies for the successful miniaturization of EEG in a fully-flexible, wearable and wireless platform.
Analysis Lab

Sponsor

440-R + Ultrasonics = Safe & Efficient Cleaning
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, misprints & SMD adhesives.
Smart Sonic

Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk

Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Materials Tech

Stacking Multiple Surfaces of Transistors and Semiconducting Elements
Chip manufacturers are looking to build up rather than out. The industry is aiming to stack multiple surfaces of transistors and semiconducting elements.
Technology Briefing

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Establishing Design Rules for the Laser Depaneling of Printed Circuit Boards
This paper presents design guidelines for laser depaneling such as contour limitations as well as required channel widths and component distances to the cutting edge.
Production Floor

Pin-in-Ball and Non-Solder Ball Grid Arrays Demonstrate Advancements
This paper will focus on the research and development of the Next Gen Pin-in-Ball Grid Array connectors, and the non-solder ball versions.
Analysis Lab

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Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond

Solder Alloy Leads to Broken Glass
A manufacturer of defroster windows was breaking thousands of dollars of windows due to a soldering problem. What was causing a change in the solder alloy?
Mysteries of Science

Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented.
Production Floor

America Risks Losing Its Status As the Most Innovative Place on Earth
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography.
Technology Briefing

D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
This study looks at an analysis of why a D-PAK exhibits more voiding than other types of BTCs. Voiding results based on an analysis of several process variables.
Analysis Lab

Expandable Bio-based Polymers: Future for Electronics Ruggedization
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components.
Materials Tech

Homogeneous Low Temperature Soldering Technology

This paper presents key findings of enabling LTS technology on AMD’s Client BGA Packages using surface mount technology (SMT).
Production Floor

Latest Industry News

Electronics Industry Demand Holds Steady Amid Tariff Turbulence

Taiwan's Foxconn acquires 1st African site

Pegatron expects revenue boost

Sergey Brin points to where Google Glasses failed — and what Android XR gets right

Quanta says sales of servers to grow in coming quarters

MORE INDUSTRY NEWS

Eliminate Cross Contamination

The Model 2003 Stencil & Pallet Cleaner is a semiautomatic system with two ultrasonic wash tanks for multiple applications. It is guaranteed to clean solder paste from any fine-pitch stencil.

LEARN MORE

Sponsor

The Smart Alternative to SAC305
Get the cost benefits of a low-silver solution without sacrificing quality. REL61 surpasses SAC305 in key tests like AOI performance—making it the smart choice for your operations.
AIM Solder

Questions and Comments

iNEMI Board Assembly –Press-Fit Technology Roadmap

A very interesting article. UIBEL CONSULTING is participating in the ...
Frank Alexander Uibel, Uibel Consulting

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability

In re-reading this study, the results, of course are well ...
Jaye Waas, Renkus-Heinz

Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions

There really, at present, no such thing as "selective cleaning". ...
Phil Zarrow, ITM Consulting

MORE COMMENTS

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

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