Technical Papers
Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment
Recent Advances in Final Finishes Push Past the Limits of Conventional Electrolytes
Smart pH Employment in Electronic Cleaning
Mastering the EV Revolution with Expertise in High-Voltage & E-Mobility
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
2D SPI and a 2D AOI now integrated in your SMT Production Machine
Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes
An Essential Guide to Optimize Selective Soldering Processing
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
New Fastest Supercomputer Will Simulate Nuke Testing
India needs 12 million workers to meet electronics growth
Hon Hai expands plans for AI
How AI Can (and Should) Drive Innovation Across Your Entire Organization
Recovering in-demand metals for new electronics—researchers find industrial-strength adsorbents soak up lanthanum
MORE INDUSTRY NEWS
November 21, 2024
How Do You Remove Oxidation from PCBs?
How Do You Remove Oxidation from PCBs?
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, share their suggestions for this scenario.
Board Talk
Characterization of SIP Assembly and Reliability Under Thermal Cycles
This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays.
Production Floor
Computing After Moore's Law
Computing After Moore's Law
The gap between computing demand and supply is growing. We are seeing a revolution due to the development of deep artificial neural networks.
Technology Briefing
Moisture Effects in Common Solderable RF Connector Dielectrics
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized.
Analysis Lab
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech
Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
Production Floor
Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab
Should We Measure Solder Paste Thickness?
Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk
Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Materials Tech
Robots Begin to Develop Common Sense Knowledge
Robots Begin to Develop Common Sense Knowledge
MIT engineers are working to give robots a bit of “common sense” when faced with situations that push them off their trained paths.
Technology Briefing
Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
Production Floor
Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly.
Analysis Lab
The Hot Chip Scale Package
The Hot Chip Scale Package
A team building the world's first high-density Chip Scale Package needed to get it out the door. It was still hot when it shipped.
Mysteries of Science
Industry Progress from 2005 to Present Day
This paper compares assembly and test of various 1.0 mm pitch CBGAs conducted between 2005 and 2014.
Production Floor
Method Produces Metals with Low Thermal Expansion without Emitting CO2
Method Produces Metals with Low Thermal Expansion without Emitting CO2
Production of metals with low thermal expansion, called Invar, are critical for the aerospace, cryogenic transport, energy, and precision instrument sectors.
Technology Briefing
Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Analysis Lab
Effect of Bi Content on Properties of Low Silver SAC Solders
Effect of Bi Content on Properties of Low Silver SAC Solders
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys.
Materials Tech
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity design and assembly issues identified during the design of experiments, the findings, reliability results, and conclusions are discussed in this paper.
Production Floor
Board Talk
How Do You Remove Oxidation from PCBs?
Should We Measure Solder Paste Thickness?
How Many Fiducials Per Stencil
Why Should We Consider Smart Feeders?
PCBA Cleaning with Sodium Bicarbonate
Cure for the Grape Effect
Big Problems with HASL Finish
Solder Paste Inspection - When and Why
MORE BOARD TALK
Questions and Comments
Big Problems with HASL Finish
This problem was quite common in the late 90s. Electronic ...
Les Watts, Testerion
Shelf Life Before Conformal Coating
There are a couple of standards that have requirements for ...
Alan Woodford, Zentech
Reflow For Rigid Flex
Depending on the overall thickness of the flex, bake times ...
Philip H. Provencal, Jr., Columbia Tech
MORE COMMENTS
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