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We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question. Board Talk
A robust board assembly recipe is demonstrated for thin FCCSP packages with reflow warpage values of up to 110μm or higher. Production Floor
MIT engineers are working to give robots a bit of “common sense” when faced with situations that push them off their trained paths. Technology Briefing
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA. Analysis Lab
In this stydy, nanoparticles were functionalized to bind them to the polymer structure while avoiding the collection among the particles. Materials Tech
Today Jet Printing is no longer seen as a futuristic technology but it has proven itself and the technology is still gaining momentum. Production Floor
Flux residues can create interaction with solder resists and the component body. This paper discusses a new SIR measurement process. Analysis Lab
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening? Board Talk
Paper on the properties of solder paste release and the effects of surface free energy that make up the stencil printing process. Materials Tech
A team has developed a wearable, stretchy patch about the size of a BandAid, which sticks to your skin and picks up tiny signals coming from human muscles. Technology Briefing |
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