Electronics Manufacturing and Electronics Assembly

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Technical Papers

Recycling vs Circularity: Minimising E-Waste in Manufacturing

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

Probe Card Manufacturer 'Sees the Unseen' With X-ray

Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods

An Eight-Step Methodology for Bringing a Process Under Statistical Control

Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel

Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry

Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment

MORE TECHNICAL PAPERS

Ask the Experts

Conformal Coating in Low Humidity Environments

Solder Paste Alloy Check

Reflow Oven - 5 Zone or 8 Zone

Tarnished OSP Circuit Boards

Concerns With Silver Finish Component Leads

Initial Screen Print Test Board

Cleaning Under Low Clearance Components

What Is This Contamination?

MORE ASK THE EXPERTS

April 1, 2025

Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester PCBs

This paper discusses the results of a comparative study for solder joint performance - under shock - for ENIG and ENEPIG surface plated tester PCBs. The best cost-reduction practice for Intel manufacturing is to deliver testers with high quality and reliability. Solutions with higher margins to failure will support this goal.
Analysis Lab

Voids in SMT Solder Joints – Trends in Automotive Electronics
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints.
Production Floor

Sponsor

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Researchers Incorporate Machine Learning Into Brain-Computer Interface
Researchers incorporated machine learning into the brain-computer interface. This solution can understand the needs of a subject and self-calibrate.
Technology Briefing

Conformal Coatings - New Solutions to Existing Problems
This paper describes work carried out by Humiseal to investigate root causes of these problems, and to introduce materials with improved performance.
Analysis Lab

Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Materials Tech

Sponsor

Bismuth in Solder Alloys
Bismuth is a primary constituent in many low-temp solders. It also serves as an additive element in SAC solders that reinforces joint durability & optimizes wetting characteristics.
AIM Solder

Pick-and-Place Feeder density within SMT and Electronics Assembly
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Production Floor

Drop/Shock Behavior of Low Temperature Solder BGA
This study examines challenges posed by aging, a critical factor influencing the long-term performance of solder joints.
Analysis Lab

Sponsor

Essential guide for hi-rel BGA re-balling
Re-balling of BGA's with tin-lead solder is required in some hi-rel applications due to tin whisker concerns. This white paper discusses the key considerations of this specialized process. Read more.
Circuit Technology Center

Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk

Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech

Carbon Dioxide and Lignin Offer Alternative to Traditional Plastic
Researchers have created a potential alternative to traditional petroleum-based plastic made from carbon dioxide, plus lignin, a component of wood.
Technology Briefing

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor

Optimizing Throughput and Cost with Manufacturing Simulation
This paper describes the design and implementation of several manufacturing simulation use-cases at an electronics assembly factory in Nanjing, China.
Analysis Lab

Sponsor

Two Part, Room Temperature Curing Epoxy
Master Bond EP39MAOHT is a thermally conductive, electrically insulative adhesive with low exotherm, suitable for large castings and potting applications.
Master Bond

Process Change Causes Spots
After implementing line improvements, tiny bright spots appeared on the surface of newly made circuit boards. What was the cause?
Mysteries of Science

Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Production Floor

Flexible Sensors Provide Versatility or Wearable Electronics
Robots are becoming more agile and wearable electronics' traditional silicon-based sensors won’t make the cut in many applications.
Technology Briefing

Oxide Alternative Process for High Frequency Bonding Applications
This paper highlights the challenges made with conventional Sulphuric-Peroxide based Oxide Replacement bonding enhancement system.
Analysis Lab

Ductile Low Temperature Solders for Mass Production of Assemblies
This paper reports results of the behaviour of Sb in a Sn-Bi alloy and consider the implications of the findings for the reliability of LTS solder joints.
Materials Tech

The Versatile Preform

This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms.
Production Floor

Latest Industry News

North American PCB Industry Sales Up 11.3% in February

Huawei 2024 revenue surges to near-record high as China smartphone comeback takes hold

Trump has dubbed April 2 'Liberation Day' for his tariffs. Here’s what to expect

Groundbreaking new EV charging tech adds 250 miles of range in 5 minutes

The 'Dirty 15' percent: Some countries will take a harder hit from Trump's tariffs

MORE INDUSTRY NEWS

100+ Repair and Rework Guides Online!

This online guidebook, packed with hundreds of detailed illustrations, is sure to be helpful when repairing circuit board assemblies to IPC specs.

CHECK IT OUT!

Sponsor

Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies

Questions and Comments

Palm Size Portable 3 Printer

Impressive start. I look forward to further reports on the ...
Jaye Waas, Renkus-Heinz

Impact of PCB Manufacturing, Design, and Material to PCB Warpage

Symmetrical stack ups and copper distribution is key to maintaining ...
Gerry Partida, Summit Interconnect

Additive Manufactured Electronics for Next Generation Microelectronics

AME is necessary to manufacture advanced electronics do to need ...
Voya Markovich

MORE COMMENTS

Peel-A-Way Removable Terminal Carriers

Reduce PC board assembly time by eliminating hand-loading of socket terminals and pins. Available in virtually any pattern to match your existing board layout.

FREE SAMPLE

Sponsor

440-R + Ultrasonics = Safe & Efficient Cleaning
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, misprints & SMD adhesives.
Smart Sonic