Research & Technical Papers

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■	Finetech Rework Equipment
■	Finetech Production Bonders
■	Finetech R&D Bonders

Finetech's high‐accuracy bonding equipment for micro assembly supports the most precise and complex applications. Sub-micron placement is possible with an extensive range of bonding technologies; our quality optics and highly stable machine design provide the accuracy and repeatability that today’s applications demand. Our professional SMD hot gas rework systems provide high end solutions. These products deliver the key benefits needed for reworking advanced devices.

The entire product development and production chain is accomplished internally (machine hardware, process modules, control electronics, tooling, software and more). This approach allows for short response times and high effectiveness at every step.

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Finetech

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die bonder, flip chip bonder, die attach system, photonics packaging, SMD rework, bga rework station, bga reballing, microelectronics assembly, R&D die bonder, SMT rework system

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540 West Iron Avenue #102
Mesa, AZ 85210

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