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Research & Technical Papers

Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes

A comparison of the transfer efficiency of solder powder particle ...

Assembly of POP with Novel Epoxy Flux on Solder Paste

In this paper, a newly developed epoxy flux, that is ...

Effect of Reflow Profiling on Solder Paste Flux Residues

Paper studied the effect of reflow profiling on the electrical ...

Challenges for Bottom Termination Components

Complex components designed to keep up with the demand for ...

Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads

In this work, a new halogen-free no-clean flux solder paste ...

Can Age and Storage Affect Performance of No-Clean Flux Residue?

Solder paste flux chemistry, storage temperature, and age seem to ...

Human-Induced Contamination on PCB Assembly

This paper will discuss an experiment that was performed to ...

Process Optimization for Fine Feature Solder Paste Dispensing

In this paper the authors evaluate variables in the solder ...

Low Cost Alternative to SAC Alloys

Paper discusses some new SAC alloy options, comparing performance to ...

Solder Fortification with Preforms

PIP is not always possible to print enough paste to ...

Stencil Printing for CSP's and 01005 Chips

Printing solder paste is a challenge when larger components are ...

No-Clean Flux Residue and Underfill Compatibility

This paper covers an experiment designed to measure the electrical ...

Best Practices - Reflow Profiling for Lead-free

Paper covers best practices for optimizing the reflow process to ...

Next Generation PoP Pastes

This paper highlights some of the differences between traditional solder ...

Voiding Control at QFN Assembly

Thermal pad voiding control at QFN assembly is a major ...

Selecting Fluxes for Lead-free Selective Soldering

Paper touches on identifying flux properties, selecting low solids fluxes ...

The Effects of Flux Residues on Reliability

Paper discusses an experiment designed to mimic partially activated flux ...

The Proliferation of Lead-free Alloys

This paper is an overview of this lead-free alloy proliferation ...

Stencil Printing: Circular vs. Square Apertures

Paper covers practices for optimizing the printing process focusing on ...

Understanding Surface Insulation Resistance

This paper covers differences between two common surface insulation resistance ...

Minimizing Voiding in QFN Packages

This paper quantifies the preform requirements and process adjustments needed ...

Drop Test Performance of BGA Assemblies

In this work, BGA solder spheres using SAC105 with 0.02% ...

Optimization to Prevent the Graping Effect

This paper will discuss the specific challenge of the Graping ...

Stencil Printing for Miniaturized Electronics

Paper covers experimental data and process optimization techniques employed to ...

A Robust Fine Feature Printing Process

This paper evaluates many fine printing stencil factors that have ...

Lead-Free Flux and Influence on Cleaning

Lead-free flux technology is more difficult to clean. Cleaners with ...

Implementing Halogen-free PCB Assembly

This paper covers the reduction of halogenated compounds and techniques ...

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Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil.

Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

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