Electronics Manufacturing and Electronics Assembly

Sponsor

Sawa Ecobrid Fully Automatic Stencil Cleaner
This cleaner has 2 ultrasonic cleaning head panels for cleaning the front & back sides together. Ultrasonic energy is applied directly to the stencil.
Seika

Technical Papers

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

MORE TECHNICAL PAPERS

Ask the Experts

Stencil Issue with PLCC Component

Concave Via Fillets Causing Problems

Gold Edge Contact Rework

Exposed Copper Defect

Solder Paste Print in Volcano Shape

Fastening Surface Mounted Connectors Before or After Refow?

BGA Reballing Question

Conformal Coating Press Fit Connectors

MORE ASK THE EXPERTS

December 2, 2025

Non-Contact Measurement of Conformal Coating Thickness

Conformal coating is designed to provide protection and long-term reliability to printed circuit boards (PCB) in harsh environments where high humidity, high temperature, corrosive gases, or salt spray may be present. This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces.
Analysis Lab

Intrusive Soldering Through-Hole Connector
We are SMT soldering a through-hole PC 104 connector. We have tried preforms and are unable to get all of the pins soldered. Phil Zarrow and Jim Hall, The Assembly Brothers, share their own suggestions in this scenario.
Board Talk

Sponsor

BGA Component Rework Simplified
When you're confronted with tough BGA rework, who do you turn to? Discover the #1 resource used by military contractors. We have solutions for all your BGA rework and repair needs.
Circuit Technology Center

Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution.
Materials Tech

Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics

This paper reports an ensemble of strategies for the successful miniaturization of EEG in a fully-flexible, wearable and wireless platform.
Analysis Lab

High-Density Adaptive Redistribution Technology for Embedded High I/O Components
Improving the performance of semiconductor chips and advancing packaging features are critical. One solution is the use of miniaturized packages with advanced embedded components.
Production Floor

Sponsor

Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond

Electronic Assembly Rework Best Practices: Cleaning Conditions

Electronic Assembly reliability must consider process residues and cleanliness. This research studies the electrical effects of flux and process residues following rework.
Materials Tech

Pin-in-Ball and Non-Solder Ball Grid Arrays Demonstrate Advancements
This paper will focus on the research and development of the Next Gen Pin-in-Ball Grid Array connectors, and the non-solder ball versions.
Analysis Lab

Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura

Qualitative Model Describing Hot Tear Above VIPPO and Other Design Elements
The mechanism for the formation of Hot Tears is discussed and applied to other design elements that can be found on Printed Circuit Board Assemblies.
Production Floor

Solder Paste Transfer Efficiency - What/Why

I've heard the term transfer efficiency relating to printing. What does this term refer to? What actions impact solder paste transfer efficiency?
Board Talk

Superior Thermal Cycling Reliability of PB-Free Solder Alloy

Alternative solders meet stringent environmental regulations, requirements for greater mechanical reliability, and high temperature service environments.
Materials Tech

Sponsor

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
This study looks at an analysis of why a D-PAK exhibits more voiding than other types of BTCs. Voiding results based on an analysis of several process variables.
Analysis Lab

Solder Paste: Fundamental Material Property / SMT Performance
Aggressive form factors, reducing pitch, thinner packages, and larger die to package ratios are leading to higher package warpage during SMT reflow.
Materials Tech

Sponsor

Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center

Attack of the BLOB!

Joe came home from work one day to find his house covered in a mysterious foam-like blob material. What was the mysterious foam and where did it come from?
Mysteries of Science

Latest Industry News

OpenAI Just Confirmed its First Hardware Prototype, Built with Jony Ive

Nvidia says its GPUs are a 'generation ahead' of Google's AI chips

Advanced Electronic Packaging – How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia

Dell misses on revenue, offers strong forecast driven by AI sales

Why Are Insurance Plans For Electric Vehicles More Expensive?

MORE INDUSTRY NEWS

Sponsor

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp