Electronics Manufacturing and Electronics Assembly

Should stencil the aperture be home plate or inverted home plate? You know the performance difference between the two types. Which one is better? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own insights.
Board Talk

Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Production Floor

Carbon Dioxide and Lignin Offer Alternative to Traditional Plastic
Researchers have created a potential alternative to traditional petroleum-based plastic made from carbon dioxide, plus lignin, a component of wood.
Technology Briefing

Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab

High-Temp Vibration Reliability of Thermally Aged Lead-Free Assemblies
In this paper, the reliability of lead-free SAC solder alloys at high temperature and vibration for pristine and thermally aged assemblies is analyzed.
Materials Tech

Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor

Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab

What Rate is World Class for SMT Machines?
What rate is considered world class when it comes to pick performance for SMT placement machines? Can you define pick performance?
Board Talk

Combined Alloy and Flux Approach Cost-Effective Reliable Solder Joints
This paper shows alloy and flux properties as well as temperature cycle test results comparing SAC305 and Innolot® solder pastes.
Materials Tech

Flexible Sensors Provide Versatility or Wearable Electronics
Robots are becoming more agile and wearable electronics' traditional silicon-based sensors won’t make the cut in many applications.
Technology Briefing

Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing.
Production Floor

Electrochemical Reliability as a Function of Component Standoff
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance.
Analysis Lab

Mysterious Drop In Production Yield
A factory manufactured membrane switches. After installing exhaust fans the yield dropped. What was causing this decrease in production?
Mysteries of Science

Young Laplace Equation Reveals New Possibilities Thermal Pad Design
This paper shows how the application of the Young-Laplace equation can lead to an understanding of the soldering process of exposed pads and heat slugs.
Production Floor

3D-Printed Concrete Revolutionizes Home Building

Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste.
Technology Briefing

Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Analysis Lab

Dynamic Bending Reliability of Chip-In Fabrics (CIF) Packaging

In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated.
Materials Tech

Effect of SMT Component Package Design on Cleaning Effectiveness
This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials.
Production Floor

Board Talk

Should Apertures be Home Plate or Inverted Home Plate?

What Rate is World Class for SMT Machines?

Selective Solder Pot Temperatures

Is Customer Approval Required for Class 3 Repair?

Top Side Reflow Causing Solder Balls

Solder Pallets With Titanium Inserts - Yes/No?

Removing Warpage from PCBAs

Trends for Printing Ultra Miniature Chips

MORE BOARD TALK

Questions and Comments

Top Side Reflow Causing Solder Balls

Just a quick note. I agree with your comments however ...
Leo Lambert, EPTAC

How Do You Remove Oxidation from PCBs?

One of the best ways to remove slight oxidation from ...
Richard Stadem, Analog Technologies Corp.

Big Problems with HASL Finish

This problem was quite common in the late 90s. Electronic ...
Les Watts, Testerion

MORE COMMENTS

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