circuit insight
July 10, 2025
Challenges of Ultra-Fine Feature Printing Optimization of Pb-Free Solder Paste
Challenges of Ultra-Fine Feature Printing Optimization of Pb-Free Solder Paste
Semiconductor manufacturing, flip chip, package on package (PoP), system in package (SiP), and miniature components like 0201M may require printing through stencil apertures of 50-100 μm (2-4 mils) in size. Creating these miniature solder joints requires solder pastes optimized for use with IPC Type 6 (5-15 μm) or smaller solder powder sizes.
Materials Tech
Pick-and-Place Feeder density within SMT and Electronics Assembly
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Production Floor
Sponsor
Smart-Sonic

Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic
The New Standard for Cyber Security
Productivity can be improved by implementing, catching counterfeits and counterfeiters closer in time and physical distance than ever before by taking a systematic approach.
Analysis Lab
The Invention of CMOS Image Sensors: A Camera in Every Pocket
The Invention of CMOS Image Sensors: A Camera in Every Pocket
CMOS image sensors continue to be used in an ever increasing variety of applications. Some of these applications are useful in every day life, some are for fun.
Analysis Lab
Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Materials Tech
Sponsor
Master-Bond

Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
Voids in SMT Solder Joints – Trends in Automotive Electronics
Voids in SMT Solder Joints – Trends in Automotive Electronics
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints.
Production Floor
Heterogeneous Integration Roadmap: Technology for Systems of the Future
The new Heterogeneous Integration Roadmap provides a long-term vision for the electronics industry, identifying future challenges and potential solutions.
Analysis Lab
Sponsor
Glenbrook-Technologies

Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies
Improving Efficiency of Through-Hole PCBAs
We are trying to improve the efficiency of the through-hole of our mixed tech, surface mount through-hole PCBAs. What are our options?
Board Talk
Methodology for Implementation of Pb-free Materials in Aerospace
Methodology for Implementation of Pb-free Materials in Aerospace
This paper will discuss the Pb-free challenges and the “building blocks” to allow cautious and responsible implementation of Pb-free materials.
Materials Tech
Using Rheology as a Measurement Potentially Predictive Tool
The types of rheology measurements studied here show trends that mirror the print volume and volume reproduceability for three pastes.
Production Floor
Sponsor
ECD

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
Hot Air BGA Rework Process with a Touchless Temperature-Dependent Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Production Floor
Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Analysis Lab
Sponsor
Creative-Electron

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
Headaches at the Factory
Headaches at the Factory
A factory was experiencing health complaints from workers. What was causing the workers to experience these health problems?
Mysteries of Science
The Versatile Preform
This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms.
Production Floor
Rework and Reball Challenges for Wafer-Level Packages
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature.
Analysis Lab
Moisture Effects in Common Solderable RF Connector Dielectrics
Moisture Effects in Common Solderable RF Connector Dielectrics
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized.
Analysis Lab
Copper Dissolution Testing Report for the Selected Pb-free Solder Alloys
This paper describes the approach for measuring the copper dissolution rates of five Pb-free solder alloys.
Materials Tech
Glass Panel Packaging: Technologies and Applications
Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Production Floor
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MORE INDUSTRY NEWS
Glenbrook-Technologies
Sponsor
Circuit-Technology-Center

Tough Engineering Changes? Where Can You Turn?
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
Circuit Technology Center
Questions and Comments
Influence of Salt Contamination and RH on Creep Corrosion of Immersion Silver
In the 1980s a consortium of companies sponsored research under ...
Pat Lees, Littelfuse
Inline Assembly of Flex PET Circuits
This is a tremendous step forward regarding PET Flex circuits. ...
Jaye Waas, Renkus-Heinz
Lead Poisoning - Was it from Wine?
Similar as to how tomatoes got their bad rap for ...
Richard Gwaltney, Kyocera-AVX Components Jacksonville
MORE COMMENTS
Closed-Loop SMT Water Treatment
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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