Electronics Manufacturing and Electronics Assembly

Prior to conformal coating, how long can we keep assemblies in an open condition before they will be impacted by moisture absorption? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss the impact that this will have on their process.
Board Talk

Miniaturization with Help of Reduced Component to Component Spacing
This paper covers layout, assembly and material selections to reduce component to component spacing down to 4-5mil from today's mainstream of 6-8mil.
Production Floor

Researchers Incorporate Machine Learning Into Brain-Computer Interface
Researchers incorporated machine learning into the brain-computer interface. This solution can understand the needs of a subject and self-calibrate.
Technology Briefing

RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
This paper will describe the common modes of corrosion-related hardware failures in the past 10 years and the means of negating their detrimental effects.
Analysis Lab

BVA: Molded Cu Wire Contact Solution
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Materials Tech

Jetting Fine Lines onto 2D and 3D Electronic Packages
The demand for smaller dispense doses including fine lines, small dots and accurate dispensing requires examination of available products and technologies.
Production Floor

Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Analysis Lab

Will Typical No Clean Paste Pass an SIR Test?
Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service?
Board Talk

Connector Design for Wearables
Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application.
Materials Tech

Wireless Network Transmits Data from Microelectronic Chips
A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips.
Technology Briefing

Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
Production Floor

Reliability of Polymeric Encapsulation Materials on SnAgCu Solder Joints
This study determined the processability, mechanical and temperature cycle reliability of SAC BGA solder joints reinforced by encapsulation using SJEMs.
Analysis Lab

Plating Quality Declines On Friday
An electroplating line was running 24/7. Suddenly one Friday quality began to falter. What was the root cause?
Mysteries of Science

AXI Applications with BTC and Connectors
What is the best way to use test and inspection techniques? How does one obtain accurate AXI data and images for surface mount technology process improvement?
Production Floor

Muscle-Powered Robotic Leg More Efficient than Conventional Ones

Muscle-powered robotic is energy efficient. It can also perform high jumps and fast movements as well as detect and react to obstacles without complex sensors.
Technology Briefing

Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste.
Analysis Lab

HCFC-225 Phaseout, What Now?

The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech

Reworkable Edge Bond Adhesives for BGA Applications
Reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies are presented.
Production Floor

Board Talk

Shelf Life Before Conformal Coating

Will Typical No Clean Paste Pass an SIR Test?

Cleaning Reballed BGA Components

Consensus for Baking Prior to Rework?

Reflow For Rigid Flex

What is Causing Dimples in Blind Via Pads?

Problems With Starved "J" Lead Joints

Proper Exhaust Pressure for Reflow Ovens?

MORE BOARD TALK

Questions and Comments

Reflow For Rigid Flex

Depending on the overall thickness of the flex, bake times ...
Philip H. Provencal, Jr., Columbia Tech

Variations in SAC 305 Solder

Curious, after dross recovery what phosphorus, at such a low ...
Scott E. Fiske, Lockheed Martin Space

Intrusive Soldering Through-Hole Connector

And remember this little tip, as it is the most ...
Richard Stadem, General Dynamics Mission Systems

MORE COMMENTS