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SET is the world's leading supplier of High Accuracy Die to Die & Die to Wafer Bonders. With more than 300 bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the high flexibility of its systems.
SET bonders adapt to all main bonding techniques and guarantee the highest bonding quality (oxide reduction technologies) for the most demanding applications: 3D integration, IR-FPA hybridization, MEMS packaging, advanced photonics packaging.
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SET Corporation S.A.
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