Electronics Manufacturing and Electronics Assembly

We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss the most important reflow guidelines in this scenario.
Board Talk

Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor

Hacker-Proof Digital Fingerprints
Researchers have found a way to use chaos to create digital fingerprints for electronic devices that may be unique enough to foil sophisticated hackers.
Technology Briefing

Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Analysis Lab

The Importance of Conformal Coating Thickness and Edge Coverage
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material.
Materials Tech

Embedded Components from Concept-To-Manufacturing
Use of embedded components has grown significantly in the defense, aerospace, telecommunications, medical and consumer markets.
Production Floor

The Invention of CMOS Image Sensors: A Camera in Every Pocket
CMOS image sensors continue to be used in an ever increasing variety of applications. Some of these applications are useful in every day life, some are for fun.
Analysis Lab

Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness?
Board Talk

Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration.
Materials Tech

Plastics That Can Be Recycled Immediately
A team announced the invention of a new plastic that could tackle the waste crisis head-on. It’s called polydiketoenamine, or PDK.
Technology Briefing

Reducing Dust Deposition on Electronic Equipment
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.
Production Floor

Microstructure and Reliability of Low AG/Bi Solder Alloys
The goal of this study was to provide a screening experiment for three alloys Bi-containing, Low (or no) Ag as alternatives to SAC305.
Analysis Lab

Polymer Thick Film That Was Thinned Out
A factory is making circuits using polymer thick film. One day the ink was too thin, making it print poorly. What was causing this?
Mysteries of Science

Miniaturization with Help of Reduced Component to Component Spacing
This paper covers layout, assembly and material selections to reduce component to component spacing down to 4-5mil from today's mainstream of 6-8mil.
Production Floor

Artificial Intelligence is Making Sense of Indecipherable Data

AI is enabling scientists to make sense of data that is indecipherable. Researchers used machine learning to determine the properties of organic molecules.
Technology Briefing

Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab

Screening of Lower Melting Point Pb-Free Alloys

Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech

Jetting Fine Lines onto 2D and 3D Electronic Packages
The demand for smaller dispense doses including fine lines, small dots and accurate dispensing requires examination of available products and technologies.
Production Floor

Supplier Spotlight

Atotech USA Inc.
We want to build on our leading position as a ...

SMTC Corporation
Founded in 1985, SMTC Corporation is a mid-size provider of ...

Japan Unix Co., Ltd.
Providing a rich array of solution for manual and soldering ...

PARMI
PARMI Co., Ltd. is a technology-intensive corporation that develops and ...

FULL SUPPLIER DIRECTORY

Board Talk

Reflow For Rigid Flex

Solder Paste Volume for BGA Rework

Problems With Starved "J" Lead Joints

Delay Before Cleaning Partial Assemblies

Can a CTE Mismatch Cause Reliability Problems?

Solder Paste Transfer Efficiency - What/Why

Issues Mixing Silicone and Acrylic Conformal Coatings

Going Beyond Your Solder Paste Work Life

MORE BOARD TALK

Questions and Comments

Why Battery Powered Cars Are Not the Future

EV's are absolutely not the future and are way to ...
Mike Lewis

What is the Best Way to Clean Solder Stencils?

As always, when cleaning stencils either by hand, spray or ...
Russell Claybrook, MicroCare, LLC

Intrusive Soldering Through-Hole Connector

It wasn't mentioned how many layers in board or which ...
Patty Smith, BitFlow, Inc.

Vapor Phase and Backward Compatibility

The discussion completely skips over whether the components on the ...
Richard Stadem, General Dynamics Mission Systems

How to Cost a Board

The question submitter writes, "A customer wants to pay .16 ...
Norman Berger, D&K Engineering

MORE COMMENTS

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