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RF Capacitor Material for Use in Printed Circuit Board

A novel ceramic-functional-particle-filled polymer composite material has been developed for ...

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Oak-Mitsui (OM) specializes in the development and production of world class performance copper foils, Aluminum Bonded Copper (ABC), and Advanced Interconnect Materials (AIM) for electronic interconnect (printed circuit board) applications.

Manufactures thin, electrodeposited copper foils for printed circuitry used in electronics, telecommunications, automotive, medical instrumentation and consumer goods.

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Oak-Mitsui, Inc.

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