Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question. Board Talk
Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness? Board Talk
CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs. Production Floor
A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips. Technology Briefing