Electronics Manufacturing and Electronics Assembly

What is ideal humidity within a final assembly facility? No soldering involved. The facility is used for final box build. Phil Zarrow and Jim Hall, The Assembly Brothers, answer this question and offer their own insights.
Board Talk

SN-CU-NI Composite Solder Paste High Temperature Use
Research on a prototype paste is being completed to improve reliability and survivability of PCB and SMT solder joints under extreme temperatures (< 500° Celsius).
Production Floor

America Risks Losing Its Status As the Most Innovative Place on Earth
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography.
Technology Briefing

Fabriciton of NiCo Alloy and Rh Coating Using Electroplating Method
The properties of NiCo deposits were analyzed using field emission scanning electron microscopy (FESEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD).
Analysis Lab

Do We Need to Switch to Type 5 Solder Pastes?
The experiment should find the optimum printer parameters, compare type 4 vs. 4.5 vs. 5 solder paste and 4 different stencils.
Materials Tech

Process Optimization for Fine Feature Solder Paste Dispensing
In this paper the authors evaluate variables in the solder paste dispensing process, and review the impact on dispense quality of the solder paste.
Production Floor

Crack Propagation Mechanism Study on Bismuth Contained Base Lead Free Solder
The thermal cycling reliability characteristics of solder containing a small amount of Bismuth which is below 4wt% in accordance with the new requirements were investigated.
Analysis Lab

What is Solder Paste Working Life on a Stencil?
Our solder paste has an exposure life of ten hours. After ten hours of operation do we need to remove all of the paste on the stencil and scrap it?
Board Talk

New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

The Biggest Barrier to a Robotics Revolution
Experts believe robots will be able to cost-effectively perform a large share of physical tasks which, until now, have been performed only by humans.
Technology Briefing

Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee.
Production Floor

Quantifying Environmental Life Cycle Impacts for ICT Products
This paper describes a simplified approach for estimating the environmental impact of Information and Communications Technology (ICT) products.
Analysis Lab

Epoxy Resin and the Red Gas Cloud
A chemist mixed epoxy and a catalyst that caused an overheated reaction producing a reddish gas cloud. What caused this reaction?
Mysteries of Science

Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor

Leveraging America's Enormous Deep Tech Advantage

At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing

Cavity Board SMT Assembly Challenges
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success.
Analysis Lab

Managing blooming in an adhesives process

If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Materials Tech

Implementing Automation and Ai for Electronic Card Assembly
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation.
Production Floor

Board Talk

What is Ideal Humidity for Final Assembly?

What is Solder Paste Working Life on a Stencil?

Is No-Clean the Trend for QFN Components?

Step Stencil Setup

Why Do Our Boards Warp During Reflow?

Acceptable Rate for Head in Pillow?

Should Apertures be Home Plate or Inverted Home Plate?

What Rate is World Class for SMT Machines?

MORE BOARD TALK

Questions and Comments

What Rate is World Class for SMT Machines?

So many comments here and no hard numbers, so as ...
Robert Gray

Should Apertures be Home Plate or Inverted Home Plate?

I do the same thing as Steve O'Brien. It also ...
Richard Stadem, General Dynamics Mission Systems

Top Side Reflow Causing Solder Balls

Just a quick note. I agree with your comments however ...
Leo Lambert, EPTAC

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