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Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print. Board Talk
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind? Board Talk
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components? Board Talk
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards? Board Talk
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario. Board Talk
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper and a .4 - .8 micron thickness on tin-nickel. Board Talk
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question. Board Talk
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture. Board Talk
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions. Board Talk
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant? Board Talk |
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