Authored By:
Mike Freda, Sun Microsystems
Paul Reid, PWB Interconnect Solutions
Transcript
Reliability testing of printed wire boards by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment.
This paper delineates an eleven step method to establish a test protocol that will maximize accuracy, applicability and reduced costs and reduce the propensity for confounded data in thermal cycle testing of bare PWBs exposed to lead-free assembly and rework simulation.
The method presented in this paper is targeted to the unique challenges afforded by lead-free testing applications and testing of the integrity of conductive interconnections and dielectric materials.
Summary
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. This article delineates an eleven step method to establish a test protocol that will maximize accuracy, applicability and reduced costs and reduce the propensity for confounded data in thermal cycle testing of bare PWBs exposed to lead-free assembly and rework simulation. The method presented in this paper is targeted to the unique challenges afforded by lead-free testing applications and testing of the integrity of conductive interconnections and dielectric materials.
Initially Published in the IPC Proceedings
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