Electronics Manufacturing and Electronics Assembly

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Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic

Technical Papers

Unlocking the Potential of Nanoscale Conformal Coatings

Recycling vs Circularity: Minimising E-Waste in Manufacturing

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

Probe Card Manufacturer 'Sees the Unseen' With X-ray

Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods

An Eight-Step Methodology for Bringing a Process Under Statistical Control

Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel

Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry

MORE TECHNICAL PAPERS

Ask the Experts

Components Jumping Around During Reflow

Conformal Coating in Low Humidity Environments

Solder Paste Alloy Check

Reflow Oven - 5 Zone or 8 Zone

Tarnished OSP Circuit Boards

Concerns With Silver Finish Component Leads

Initial Screen Print Test Board

Cleaning Under Low Clearance Components

MORE ASK THE EXPERTS

Eliminate Cross Contamination

The Model 2003 Stencil & Pallet Cleaner is a semiautomatic system with two ultrasonic wash tanks for multiple applications. It is guaranteed to clean solder paste from any fine-pitch stencil.

LEARN MORE

April 3, 2025

Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions

Electronic Assembly reliability must consider process residues and cleanliness. IPC J-STD-001J—Section 8 requires assemblers to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other process residues. This research aims to study the electrical effects of flux and process residues following the rework process.
Materials Tech

Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Production Floor

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Method Produces Metals with Low Thermal Expansion without Emitting CO2
Production of metals with low thermal expansion, called Invar, are critical for the aerospace, cryogenic transport, energy, and precision instrument sectors.
Technology Briefing

Solder Joint Void Metrology to Monitor Solder Joint Quality
We are showing what could be done when using a 2D X-ray system to collect high resolution images and process them with Deep Learning using AI.
Analysis Lab

Solder Paste: Fundamental Material Property / SMT Performance
Aggressive form factors, reducing pitch, thinner packages, and larger die to package ratios are leading to higher package warpage during SMT reflow.
Materials Tech

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e-media Advertising Delivers Results!
Introduce your technology, new products or services in our e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 125,000 professionals.
Circuitnet Media LLC

Using Rheology as a Measurement Potentially Predictive Tool
The types of rheology measurements studied here show trends that mirror the print volume and volume reproduceability for three pastes.
Production Floor

Measuring the Impact of Test Methods for High-Frequency Circuit Materials
How can two different test methods provide Dk measurement that are different? When the methods measure the same circuit material in two different directions.
Analysis Lab

Sponsor

Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics - no trade-offs needed.
AIM Solder

Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Materials Tech

Computing After Moore's Law
The gap between computing demand and supply is growing. We are seeing a revolution due to the development of deep artificial neural networks.
Technology Briefing

Sponsor

Touchless Solder Ball Removal
Watch our video showcasing touch-free BGA component deballing. This revolutionary approach achieves unparalleled reliability and precision when preparing BGA components for re-balling.
Circuit Technology Center

Hot Air BGA Rework Process with a Touchless Temperature-Dependent Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Production Floor

Assessing Electronic Devices with 3D X-Ray Imaging and Electron Microscopy
This article presents workflows that combine 3D X-ray microscopy, nanoscale tomography, and electron microscopy for visualization of the interior of electronic devices.
Analysis Lab

Sponsor

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD

The Ink Spitting Autowriter
A factory was testing a new auto writing system. It went haywire when a big fork truck passed by. What was causing this?
Mysteries of Science

Voids in SMT Solder Joints – Trends in Automotive Electronics
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints.
Production Floor

Researchers Incorporate Machine Learning Into Brain-Computer Interface

Researchers incorporated machine learning into the brain-computer interface. This solution can understand the needs of a subject and self-calibrate.
Technology Briefing

Conformal Coatings - New Solutions to Existing Problems
This paper describes work carried out by Humiseal to investigate root causes of these problems, and to introduce materials with improved performance.
Analysis Lab

Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Materials Tech

Pick-and-Place Feeder density within SMT and Electronics Assembly

To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Production Floor

Latest Industry News

No Technical Obstacles to New Giant Particle Collider in Europe: CERN

Consumer electronics see electric performance

North American EMS Industry Up 1.7% in February

Intel will spin off its 'non-core' businesses, new CEO says

Trump tariffs kick off today: Electronics companies hope for a reprieve

MORE INDUSTRY NEWS

Sponsor

Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond

Questions and Comments

Palm Size Portable 3 Printer

Impressive start. I look forward to further reports on the ...
Jaye Waas, Renkus-Heinz

Impact of PCB Manufacturing, Design, and Material to PCB Warpage

Symmetrical stack ups and copper distribution is key to maintaining ...
Gerry Partida, Summit Interconnect

Additive Manufactured Electronics for Next Generation Microelectronics

AME is necessary to manufacture advanced electronics do to need ...
Voya Markovich

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Keys to Reliable Tin Mitigation

Unlock the secret to component lead tinning for tin mitigation using robotic hot solder dip.

Download our free whitepaper and discover all the secrets.

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Sponsor

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies