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The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry to Realize Smart Manufacturing

The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry to Realize Smart Manufacturing
The future of manufacturing is dependent on the ability to develop and deploy suites of technology platforms to realize Smart Manufacturing and Industry 4.0.
Production Floor


Authored By:

Daniel Gamota, Jabil
San Jose, CA

Ranjan Chatterjee, Cimetrix
Salt Lake City, UT


The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain as well as the introduction of equipment and processes across the segments. The ability to develop Smart Manufacturing and Industry 4.0 enabling technologies (e.g., big data analytics, artificial intelligence, cloud/edge computing, robotics, automation, IoT) that can be deployed within and between the Vertical Segments is critical. A Smart Manufacturing Technology Working Group (TWG) was formed by International Electronics Manufacturing Initiative (iNEMI) that included thought leaders from across the electronic products manufacturing industry. The TWG published a roadmap that included the situation analysis, critical gaps and key needs to realize Smart Manufacturing.


The iNEMI Smart Manufacturing Roadmap Chapter provides the situation analysis and key attribute needs for the Horizontal Topics within the Vertical Segments as well as between the Vertical Segments. Also, the chapter identifies the primary gaps and needs for the Horizontal Topics that must be addressed to enable realization of Smart Manufacturing.

The gaps and needs that were identified for addressing require additional detail for the status of the different Vertical Segments to appropriately structure the initiatives. It was suggested to circulate surveys to gather the information to appreciate the issue. One survey format was suggested as an example template: Survey on Security in Manufacturing Across the Microelectronics Supply Chain.

iNEMI, together with other organizations such as SEMI, can organize workshops to facilitate collaboration between the electronics manufacturing industry stakeholders. In addition, iNEMI can establish cross-industry collaborative projects that can develop the enabling technologies to address the roadmap identified needs and gaps to realize SM. Organizations such as iNEMI and SEMI can collaborate to establish guidelines and standards (e.g., data flow interfaces and data formats) as well as lead groups to develop standards for equipment and tool hardware to reduce complexity during manufacturing. Also, iNEMI can engage other industry groups to foster exchange of best practices and key knowledge from SM initiatives. The members of the roadmap TWG are committed to provide guidance during the Smart Manufacturing Journey—people, processes, technologies. Members of the TWG also suggested engaging microelectronics groups as well as non-microelectronics groups to assess opportunities to leverage existing SM guidelines and standards.

Initially Published in the SMTA Proceedings


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