Electronics Manufacturing and Electronics Assembly

Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question.
Board Talk

Aerosol Jet Printing of Conductive Epoxy for 3D
The authors describe efforts to improve both the dispensability of small volume dots and correspondingly improve the consistency and conductivity of the dots.
Production Floor

Researchers Incorporate Machine Learning Into Brain-Computer Interface
Researchers incorporated machine learning into the brain-computer interface. This solution can understand the needs of a subject and self-calibrate.
Technology Briefing

The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Analysis Lab

Atmospheric Plasma Surface Engineering of Printed Circuit Boards
Plasma treatment increases the adhesion strength of the conformal coatings through the removal of organic contaminants and surface activation.
Materials Tech

Concentration Monitoring & Closed Loop Control
In this study, the Flowsensor or acoustic concentration measurement system was evaluated at the original beta site detailing 20 days of concentration monitoring data.
Production Floor

Electrochemical Methods to Measure Corrosion Potential of Flux Residue
This study reviewed electrochemical methods on four flux systems used in a SIR study to determine if EIS data findings have commonality with SIR data findings.
Analysis Lab

Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness?
Board Talk

Optimizing Insulated Metal Substrate Application
The growth in insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application.
Materials Tech

Robots Begin to Develop Common Sense Knowledge
MIT engineers are working to give robots a bit of “common sense” when faced with situations that push them off their trained paths.
Technology Briefing

Hot Air BGA Rework Process with a Touchless Temperature-Dependent Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Production Floor

Analysis of Mechanism About Data Retention Characteristic in TANOS Structure
The long-term evaluation of TANOS structure is investigated and the prediction of retention characteristic can be evaluated through the accelerated tests.
Analysis Lab

Why Is IBM Underfill Blue?
IBM, known as Big Blue, manufactures an underfill materials that is blue. Is there a technical advantage to blue underfill?
Mysteries of Science

CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Production Floor

Wireless Network Transmits Data from Microelectronic Chips

A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips.
Technology Briefing

Direct Determination of Phosphorus Content in Electroless Nickel Plating
Developments in XRF instrument hardware and software have extended the measurement application of electroless plating processes to nearly any substrate.
Analysis Lab

Circuit Material Performance for PCBs at Millimeter Wave Frequencies

This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech

Applying Lean Philosophies to Supply Chain Management in EMS
A mid-tier EMS company's look at their use of technology, philosophy and partnerships to optimize its systems and facilitate growth.
Production Floor

Board Talk

What is the Best Way to Clean Solder Stencils?

Solder Paste Volume for BGA Rework

V-Score and Depanel in One Step

Delay Before Cleaning Partial Assemblies

Intrusive Soldering Through-Hole Connector

Solder Paste Transfer Efficiency - What/Why

Help With Lead to Hole Ratio

Going Beyond Your Solder Paste Work Life

MORE BOARD TALK

Questions and Comments

Variations in SAC 305 Solder

Curious, after dross recovery what phosphorus, at such a low ...
Scott E. Fiske, Lockheed Martin Space

Intrusive Soldering Through-Hole Connector

And remember this little tip, as it is the most ...
Richard Stadem, General Dynamics Mission Systems

Vapor Phase and Backward Compatibility

HI Jim and Phil, I love your Board Talk Podcasts. ...
Gerry Partida, Summit Interconnect

MORE COMMENTS

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