| Research & Technical Papers
|
|
No Recent Research Postings.
|
|
|
|
|
|
| More Information |
| No Additional Information.
|
|
|
|
![AmTECH Microelectronics Logo]()
|
|
AmTECH Microelectronics was established over 30-years ago by a core team of Silicon Valley professionals. The team’s roots coming from design for manufacturing and process development of Multi-Chip Modules (MCM), 2.5D & 3D Heterogeneous Assembly, Chiplets, Chip-On-Board (COB), Chip-On-Flex (COF), PCBA and RF Assembly. AmTECH processes include, flip chip TCB & C4, silver sintering, die attach, wire bonding, ribbon bonding, dispense & encapsulation, and Surface Mount Technology (SMT).
|
|
| Presentations |
|
No Presentations Currently Available.
|
|
AmTECH Microelectronics
|
|