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Risk Mitigation in Hand Soldering
Cavity Board SMT Assembly Challenges
Managing blooming in an adhesives process
Implementing Automation and Ai for Electronic Card Assembly
Healthcare Gaps That Only Technology Can Fill
Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
Optimization of Stencil Apertures to Compensate for Scooping
The Sir Reliability of Fine Pitch QFN Components Under Harsh Condition
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Latest Industry News
Microsoft Surges Ahead in AI Race with Massive Nvidia Chip Acquisition
CHIPS Act Investment and Supply Chain Challenges
The US government releases first-ever quadrennial supply chain review
The evolving revolution: AI in 2025
Meet the Cobot Bringing Precision and Accuracy to Fab Equipment Maintenance
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Process Cleaning Rate Theory
In this video Dr. Mike Bixenman, Chief Technology Officer of Kyzen, explains the process cleaning rate theory and how to use it.
Production Floor
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Board Talk
Is No-Clean the Trend for QFN Components?
Step Stencil Setup
Why Do Our Boards Warp During Reflow?
Acceptable Rate for Head in Pillow?
Should Apertures be Home Plate or Inverted Home Plate?
What Rate is World Class for SMT Machines?
Selective Solder Pot Temperatures
Is Customer Approval Required for Class 3 Repair?
MORE BOARD TALK
Ask the Experts
Double Sided Reflow for Micro BGA Components
Transfer Efficiency Greater Than 100%
Pin in Paste Solder Dropping
Dam & Fill vs. Conformal Coating
Extending Shelf Life for Jars of Solder Paste
How to Re-qualify BGA Spheres
No-Clean Flux Residue After Selective Soldering
Frequency of Temperature and Relative Humidity Tracking
MORE ASK THE EXPERTS
