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This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently. Materials Tech
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things. Materials Tech
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys. Materials Tech
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests. Materials Tech
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications. Materials Tech
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers. Materials Tech
A new low global warming potential fluorinated solvent for precision cleaning is discussed. The paper covers the properties and performance. Materials Tech
The use of BiSnbased solder paste improves the BGA solder joint yield relative to SAC based solder pastes during low temperature reflow soldering. Materials Tech
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology. Materials Tech
Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application. Materials Tech |
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