|
AI Technology has more than 29 years experience in designing and manufacturing various forms of high performance “Stress-free” flexible adhesive films and pastes and materials for microelectronic packaging and thermal interface materials for thermal management applications.
Our technologies and products include solvent-free dies and substrate attach pastes and films, compressible gap-filling phase change thermal interface materials of thermal pads, thermal gels, thermal greases, polymer based Solder-Sub® flexible conductive adhesives for solder-replacement in fine-pitch interconnections, near-hermetic lid sealant for ceramic and metal covers and optical glass lids for opto-electronic sensors and devices, EMI Shielding gasket/adhesive/caulk materials, double-sided UV-release wafer grinding tapes and high temperature-static free dicing tapes.
|
|
Presentations |
No Presentations Currently Available.
|
|
AI Technology, Inc.
|
Supplier Update Form
|
Use the form below to request updates to this supplier page listing.
|
Contact Information |
Your Address Information is missing.
|
WEBSITE
|
Social Media Links
|
Line through indicates social medial link missing.
|
Return To Listing
|
|
|
|