Vapour Phase - Profiling for Lead-Free Alloys
This paper covers the profiling gap with thermal control techniques to address profiles meeting paste manufacturer recommendations.
Production Floor
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Authored By:
Allen Duck
A-Tek LLC, Berthoud, CO, USA
Claus Zabel
Asscon Systemtechnik
Summary
Vapour Phase has seen resurgence in its use recently. In large part this has been a result of new chemistry and the advances in the technology to manage energy flow from the source to the PCB via the vapour. Added the demand from the customer base is again present as we deal with density challenges in PCB design, Parts design as well have to contend with new alloys that are less forgiving than the old traditional 63/37.
Conclusions
The end result of such a mechanism is the freedom to create any shape recommended profile and retain the extremely beneficial characteristics that Vapour Phase offers.
- O2 free environment.
- Controlled ramp rates.
- Low or zero delta Ts at peak
- Direct thermal communication with I/O under array packages.
- Lower power consumption.
Initially Published in the SMTA Proceedings
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