Electronics Manufacturing and Electronics Assembly

How long will the industry continue to use through hole components? I can envision connectors being used for some time, what about component types? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question.
Board Talk

The Dynamics of Low Stress Epoxy Curing
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature).
Production Floor

Robotic Systems Perform Experiments Speeding Up Research
Robotic systems can perform experiments without fatigue, speeding up research. Robots execute experimental steps with greater consistency than humans.
Technology Briefing

Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages.
Analysis Lab

Cu Conductive Paste as Via Filling Materials for Various Substrates
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates.
Materials Tech

Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Production Floor

CU Core Column Enables Fine Pitch & High-Density 3D Packaging
The diameter, length, and aspect ratio of the Cu core columns and how to optimize the dimensions of the Cu core column is discussed.
Analysis Lab

Assembling Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two?
Board Talk

The Effect of Sb and Ag Addition on the Behavior of Sn-Bi LTS
This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions.
Materials Tech

Flexible Sensors Provide Versatility or Wearable Electronics
Robots are becoming more agile and wearable electronics' traditional silicon-based sensors won’t make the cut in many applications.
Technology Briefing

A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
Production Floor

Accuracy Validation Finds Hidden Problems Affecting DPMO
This paper discusses individual process step validation methods with real examples of improvement that contribute to defect per million opportunities (DPMO) reduction.
Analysis Lab

Cloudy Copper Plating Bath
At a circuit shop near Los Angeles there was trouble with the copper plating line. Was an impurity getting in the tank and how?
Mysteries of Science

Strain During Press Fit Connector Insertion in PCB Assembly
Locations closer to the insertion site experienced the highest level of strain, which progressively decreased further from the insertion location.
Production Floor

Researchers Incorporate Machine Learning Into Brain-Computer Interface

Researchers incorporated machine learning into the brain-computer interface. This solution can understand the needs of a subject and self-calibrate.
Technology Briefing

Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated.
Analysis Lab

Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging

The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Materials Tech

Complex Board Design Induced Solder Separation Failure
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure.
Production Floor

Board Talk

Demise of the Plated-Through Hole?

Assembling Boards with BGAs on Both Sides

Simple Test for Flux Penetration

5 vs 8-Zone Ovens

Problem Meeting Minimum Hole Fill During Wave Soldering

BGA Components and Coplanarity

What is Ideal Humidity for Final Assembly?

What is Solder Paste Working Life on a Stencil?

MORE BOARD TALK

Questions and Comments

What Rate is World Class for SMT Machines?

So many comments here and no hard numbers, so as ...
Robert Gray

Should Apertures be Home Plate or Inverted Home Plate?

I do the same thing as Steve O'Brien. It also ...
Richard Stadem, General Dynamics Mission Systems

Top Side Reflow Causing Solder Balls

Just a quick note. I agree with your comments however ...
Leo Lambert, EPTAC

MORE COMMENTS