Electronics Manufacturing and Electronics Assembly

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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Technical Papers

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

Maintenance: The Basics of Cleaning Series Part 4

MORE TECHNICAL PAPERS

Ask the Experts

Rework or Repair?

BGA Component Grounding Problem

Aluminum Trays and Rapid Static Discharge

Use of Nitrogen for Hand Soldering

Environment Impact on Assembly, Printing and Reflow

IPC-A-610 Class 3 - IPC-A-600 Class 2

Glued SMT Components Falling Off

Delamination Causing Scrap

MORE ASK THE EXPERTS

October 16, 2025

Soldering Challenges Caused by Warpage of Large Integrated Circuits

We found that BGAs exhibit minimum warpage at a reflow temperature of 200-220°C, not MAPSP 210oC the lower temperature of about 180°C that tin-bismuth solders require. The best process production window can be obtained by using a solder alloy with a melting point of 200°C
Production Floor

Innovative Panel Plating for Heterogeneous Integration
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing.
Production Floor

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Development of Si-Interposers for 3D Heterogeneous Integration
This paper will review the status of the ongoing interposer development program and provide details on the process capabilities that have been established.
Analysis Lab

Solder Joint Void Metrology to Monitor Solder Joint Quality
We are showing what could be done when using a 2D X-ray system to collect high resolution images and process them with Deep Learning using AI.
Analysis Lab

2nd Generation of indium TIM
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Materials Tech

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Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic

Pick-and-Place Feeder density within SMT and Electronics Assembly
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Production Floor

Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds.
Analysis Lab

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

How Can We Prevent Our 0201 Nozzles From Clogging?
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle.
Board Talk

Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating.
Materials Tech

Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Materials Tech

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Elevate Your Operations with REL61
Stop settling for cost-effective alternatives that underperform. REL61 delivers the best of both worlds: significant cost reductions and superior solder joint reliability.
AIM Solder

Investigating the Metric 0201 Assembly Process
This paper will look at the challenges of assembling the M0201 component in a high-volume manufacturing environment.
Production Floor

Lessons Learned While Investigating Microvia Reliability Failures
There has been an increasing number of reports concluding that stacked micro vias are failing preferentially when compared to an alternative staggered via design.
Analysis Lab

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Are Your BGA Rework Operators Competent?
Can every operator handle your BGA rework equally well? In real life, in all but just a few situations, the answer is no. Why is this so?
Circuit Technology Center

Was Sodium Causing Factory Fires?
One summer a factory producing coloring dyes was experiencing many alarms signaling a fire. What was causing these fires?
Mysteries of Science

Optimize the Dispensing Process with True 3D Inspection
The journey toward zero defects in dispensing is challenging but achievable. True 3D inspection technology has have emerged as a powerful ally in this quest to ensure the highest quality levels.
Production Floor

Voids in SMT Solder Joints – Trends in Automotive Electronics

There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints.
Production Floor

Conformal Coatings - New Solutions to Existing Problems
This paper describes work carried out by Humiseal to investigate root causes of these problems, and to introduce materials with improved performance.
Analysis Lab

Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Materials Tech

Hot Air BGA Rework with a Touchless Temperature-Dependent Process

The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Production Floor

Latest Industry News

Worldwide PC Shipments Grew 8.2% in Third Quarter of 2025

Apple's Foldable iPhone May Be Cheaper Than We Expected

Pegatron chair downplays impact of rare earth curbs

Why Corporate Innovation Moves So Slowly — and the Shift That's Finally Breaking the Cycle

New Rumors Suggest A Smartphone With A 9,000 mAh Battery Could Be On Its Way

MORE INDUSTRY NEWS

Sponsor

Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements.
Master Bond

Questions and Comments

Supercooled Solder Pastes in Low-Temperature Attach Applications

Interesting work toward very low temperature soldering. While it resulted ...
Jaye Waas, Renkus-Heinz

PCBA Inspection Concerns

A rule to follow, is; do not slide the boards ...
Jaye Waas, Renkus-Heinz

Can Conductive Ink Shrink?

The statements presented hit the key points. Conductive inks shrink ...
Jaye Waas, Renkus-Heinz

MORE COMMENTS

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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD