A fabricator recently notified us that during the ENIG plating process, several pads had been “skipped” and missed on a number of boards. The fabricator would like to add OSP to the pads that are missing the ENIG. Is this acceptable? Board Talk
A Novel Conformal Back-Up Material
Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits. Materials Tech
Soldering Immersion Tin
This paper focuses on awareness of factors attributed to soldering i-Sn including IMC formations in relation to reflow cycles and solderability performance. Production Floor
Automation with biology and chemistry to create a farming revolution which enabled a fraction of the population to deliver more than had formerly produced. Technology Briefing
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys. Materials Tech