Technical Papers
Solder Alloy Contribution to Robust Selective Soldering Process
The Four Roles of Inspection Data in a Smart Factory
Toward the Lights-out Factory
The Essential Guide for High-Reliability BGA Component Re-balling
Understanding X-ray Inspection versus X-ray Component Counters
Milling (Reworking) Underfilled Parts
The Importance of Solderability Testing
Advancing silicon photonics physical verification through innovation
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Apple Manufacturers Beef Up Hiring to Meet Rising Demand
China supply woes hit PC production
How to Spot Shifty Sales Tactics in a Tight Market
Addressing the Global GPU Supply Landscape
Be Deliberate, Time Management Skills Don't Improve by Accident
MORE INDUSTRY NEWS
May 19, 2022
Is HASL a Good Choice for Surface Finish?
Is HASL a Good Choice for Surface Finish?
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this scenario and share their own suggestions and recommendations.
Board Talk
A Robot's Place in SMT
SMT machines today are designed to pick and place from tape, tray, and sticks. Robots can handle these more efficiently than an operator.
Production Floor
Artificial Intelligence is Making Sense of Indecipherable Data
Artificial Intelligence is Making Sense of Indecipherable Data
AI is enabling scientists to make sense of data that is indecipherable. Researchers used machine learning to determine the properties of organic molecules.
Technology Briefing
Collaboration to Combat Head on Pillowing Defects
This project was designed to evaluate AXI results from different machine platforms by analyzing results from similar platforms at different facilities.
Analysis Lab
Development of Materials Informatics Platform
Development of Materials Informatics Platform
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials.
Materials Tech
Spray Plus Soak Improves Cleaning Under BTC
Innovative spray and soak methods for removing low residue flux residues and rinsing under bottom termination and leadless components is evaluated.
Production Floor
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.
Analysis Lab
Connector Bowing During Reflow Process
Connector Bowing During Reflow Process
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this?
Board Talk
Formulation of a New Liquid Flux for High Temperature Soldering
This paper presents the development of a new liquid flux. Laboratory and beta-site test results for existing fluxes are compared to this new flux.
Materials Tech
Flying Taxis Are Almost Here
Flying Taxis Are Almost Here
Ride-hailing applications, electric propulsion technology and a new generation of avionics suddenly awakened commercial interest from companies.
Technology Briefing
Acid Copper Electroplating Processes for Flash Etching
The focus of this study was to investigate the underlying mechanism of V-pitting and to develop a process to withstand or resist the pitting.
Production Floor
New Requirements for Sir Measurement
Flux residues can create interaction with solder resists and the component body. This paper discusses a new SIR measurement process.
Analysis Lab
Was It Acid Rain Itch?
Was It Acid Rain Itch?
Something in Jean's environment was not agreeing with her and it was causing her skin to itch. Could acid rain be the cause?
Mysteries of Science
Minimizing Printed Circuit Board Warpage in Assembly Process
The purpose of this paper is to present a cleaning process for difficult no-clean, lead-free and high temperature flux residues on reflowed PCBs.
Production Floor
Microchips for Future Computing Security
Microchips for Future Computing Security
Microchips with tiny clocks hold the key to future computing security, a system that is resistant to attacks, and also inexpensive, convenient, and scalable.
Technology Briefing
Generalizations About Component Flatness at Elevated Temperature
The flatness of boards and components is an important topic. This study deals only with components.
Analysis Lab
Hybrid Conformal Coatings for Mitigating Tin Whiskers
Hybrid Conformal Coatings for Mitigating Tin Whiskers
In this stydy, nanoparticles were functionalized to bind them to the polymer structure while avoiding the collection among the particles.
Materials Tech
Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments.
Production Floor
Supplier Spotlight
IBE SMT Equipment, Inc.
For over Fifteen Years IBE has provided the Electronics Manufacturing ...
Hisco, Inc.
Hisco is a specialty distribution company serving the electronic assembly ...
IEC Electronics Corp.
By utilizing our on-site analytical laboratories or our proven industry ...
Ohmega Technologies, Inc.
For five decades OhmegaPly has been used in a variety ...
FULL SUPPLIER DIRECTORY
Board Talk
Is HASL a Good Choice for Surface Finish?
Connector Bowing During Reflow Process
Can Solder Mask Be Considered an Insulator?
Long Term Component Storage
What Causes Solder Balls During Hand Soldering?
Has My Flux Expired?
Wet-Based vs. Dry-Based Cleaning
Processing Circuit Boards with BGAs On Both Sides
MORE BOARD TALK
Questions and Comments
Can Solder Mask Be Considered an Insulator?
We had a similar question in regards to clinched leads ...
Dale Carmine, Reinke
Wet-Based vs. Dry-Based Cleaning
Stencil apertures have gotten much smaller to accommodate new passive ...
Russell Claybrook, MicroCare, LLC
Solder Boards Not Holding Up to Shock Testing
Failure due to Mechanical Shock (Drop Testing) or Thermal Shock ...
Derek Daily, Senju
MORE COMMENTS
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