Electronics Manufacturing and Electronics Assembly

Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question and share their own experiences.
Board Talk

Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor

Mastering Innovation's Toughest Trade-Offs
Innovation in dynamic environments is rife with critical tensions. When left unaddressed or mishandled, these tensions sink teams and organizations.
Technology Briefing

Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Analysis Lab

Microalloyed Sn-Cu Pb-Free Solder for High Temp
While susceptibility to tin whisker growth remains a barrier to the transition to Pb-free, there is now general acceptance that there are reliable alternatives.
Materials Tech

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
Paper outlines positive and negative aspects of current 3D package innovations and challenges facing adopters of silicon and glass based interposer fabrication.
Production Floor

Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
Analysis Lab

Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable?
Board Talk

High Performance Light and Moisture Dual Curable Encapsulant
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Materials Tech

Diodes As One Way Regulator Valves
Diodes are in nearly every electronic device, acting as one-way regulator valves. Diodes allow electricity to flow in only one direction through the device.
Technology Briefing

Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor

Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab

Sealed Membrane Switch Mystery
A factory was building membrane switches but all the switches from units in Denver failed. What was unusual about Denver?
Mysteries of Science

Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor

Neuromorphic Chip Runs Computations Directly in Memory

NeuRRAM neuromorphic chip brings AI closer to running on edge devices, performing tasks without relying on a network connection to a centralized server.
Technology Briefing

Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
Analysis Lab

Design and Fabrication of Ultra-Thin Flexible Substrate

This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
Materials Tech

Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor

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Board Talk

Is No-Clean the Trend for QFN Components?

Acceptable Rate for Head in Pillow?

What Rate is World Class for SMT Machines?

Why Do Our Boards Warp During Reflow?

Should Apertures be Home Plate or Inverted Home Plate?

Is Customer Approval Required for Class 3 Repair?

Selective Solder Pot Temperatures

Solder Pallets With Titanium Inserts - Yes/No?

MORE BOARD TALK

Questions and Comments

What Rate is World Class for SMT Machines?

Actually, it is not how fast nor how accurately a ...
Richard Stadem, General Dynamics Mission Systems

What Rate is World Class for SMT Machines?

Basically, it would seem that this is a comparison between ...
Jaye Waas, Renkus-Heinz

Selective Solder Pot Temperatures

Selective pots using common Pb-Free alloys (SAC305, SAC0307 etc) are ...
Timothy ONeill, AIM

MORE COMMENTS