Electronics Manufacturing and Electronics Assembly

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Technical Papers

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

MORE TECHNICAL PAPERS

Ask the Experts

Options for Reballing BGA Components

How to Detect Counterfeit Components?

Production Floor Temperature and Humidity Loggers

Design Specs for Selective Soldering

Moisture Sensitivity Level for Bare Boards

Solder Paste Thickness Measurements

Conformal Coating & Humidity

Stencil Issue with PLCC Component

MORE ASK THE EXPERTS

December 9, 2025

Optimizing Cleaning Strategies for Advanced Packaging Technologies

The study will utilize various test vehicles with low standoff components, using both No-clean and Water-soluble solder formulations. Two aqueous-based cleaning agents will be evaluated, and cleanliness assessed through visual inspection, SIR, and IC testing following IPC standards.
Materials Tech

What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure?
Board Talk

Sponsor

Bismuth in Solder Alloys
Bismuth is a primary constituent in many low-temp solders. It also serves as an additive element in SAC solders that reinforces joint durability & optimizes wetting characteristics.
AIM Solder

Heterogenous Integration using Fan-out Wafer-level Packaging Technology
An overview of packages having multiple die along with double-sided build up layers will be presented. This technology can provide high module yields.
Production Floor

How to Manage Material Outgassing in Reflow Oven

This study investigates the evaporation of chemicals during the reflow process from preheating until cooling. Different solder pastes are compared.
Analysis Lab

Hybrid Sintering for High-power Density Devices Aerospace Applications
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications.
Materials Tech

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Extending 3D MRS Sensor Technology to Address Challenging Applications

There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets.
Production Floor

Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness?
Board Talk

Sponsor

Tech Paper - The Essential Guide for High-Reliability BGA Component Re-balling
This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. Download this free tech paper.
Circuit Technology Center

The Metallic Paint Secret
A technician determined how super-bright metallic paint was made without analyzing the material. How could this be done?
Mysteries of Science

High Performance Light and Moisture Dual Curable Encapsulant

This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Materials Tech

How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Production Floor

Sponsor

Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond

Comparison of Contemporary Stencil Coatings and Under Wipe Solvents
The tests examined the effects of wiping on different sized packages, different wipe frequencies, and different wipe chemistries.
Analysis Lab

Establishing Design Rules for the Laser Depaneling of Printed Circuit Boards
This paper presents design guidelines for laser depaneling such as contour limitations as well as required channel widths and component distances to the cutting edge.
Production Floor

Sponsor

EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic

Was the Contamination From Silicone?

Black enamel was sprayed onto metal followed by a clear coating when a contamination problems surfaced. What was causing the contamination?
Mysteries of Science

Latest Industry News

USMCA Review: A Critical Opportunity to Fortify North American Electronics

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Global Electronics Association Calls for Expansion of EU Chips Act to Support Critical Industries

Gartner Predicts Only 5% of Automakers Will Keep Investing Heavily in AI by 2029

This Is The Biggest Threat To Tim Cook's Promise Of Apple AI Dominance

MORE INDUSTRY NEWS

Sponsor

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Sponsor

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies

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