October 16, 2025
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Soldering Challenges Caused by Warpage of Large Integrated Circuits
We found that BGAs exhibit minimum warpage at a reflow temperature of 200-220°C, not MAPSP 210oC the lower temperature of about 180°C that tin-bismuth solders require. The best process production window can be obtained by using a solder alloy with a melting point of 200°C
Production Floor
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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2nd Generation of indium TIM
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Materials Tech
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Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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Elevate Your Operations with REL61
Stop settling for cost-effective alternatives that underperform. REL61 delivers the best of both worlds: significant cost reductions and superior solder joint reliability.
AIM Solder
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Are Your BGA Rework Operators Competent?
Can every operator handle your BGA rework equally well? In real life, in all but just a few situations, the answer is no. Why is this so?
Circuit Technology Center
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Was Sodium Causing Factory Fires?
One summer a factory producing coloring dyes was experiencing many alarms signaling a fire. What was causing these fires?
Mysteries of Science
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