Electronics Manufacturing and Electronics Assembly

Sponsor

Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Estimating Failure Rate During Rework

Long Term Component Storage

How To Measure Solder Paste Rolling Diameter

Class 3 Pin Contact Question

Solder Paste Print Test Boards

Removing Cleaning Residues Under BTC Packages

BGA Solder Ball Wetting

Requirements for Installing Leaded vs. Lead-free Press Fit Connectors

MORE ASK THE EXPERTS

A New Approach to Process Qualification – SIR Testing + Functional Components
The experiment will build test vehicles with soldering materials susceptible to electrical leakage and electrochemical failures. The test vehicles will be tested using a test instrument designed to power and record the outputs of functional and dummy components.
Technical Paper

Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages.
Technical Paper

Sponsor

Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.

Solderability Testing Protocols and Component Re-Tinning Methods
This paper addresses methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating.
Technical Paper

Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk

Probe Contact Issues with No-Clean Pin-in-Paste
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow?
Board Talk

Sponsor

The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation

CU Core Column Enables Fine Pitch & High-Density 3D Packaging
The diameter, length, and aspect ratio of the Cu core columns and how to optimize the dimensions of the Cu core column is discussed.
Technical Paper

ECM and IOT How to Predict, Quantify and Mitigate ECM Failure Potential
There was a time when virtually all circuit assemblies were cleaned. The removal of flux and other process-related contamination was commonplace.
Technical Paper

Sponsor

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

A Standardized Reliability Evaluation Framework for Connections
The iNEMI Connector Reliability Test Recommendations team recommends work to define test conditions to evaluate the expected degradation of connectors under the stress levels.
Technical Paper

Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth BTC Solder Joints
The subject of this follow-up paper is the microstructural evolution of BTC eutectic Sn-Bi solder joints during electromigration. The growth of intermetallic phases at the solder-substrate interfaces and the extent of bismuth electromigration were measured as a function of temperature, current density and time in a bid.
Technical Paper

De-Ionized Water Affected By the Atmosphere
Resistivity readers of the de-ionized water are above 15 megohms. Resistivity results of the samples tested by the outside lab have been approximately 1 megohm.
Board Talk

Sponsor

Reliable Solder Performance for Less Silver
Stop overpaying for silver. REL61 offers equivalent mechanical strength and thermal stability to SAC305 with a decade of field-proven success. Switch without the risk.
AIM Solder

Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated.
Technical Paper

Accuracy Validation Finds Hidden Problems Affecting DPMO
This paper discusses individual process step validation methods with real examples of improvement that contribute to defect per million opportunities (DPMO) reduction.
Technical Paper

Sponsor

Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology

Copper-Tin Intermetallics: Their Importance, Growth Rate and Nature
This paper will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance.
Technical Paper

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Handheld Plasma Activation
Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more.
Plasma Etch

Sponsor

Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect