Research & Technical Papers

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HDI Structures Using Thin Films and Low Temp Paste

Conductors and dielectrics have to be considered when building any ...

Cost Comparison of Complex PCB Fabrication

The authors present an alternative to sequential lamination for fabricating ...

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■	No additional information currently available.

Ormet materials provide high electrical and thermal conductivity, good solderability, adhesion to most substrates and low curing temperatures. During cure, Ormet ink becomes a fused metal network that alloys itself to conventional circuit materials.

The metal network is permeated by polymer that adheres to the substrate providing mechanical reinforcement. These properties represent the product of Ormet inks patented composition.

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Ormet Circuits, Inc.

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