Electronics Manufacturing and Electronics Assembly

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Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics - no trade-offs needed.
AIM Solder

Technical Papers

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

Maintenance: The Basics of Cleaning Series Part 4

The Economics of Electronic Component Salvage and Reuse

MORE TECHNICAL PAPERS

Ask the Experts

Reflow Causing Warp

Conformal Coating Recommendation

Circuit Board Bow and Twist

Burned Chip Repair

Confused About IPC-A-610 Class 2 vs. Class 3

Copper Dissolution Rate

What is the IPC Definition of Uncommonly Harsh?

MORE ASK THE EXPERTS

October 2, 2025

Requirements for the Filler Material Solder Paste for Different Technologies

To date, filler materials based on solder pastes have been qualified for the respective technologies to meet the respective requirements. The article is intended to show which important requirements are necessary for the respective evaluation.
Materials Tech

Technologies and Standards to Realize Smart Manufacturing
The future of manufacturing in the Electronics Industry is dependent on the ability to develop and deploy technology platforms to realize Smart Manufacturing and Industry 4.0.
Production Floor

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BGA Component Rework Simplified
When you're confronted with tough BGA rework, who do you turn to? Discover the #1 resource used by military contractors. We have solutions for all your BGA rework and repair needs.
Circuit Technology Center

In-Line Testing of Highly Panelized PCBAs with Parallel Functional Test
The manufacturing process challenges faced by electronics manufactures producing large panels of small boards is discussed.
Production Floor

A Method to Investigate PCB Supplier Rework Processes and Best Practices
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality.
Analysis Lab

Fill the Void
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding.
Materials Tech

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Silver Filled, Heat Curing Epoxy
Master Bond EP4S-80 is a one part, electrically conductive, silver filled adhesive for bonding, sealing and coating with a low curing temperature of 80°C.
Master Bond

Artificial Intelligence in Improving Automated Optical Inspection
After reviewing the four AI use cases presented in this paper, it is very apparent the overwhelming benefit AI can have with our AOI process and programs.
Production Floor

Board Level Reliability of Large Body Size WlCSP for Automotive Applications
This paper will outline the board-level assembly development and reliability that was undertaken to demonstrate this WLCSP could meet the demands of automotive.
Analysis Lab

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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

How Effective Is Nano Coating On Stencils?
With nano coatings on stencils evolving, what is the best method to measure the thickness? How do you know if the coating degrades over time?
Board Talk

Engineered Cleaning Agent Study Rinsing under Low Profile Components
This research studies rinsing effects as a function of loading and cleaning agent design. A type of sensor for non-ionic organic compounds will be used.
Materials Tech

Conformal Coating Testing in Various Test Environments
This paper compared these three environments in terms of how well they characterize conformal coatings.
Analysis Lab

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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor

Optimization of PCB SI Coupon Design that Minimizes Discontinuity
In this study, we tried to minimize the discontinuous path of Delta-L coupon by using the VIPPO (Via In Pad Plated Over) technique to improve the signal integrity.
Analysis Lab

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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Where Is the Missing Gold?
A gold inventory tally made sure gold-in matched gold-out. Why were gold orders going up when sales showed no increase?
Mysteries of Science

Direct Imaging and Direct Jetting of Solder Mask
PCB manufacturers are challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components.
Production Floor

Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers

To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, without compromising quality, cost, and throughput.
Production Floor

Effect of Thermal Cycling Dwell Time on High-Performance Solder Alloys
This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time.
Analysis Lab

Low Temperature Solder “Reverse Hybrid” Method
This paper will review the implementation of LTS “Reverse Hybrid”, which is the assembly of a ball grid array component with LTS solder balls to the motherboard.
Materials Tech

Machine Vision-based Defect Inspection for Plated Through Hole Components

This study delineates the conceptualization of a machine vision-based defect inspection model, meticulously engineered to confront the intricacies of high-throughput PCB assembly.
Production Floor

Latest Industry News

TSMC Price Hikes End the Era of Cheap Transistors

Why current AI models won’t make scientific breakthroughs, according to a top tech exec

PCB industry to expand this year

North American EMS Industry Shipments Down 1.4% in August

AI Can't Translate Culture — Here's Why Human Oversight Still Wins in Localization

MORE INDUSTRY NEWS

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Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic

Questions and Comments

Concerns with Flux During Vapor Phase Reflow

Flux density is lighter than the Galden, so any melted ...
Mike Cummings, TSI

Is There a Spacing Spec for SMD Components?

Another significant spacing issue arises if you have a mixed-technology ...
Alan Ritter, MtRitter.com, LLC

Influence of Salt Contamination and RH on Creep Corrosion of Immersion Silver

In the 1980s a consortium of companies sponsored research under ...
Pat Lees, Littelfuse

MORE COMMENTS

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

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