Electronics Manufacturing and Electronics Assembly

A fabricator recently notified us that during the ENIG plating process, several pads had been “skipped” and missed on a number of boards. The fabricator would like to add OSP to the pads that are missing the ENIG. Is this acceptable?
Board Talk

Reliability of Critical Assemblies When Implementing a New Cleaning
The cleanliness of high-reliability assemblies has become more critical for the product’s performance in the field.
Production Floor

Carbon Dioxide and Lignin Offer Alternative to Traditional Plastic
Researchers have created a potential alternative to traditional petroleum-based plastic made from carbon dioxide, plus lignin, a component of wood.
Technology Briefing

Solid-State Diffusion between Rolled Cu and Electroplated Matte-Sn System
This study focusses on the IMC phase growth in rolled Cu- electroplated Sn system during the temperature range from 398K to 473K.
Analysis Lab

Development and Testing of a Lead-Free Low Melting Point Alloy
This paper describes the development and testing procedure of a new lead-free low melting point alloy.
Materials Tech

Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor

Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab

The Best Method for Reworking Ultra-Micro Chips
We are soldering and reworking 0201s and 01005s using hot air solder rework station with adjustable air flow. The minimum air flow will blow parts.
Board Talk

A Novel Conformal Back-Up Material
Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits.
Materials Tech

Wireless Network Transmits Data from Microelectronic Chips
A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips.
Technology Briefing

Soldering Immersion Tin
This paper focuses on awareness of factors attributed to soldering i-Sn including IMC formations in relation to reflow cycles and solderability performance.
Production Floor

Influence of Via Stub Length and Antipad Size
The paper describes the test vehicle and electrical performance characteristics of the various test cells. A recommendation for an acceptable stub length is given.
Analysis Lab

The Metallic Paint Secret
A technician determined how super-bright metallic paint was made without analyzing the material. How could this be done?
Mysteries of Science

Control of the Underfill of Surface Mount Assemblies
Paper addresses the control of surface mount under fill assemblies, focusing on inspection techniques and possible options to overcome their limitations.
Production Floor

AI and Precision Agriculture Address Farming Problems

Automation with biology and chemistry to create a farming revolution which enabled a fraction of the population to deliver more than had formerly produced.
Technology Briefing

Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders.
Analysis Lab

Intermetallic Compounds in Solder Alloys: The Common Misconception

This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys.
Materials Tech

Returning to Basics in the SMT Screen Printing Process
This paper showcases a new stencil process that was discovered by reverting to the basics.
Production Floor

Board Talk

Adding OSP to Pads that are Missing ENIG Plating Process

The Best Method for Reworking Ultra-Micro Chips

How To Rework Warped PCBAs?

Incoming Circuit Boards - How Clean Is Clean?

How Long Solder Paste Can Be Left On a Stencil Without Activity

Should We Invest in 3D Optical Inspection?

Intrusive Soldering vs. Wave Solder

Issues With BGA Rework Residue

MORE BOARD TALK

Questions and Comments

Solder Paste Printing First Pass

The focus here is what to do about checking the ...
Michael Sivigny, CeTaQ Americas

Solder Paste Printing First Pass

Several questions you may also to considers *Can parts be ...
Fred Huang, Sparqtron Corp.

How Long Solder Paste Can Be Left On a Stencil Without Activity

Testing for Environmental factors should include seasonal changes. Most larger ...
Alan Woodford, Zentech

MORE COMMENTS

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