circuit insight
April 24, 2025
Exploring the Next-Generation High-Reliability Lead-free Solder Alloy
Exploring the Next-Generation High-Reliability Lead-free Solder Alloy
The novel Alloy 10 solder alloy presented here exhibits exemplary thermomechanical and mechanical reliability in extreme operating conditions, ideal for the future needs of high-reliability electronics, such as in the automotive industry.
Materials Tech
3P Production Preparation Process
A Lean Manufacturing methodology is presented as a standardization tool where teams work for the process design of production lines and manufacturing systems.
Production Floor
Sponsor
Aim-Solder

Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics - no trade-offs needed.
AIM Solder
Muscle-Powered Robotic Leg More Efficient than Conventional Ones
Muscle-powered robotic is energy efficient. It can also perform high jumps and fast movements as well as detect and react to obstacles without complex sensors.
Technology Briefing
Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Analysis Lab
High and Matched Refractive Index Liquid Adhesives for Optical Device
High and matched refractive index liquid adhesives are required in several electronics devices, where the liquid adhesives are in the optical pathway.
Materials Tech
Sponsor
Circuit-Technology-Center

Proven Strategies for Reliable Tin Mitigation
Unlock the secret to component lead tinning for tin mitigation using robotic hot solder dip. Download our newest whitepaper now!
Circuit Technology Center
Surface Treatment Enabling Low Temperature Soldering to Aluminum
Surface Treatment Enabling Low Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates.
Production Floor
The Importance of Having a Clean Slate in the SMT Assembly Process
The paper covers an experiment to improve upon the defect ratio of their PCB assembly process by utilizing a bare board cleaner before the paste printer.
Analysis Lab
Sponsor
ECD

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
Solder Paste Printing First Pass
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print.
Board Talk
Designing a High Performance Electroless Nickel and Immersion Gold
Designing a High Performance Electroless Nickel and Immersion Gold
It was the goal of this paper to overcome myths and misunderstandings within the PCB manufacturing environment regarding the HP ENIG finish.
Materials Tech
Microchips That Can Identify Multiple Diseases from a Cough
Microchips That Can Identify Multiple Diseases from a Cough
Research shows it's possible to develop and build microchips that can identify multiple diseases from a single cough or air sample and can be produced at scale.
Technology Briefing
Sponsor
Master-Bond

Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond
Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Production Floor
Thermal Fatigue Reliability of SAC305 due to Mixed Metallurgy Assembly
This study presents thermal fatigue data generated in thermal cycling for the case of BGA mixed metallurgy assembly.
Analysis Lab
Sponsor
Glenbrook-Technologies

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies
The Case of the Falling Floor
The Case of the Falling Floor
The line was running when suddenly there was a loud thud. The floor, supporting a vertical beam had given way. What happened?
Mysteries of Science
Characterization of SIP Assembly and Reliability Under Thermal Cycles
This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays.
Production Floor
Computing After Moore's Law
Computing After Moore's Law
The gap between computing demand and supply is growing. We are seeing a revolution due to the development of deep artificial neural networks.
Technology Briefing
The Maximum Allowable Compression Load Per Solder Interconnect
An attempt to identify the maximum quantitative allowable compression load per solder ball in a large component configuration with 600μm in solder ball diameter is investigated.
Analysis Lab
Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech
Gooey Flux Residue Left Behind
Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk
Latest Industry News
CATL Charges Ahead With 520km Range in Five Minutes
Recycle rare earths to help protect supply chain
Here's what Elon Musk said about tariffs and their potential effect on Tesla
Tesla CEO Elon Musk dreams big but often delivers late
Electronics Suppliers Bolster Sustainability Efforts Despite Challenges from Tariffs, AI
MORE INDUSTRY NEWS
Glenbrook-Technologies
Sponsor
Smart-Sonic

Eliminate Worry of Cross Contamination
While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine.
Smart Sonic
Questions and Comments
A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
In re-reading this study, the results, of course are well ...
Jaye Waas, Renkus-Heinz
Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions
There really, at present, no such thing as "selective cleaning". ...
Phil Zarrow, ITM Consulting
Palm Size Portable 3 Printer
Impressive start. I look forward to further reports on the ...
Jaye Waas, Renkus-Heinz
MORE COMMENTS
Robotic Component Tinning Services
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
Cartoon
"Our legal department wants us to download their new software. It translates gobbledygook to mumbo jumbo."
Copyright © Randy Glasbergen