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In this work, we further discuss solderability and mechanical reliability of a novel low temperature proprietary alloy (generically called as X46). Materials Tech
This paper presents an examination of three low temperature solders and provides a comparison with tin-silver-copper solder. Materials Tech
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys. Materials Tech
This paper describes the development and testing procedure of a new lead-free low melting point alloy. Materials Tech
This study focuses on two major bonding techniques: Cu nanoparticle (Cu NP) sintering and Cu-Sn3.0Ag0.5Cu (Cu-SAC305) hybrid paste bonding. Both methods aim to address the limitations of conventional soldering processes, especially in high-temperature, high-power applications. Materials Tech
The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the materials that require control or replacement. Materials Tech
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs. Materials Tech
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions. Materials Tech
This paper will discuss advantages of advanced ball-attach materials developed to meet the challenges of advanced packaging. Materials Tech
A new generation of indium TIM is introduced. This class of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging. Materials Tech |
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