A Close look at IPC X-Ray Inspection Guidelines for BGAs
The massive amount of measurements and qualitative information provided by CT-Xray systems can now enable more inspections to be easily automated, ultimately reducing the burden on engineers. With access to this impressive technology, tighter processing parameters can be maintained to ultimately ensure higher quality electronic products for a variety of markets.
Analysis Lab
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Authored By:
Nicholas Fieldhouse, M.S.
Omron Electronics
IL, USA
Summary
BGA defects can be challenging to detect when images are not taken from the appropriate perspective or with the correct equipment. While IPC's recommended tests are effective in certain situations, recent improvements in CT technology offer a more comprehensive analysis of each solder ball within seconds. Utilizing a genuine 3D CT method, defects such as Voiding, Non-Wetting, and Head-in-Pillow are distinctly visible, enabling engineers to conduct accurate root-cause analyses. 3D CT X-Ray inspection offers exceptional clarity when comparing defects against IPC standards and removes many of the visible obstructions introduced by other advanced X-Ray Technologies.
Conclusions
Electronic applications have become too complicated for 2D X-Ray inspection alone. To meet IPC’s standards while accommodating busier assembly lines with a limited amount of experienced operators, SMT manufacturers are forced to rely more on intelligent equipment. A fully automated 3D CT X-Ray inspection machine is an ideal solution, as it is well equipped to automatically detect and measure the same defects mentioned in IPC’s 7095 standards guide. With the ability to capture full volumetric information and over three hundred cross-section slices for each solder joint, there is little opportunity for a defect to be missed. Voiding no longer needs to be limited to results from a single perspective, since the volume ratio of void to solder can be easily calculated. The contour and shape of a solder ball can be analyzed across the complete solder interface to ensure that defects like HiP, Non-Wets, or bridging are quickly identified in a matter of seconds and removed from the line.
The massive amount of measurements and qualitative information provided by CT-Xray systems can now enable more inspections to be easily automated, ultimately reducing the burden on engineers. With access to this impressive technology, tighter processing parameters can be maintained to ultimately ensure higher quality electronic products for a variety of markets. The adoption of fully automated 3D CT X-Ray inspection technology marks a pivotal advancement in electronic manufacturing, ensuring products meet the rigorous IPC standards. This technology enhances defect detection and analysis, significantly boosting production efficiency and product reliability across various markets.
Initially Published in the SMTA Proceedings
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