Research
Implementing Robust Bead Probe Test Processes
Via-In Pad Plated Over (VIPPO) Design Considerations
Screening of Lower Melting Point Pb-Free Alloys
Condensation Testing - A New Approach
Case Study for Improving the PCB Print Process Using Factory Data
DFX on High Density Assemblies
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
Wetting and Solidification of Pure Tin on Polycrystalline Intermetallic Substrates
MORE RESEARCH
Latest Industry News
MacBook, iPad Production Delayed as Supply Crunch Hits Apple
Microsoft unveils liquid cooling solution for datacenters
A Theory of (Almost) Everything
Toyota unveils new models in advanced driver-assist technology push
Tech Giants Enter Their Chips in the Race for Self-driving Cars
What will self-driving trucks mean for truck drivers?
4 Great Things That Happened When We Went Remote
iPhone 13 is going to be worth the wait: All the major upgrades we're looking forward to
MORE INDUSTRY NEWS

The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry to Realize Smart Manufacturing



The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry to Realize Smart Manufacturing
The future of manufacturing is dependent on the ability to develop and deploy suites of technology platforms to realize Smart Manufacturing and Industry 4.0.
Production Floor

DOWNLOAD

Authored By:


Daniel Gamota, Jabil
San Jose, CA

Ranjan Chatterjee, Cimetrix
Salt Lake City, UT

Summary


The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain as well as the introduction of equipment and processes across the segments. The ability to develop Smart Manufacturing and Industry 4.0 enabling technologies (e.g., big data analytics, artificial intelligence, cloud/edge computing, robotics, automation, IoT) that can be deployed within and between the Vertical Segments is critical. A Smart Manufacturing Technology Working Group (TWG) was formed by International Electronics Manufacturing Initiative (iNEMI) that included thought leaders from across the electronic products manufacturing industry. The TWG published a roadmap that included the situation analysis, critical gaps and key needs to realize Smart Manufacturing.

Conclusions


The iNEMI Smart Manufacturing Roadmap Chapter provides the situation analysis and key attribute needs for the Horizontal Topics within the Vertical Segments as well as between the Vertical Segments. Also, the chapter identifies the primary gaps and needs for the Horizontal Topics that must be addressed to enable realization of Smart Manufacturing.

The gaps and needs that were identified for addressing require additional detail for the status of the different Vertical Segments to appropriately structure the initiatives. It was suggested to circulate surveys to gather the information to appreciate the issue. One survey format was suggested as an example template: Survey on Security in Manufacturing Across the Microelectronics Supply Chain.

iNEMI, together with other organizations such as SEMI, can organize workshops to facilitate collaboration between the electronics manufacturing industry stakeholders. In addition, iNEMI can establish cross-industry collaborative projects that can develop the enabling technologies to address the roadmap identified needs and gaps to realize SM. Organizations such as iNEMI and SEMI can collaborate to establish guidelines and standards (e.g., data flow interfaces and data formats) as well as lead groups to develop standards for equipment and tool hardware to reduce complexity during manufacturing. Also, iNEMI can engage other industry groups to foster exchange of best practices and key knowledge from SM initiatives. The members of the roadmap TWG are committed to provide guidance during the Smart Manufacturing Journey—people, processes, technologies. Members of the TWG also suggested engaging microelectronics groups as well as non-microelectronics groups to assess opportunities to leverage existing SM guidelines and standards.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Solder Paste Volume for BGA Rework
Reflow For Rigid Flex
Delay Before Cleaning Partial Assemblies
Problems With Starved "J" Lead Joints
Solder Paste Transfer Efficiency - What/Why
Can a CTE Mismatch Cause Reliability Problems?
Going Beyond Your Solder Paste Work Life
Issues Mixing Silicone and Acrylic Conformal Coatings
MORE BOARD TALK
Ask the Experts
Bottom Terminated Components and Vias
Is Solder Mask Considered an Insulator
Reduce Glare During Assembly
BGA BAll Sheer Testing
Components Jumping Around During Reflow
Floor Life of MSD Parts
QFN Open Solder Joints
Delamination Causing Scrap
MORE ASK THE EXPERTS