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Intermetallic Compounds in Solder Alloys: The Common Misconception
Intermetallic Compounds in Solder Alloys: The Common Misconception
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys.
Materials Tech

Evaluation and Qualification of Reworkable Underfill Materials
Evaluation and Qualification of Reworkable Underfill Materials
Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability.
Materials Tech

Insertion Loss Comparisons of High Frequency PCBs
Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech

Essential Tools to Combat the Ingress of Counterfeit Materials
Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Materials Tech

The Role of Organic Amines in Soldering Materials
The Role of Organic Amines in Soldering Materials
Paper shows that tests can be developed to characterize fundamental properties of activator packages that directly impact performance.
Materials Tech

Endocrine Disrupting Chemicals and Bioaccumulative Substances
Endocrine Disrupting Chemicals and Bioaccumulative Substances
The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the materials that require control or replacement.
Materials Tech

Materials for Advanced Ball-Attach Processes for Advanced Packages
Materials for Advanced Ball-Attach Processes for Advanced Packages
This paper will discuss advantages of advanced ball-attach materials developed to meet the challenges of advanced packaging.
Materials Tech

Behavior of Materials in the Manufacturing Environment
Behavior of Materials in the Manufacturing Environment
This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead-free assembly.
Materials Tech

Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions.
Materials Tech

Suitable Flux Medium for Cleanable and No-Clean Solder Pastes
Suitable Flux Medium for Cleanable and No-Clean Solder Pastes
This paper presents two concrete studies. Development steps will be validated by standardized tests, home-made testing, and industrial evaluations.
Materials Tech