Technical Papers
The Essential Guide to Large-Volume Thermal Interface Materials (TIM) Dispensing
Reduction of voids in solder joints with vacuum
Selective Soldering High Thermal Mass and Fine-Pitch Components
Not All 3D Inspection Is Created Equal
Essential Tools For High Accuracy Thermal Profiling
Inductive Soldering for High Thermal Demand Applications
X-Ray Supports Solder Paste Development
Functional Test of RF Boards with MMCX Connectors
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Competing Visions Underpin China's Quantum Computer Race
Foxconn prototype spied
The Future of Remote Patient Monitoring Technologies
Apple's next big technology was absent at the iPhone 13 launch, but Tim Cook says he's still a fan
Start a Mindfulness Practice and to Reduce Stress and Improve Your Business
Not on Speaking Terms
The iPhone 13 is already showing strong early sales in China, local media reports say
Foxconn suspends plans with Byton
MORE INDUSTRY NEWS
September 16, 2021
01005 Component Challenges and Bugs
01005 Component Challenges and Bugs
We are going forward with assemblies that use 01005 components. We're wondering if you have some input as to the challenges we will face. The Assembly Brothers, Phil Zarrow and Jim Hall, share their own insight and suggestions.
Board Talk
Technologies and Standards to Realize Smart Manufacturing
The future of manufacturing in the Electronics Industry is dependent on the ability to develop and deploy technology platforms to realize Smart Manufacturing and Industry 4.0.
Production Floor
Self Driving Cars Analyze Other Drivers
Self Driving Cars Analyze Other Drivers
A team of researchers have developed a new early warning system for vehicles that uses artificial intelligence to learn from thousands of real traffic situations.
Technology Briefing
SIR Test Method for Developing Evidence for the Production Assembly
The purpose of this paper is research on the development of temperature-humidity-bias instrumentation and test board designs forproduct acceptance.
Analysis Lab
Attributes of Cored Solder Wire in LED Luminaire Soldering
Attributes of Cored Solder Wire in LED Luminaire Soldering
Reflectivity as a metric to quantify "shininess" is presented. An approach to quantifying "Reflectivity" of solder alloy joints has been developed.
Materials Tech
Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, witout compromising quality, cost, and throughput.
Production Floor
Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Cycles-to-failure versus Distance to Neutral Point (DNP) data for SnPb and lead-free assemblies under Accelerated Thermal Cycling (ATC) conditions are observed.
Analysis Lab
Insulation Between Overhanging Component Lead and Circuit Conductor
Insulation Between Overhanging Component Lead and Circuit Conductor
We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor?
Board Talk
Hybrid Conformal Coatings for Mitigating Tin Whiskers
In this stydy, nanoparticles were functionalized to bind them to the polymer structure while avoiding the collection among the particles.
Materials Tech
Implications of the 2021 Microchip Shortage
Implications of the 2021 Microchip Shortage
The underlying vulnerabilities of global supply chains are obvious. And there is no more far-reaching example of that than the semiconductor industry.
Technology Briefing
Printing and Assembly Challenges for QFN Devices
QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases.
Production Floor
Pad Cratering Susceptibility Testing with Acoustic Emission
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test.
Analysis Lab
The Metallic Paint Secret
The Metallic Paint Secret
A technician determined how super-bright metallic paint was made without analyzing the material. How could this be done?
Mysteries of Science
In Situ Recycling of Cleaning and Rinsing Fluids
The purpose of this paper is to provide an understanding of how to achieve these targets at the lowest possible cost.
Production Floor
Deep Learning Method Produces Holograms Instantly
Deep Learning Method Produces Holograms Instantly
3D makes users feel sick. The solution for widespread 3D visualization could lie in reviving holograms, a 60-year-old technology remade for the digital world.
Technology Briefing
Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Analysis Lab
Low Surface Energy Coatings Rewrite Area Ratio Rules
Low Surface Energy Coatings Rewrite Area Ratio Rules
Paper on the properties of solder paste release and the effects of surface free energy that make up the stencil printing process.
Materials Tech
Optimizing Immersion Silver Chemistries For Copper
Study evaluated several types of additives. Data on thickness distribution, copper attack rate, and deposit porosity resulted in new theories on how to control immersion silver.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
Brewer Science
Brewer Science
Brewer Science is a global leader in ...
CCL (Computer Components Ltd.)
CCL (Computer Components Ltd.)
Established in 1997. CCL is a UK ...
cyberTECHNOLOGIES
cyberTECHNOLOGIES
cyberTECHNOLOGIES is dedicated to providing our clients ...
SEMI
SEMI
SEMI is the global industry association that ...
Technology Corner
Peel-A-Way Removal Terminal Carriers
Advanced Interconnections Corp.
Unitech PCB Cleaner Intro
Seika Machinery, Inc.
Real-time Visual PCB Analysis and Debug
XJTAG
Introducing Ni-Less ENIG-Premium
LiloTree
MORE TECHNOLOGY CORNER
Board Talk
01005 Component Challenges and Bugs
Insulation Between Overhanging Component Lead and Circuit Conductor
Sticky Residue Under Low Clearance Parts
Finding the Cause of Cold Solder Joints
Soldering Relays Intrusively in Lead Free Process
Printing vs. Dispensing
Maximum Board Temperature During Tin-Lead
Is There a Spacing Spec for SMD Components?
MORE BOARD TALK
Questions and Comments
Soldering Relays Intrusively in Lead Free Process
In follow-up, The desire here is to fix the problem ...
Ike Sedberry, Sedberry Sales Inc
Issues With BGA Rework Residue
Any cleaning process that is not controlled is unpredictable, and ...
Alan Couchman, Process Sciences, Inc.
Soldering Relays Intrusively in Lead Free Process
As Mr. Woodford aluded above the number of zones required ...
Ike Sedberry, Sedberry Sales Inc
Soldering Relays Intrusively in Lead Free Process
Have you considered vapor phase reflow? Heat transfer is many ...
Dean Metzler, Carel USA
Why Battery Powered Cars Are Not the Future
Ev's are absolutely the cars of the future, fuel cells ...
Jan Zajic, Manulife
MORE COMMENTS
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