Technical Papers
Smart pH Employment in Electronic Cleaning
Mastering the EV Revolution with Expertise in High-Voltage & E-Mobility
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
2D SPI and a 2D AOI now integrated in your SMT Production Machine
Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes
An Essential Guide to Optimize Selective Soldering Processing
Is My Printed Circuit Board Wash Concentration in Check?
Ultraminiature Soldering: Techniques, Technologies, and Standards
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Smartphone Market Grows 4% with 316 Million Units Shipped in Q3, 2024
Slower growth forecast for printed electronics industry
Notebook market struggles: Compal's flat September sales signal weak demand in peak season
Can Anyone Beat Microsoft at AI? The CEO of Salesforce Thinks His Company Can.
China's exports miss forecasts, but continue growing
MORE INDUSTRY NEWS
October 15, 2024
V-Score and Depanel in One Step
V-Score and Depanel in One Step
Can we score and de-panel assembled PCBs in one step to create a card edge connector on the PCB. Is there a precedence for doing this? The Assembly Brothers, Jim Hall and Phil Zarrow, share their own experiences with this scenario and offer suggestions.
Board Talk
CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Production Floor
Wireless Network Transmits Data from Microelectronic Chips
Wireless Network Transmits Data from Microelectronic Chips
A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips.
Technology Briefing
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Developments in XRF instrument hardware and software have extended the measurement application of electroless plating processes to nearly any substrate.
Analysis Lab
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech
Applying Lean Philosophies to Supply Chain Management in EMS
A mid-tier EMS company's look at their use of technology, philosophy and partnerships to optimize its systems and facilitate growth.
Production Floor
Selective Soldering Design for Reliability Using SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab
Delay Before Cleaning Partial Assemblies
Delay Before Cleaning Partial Assemblies
We're assembling circuit boards with a water soluble flux. Is it acceptable to leave these partially assembled boards for 3 to 4 days before finishing them?
Board Talk
Manufacture of Aluminum Substrate PCBs
A new fab method that uses an aluminum substrates that house fully tested and burned in components to create a component board is described.
Materials Tech
America Risks Losing Its Status As the Most Innovative Place on Earth
America Risks Losing Its Status As the Most Innovative Place on Earth
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography.
Technology Briefing
Using Rheology as a Measurement Potentially Predictive Tool
The types of rheology measurements studied here show trends that mirror the print volume and volume reproduceability for three pastes.
Production Floor
Advanced Substrate Technology for Heterogeneous Integration
The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process.
Analysis Lab
Mystery of the Vanishing Foam
Mystery of the Vanishing Foam
A lab developed a new type of foam mattress. Samples were shipped to a customer, but upon arrival the foam had disappeared. What happened?
Mysteries of Science
Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Production Floor
Flexible Sensors Provide Versatility or Wearable Electronics
Flexible Sensors Provide Versatility or Wearable Electronics
Robots are becoming more agile and wearable electronics' traditional silicon-based sensors won’t make the cut in many applications.
Technology Briefing
Living With PB-Free in High Performance Engineering Design
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by this material.
Analysis Lab
Material Selection and Optimization for TMV PoP
Material Selection and Optimization for TMV PoP
Materials selection and parameter optimization to better understand the critical factors with successful TMV PoP assembly are investigated.
Materials Tech
Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor
Board Talk
V-Score and Depanel in One Step
Delay Before Cleaning Partial Assemblies
Intrusive Soldering Through-Hole Connector
Solder Paste Transfer Efficiency - What/Why
Help With Lead to Hole Ratio
Going Beyond Your Solder Paste Work Life
Vapor Phase and Backward Compatibility
Cause of Damage During Through-hole Component Insertion
MORE BOARD TALK
Questions and Comments
Variations in SAC 305 Solder
Curious, after dross recovery what phosphorus, at such a low ...
Scott E. Fiske, Lockheed Martin Space
Intrusive Soldering Through-Hole Connector
And remember this little tip, as it is the most ...
Richard Stadem, General Dynamics Mission Systems
Vapor Phase and Backward Compatibility
HI Jim and Phil, I love your Board Talk Podcasts. ...
Gerry Partida, Summit Interconnect
MORE COMMENTS
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