Electronics Manufacturing and Electronics Assembly

We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness. What do you advise? Jim Hall and Phil Zarrow, The Assembly Brothers, share their thoughts and experiences with this scenario.
Board Talk

Jetting Strategies for mBGAs
This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape.
Production Floor

Method Produces Metals with Low Thermal Expansion without Emitting CO2
Production of metals with low thermal expansion, called Invar, are critical for the aerospace, cryogenic transport, energy, and precision instrument sectors.
Technology Briefing

Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab

High Performance Light and Moisture Dual Curable Encapsulant
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Materials Tech

Electrostatic Discharge Factory Issues
The paper offers an overview of causes for ESD, where electrostatic charges are increasingly generated.
Production Floor

Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
Analysis Lab

Proper Exhaust Pressure for Reflow Ovens?
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure?
Board Talk

Microalloyed Sn-Cu Pb-Free Solder for High Temp
While susceptibility to tin whisker growth remains a barrier to the transition to Pb-free, there is now general acceptance that there are reliable alternatives.
Materials Tech

Palm Size Portable 3 Printer
Imagine a portable 3D printer you could hold in your palm. The tiny device could enable a user to rapidly create customized, low-cost objects on the go.
Technology Briefing

Backward Compatible Solder Joint Reliability Under Accelerated Conditions
Accelerated temperature cycling was used to assess the thermal fatigue reliability of a Pb free grid array package assembled.
Production Floor

Evaluation of the Use of ENEPIG in Small Solder Joints
In this study, the impact of industry standard Pd thicknesses on thin solder joints is evaluated through shear testing.
Analysis Lab

Flying Saucer Over The Factory
At a new circuit factory an employee heard a thud and saw a bright metal dome-shaped object falling from the sky. Where did it come from?
Mysteries of Science

Counterfeit Electronics Component Conundrum with Smart Labeling
Electronics manufacturers hurting from supply chain disruptions, component shortages, and a trade war are further challenged by the rise in counterfeit components.
Production Floor

The Biggest Barrier to a Robotics Revolution

Experts believe robots will be able to cost-effectively perform a large share of physical tasks which, until now, have been performed only by humans.
Technology Briefing

Assembly Reliability of TSOP/DFN PoP Stack Package
This paper presents thermal cycle reliability evaluations of 2-high and 4-high 3D stacks built with a mix of TSOP and DFN daisy-chain package assembly.
Analysis Lab

The Basics of Metal Thermal Interface Materials (TIMS)

Advancements in metal patterning have improved the effectiveness of metal TIMs by improving their compressibility.
Materials Tech

Stereo Vision Based Automated Solder Ball Height Detection
An automatic, stereo vision based, in-line ball height inspection method is presented. This includes an imaging setup with a computer vision algorithm.
Production Floor

Board Talk

Problems With Starved "J" Lead Joints

Proper Exhaust Pressure for Reflow Ovens?

Can a CTE Mismatch Cause Reliability Problems?

Max Interval Between Reflow for OSP Boards

Issues Mixing Silicone and Acrylic Conformal Coatings

We Bake, But Still Have Delamination, Why?

What is the Best Way to Clean Solder Stencils?

Solder Paste Volume for BGA Rework

MORE BOARD TALK

Questions and Comments

Variations in SAC 305 Solder

Curious, after dross recovery what phosphorus, at such a low ...
Scott E. Fiske, Lockheed Martin Space

Intrusive Soldering Through-Hole Connector

And remember this little tip, as it is the most ...
Richard Stadem, General Dynamics Mission Systems

Vapor Phase and Backward Compatibility

HI Jim and Phil, I love your Board Talk Podcasts. ...
Gerry Partida, Summit Interconnect

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