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If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part. Materials Tech In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses. Materials Tech Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13. Materials Tech The roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon. Materials Tech In this paper, the reliability of lead-free SAC solder alloys at high temperature and vibration for pristine and thermally aged assemblies is analyzed. Materials Tech This paper shows alloy and flux properties as well as temperature cycle test results comparing SAC305 and Innolot® solder pastes. Materials Tech In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated. Materials Tech A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste. Materials Tech This paper discusses the use of jet-dispensed SMT adhesives for increased durability, lower component cost, and new form factor printed electronics. Materials Tech We are still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Materials Tech |
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